Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adesto Technologies |
IC FLASH 32MBIT 85MHZ 8UDFN
|
paquet: 8-UDFN Exposed Pad |
Stock2 688 |
|
FLASH | FLASH | 32Mb (512 Bytes x 8192 pages) | SPI | 104MHz | 8µs, 4ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
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Microchip Technology |
IC EEPROM 8KBIT 1MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock44 820 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 166MHZ 90FBGA
|
paquet: 90-TFBGA |
Stock5 008 |
|
DRAM | SDRAM | 64Mb (2M x 32) | Parallel | 166MHz | - | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
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Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock12 396 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 128BIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 792 |
|
EEPROM | EEPROM | 128b (16 x 8) | I2C | 400kHz | 4ms | 3500ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Cypress Semiconductor Corp |
IC SRAM 16MBIT 10NS 48BGA
|
paquet: 48-VFBGA |
Stock6 704 |
|
SRAM | SRAM - Synchronous | 16Mb (1M x 16) | Parallel | - | 10ns | 10ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
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IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 20NS 100TQFP
|
paquet: 100-LQFP |
Stock7 392 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (4K x 18) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
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IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8NS 165CABGA
|
paquet: 165-TBGA |
Stock3 024 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 100MHz | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 12NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock3 312 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Alliance Memory, Inc. |
IC SRAM 1MBIT 55NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock7 664 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I |
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Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
paquet: 48-TFBGA |
Stock3 600 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
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Macronix |
IC FLASH 8MBIT 55NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock7 712 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Microchip Technology |
IC EEPROM 2KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 264 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 904 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8MINIMAP
|
paquet: 8-UFDFN Exposed Pad |
Stock7 008 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 4.5µs | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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STMicroelectronics |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock23 148 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 512M PARALLEL 166MHZ
|
paquet: 66-TSSOP (0.400", 10.16mm Width) |
Stock5 376 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 166MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
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ISSI, Integrated Silicon Solution Inc |
IC FLASH 32M SPI 133MHZ 8SOP
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock4 032 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Micron Technology Inc. |
IC GDDR5 8G 256MX32 FBGA
|
paquet: - |
Stock7 520 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 944 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Renesas Electronics Corporation |
IC RAM 16MBIT 108MHZ 8DFN
|
paquet: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 16Mbit | - | 108 MHz | - | - | 1.71V ~ 2V | -40°C ~ 85°C | Surface Mount | 8-WDFN Exposed Pad | 8-DFN (5x6) |
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Microchip Technology |
IC EEPROM 32KBIT I2C 1MHZ SMD
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
HYPERFLASH
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | HyperBus | 100 MHz | - | 96 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
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Winbond Electronics |
8G-BIT SLC NAND FLASH, 1.8V, 1-B
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 8Gbit | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 16GBIT PARALLEL 96LWBGA
|
paquet: - |
Stock741 |
|
DRAM | SDRAM - DDR3L | 16Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 85°C (TC) | Surface Mount | 96-LFBGA | 96-LWBGA (10x14) |
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Cypress Semiconductor Corp |
IC SRAM 256KBIT PARALLEL 24DIP
|
paquet: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 45ns | 45 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |