Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Alliance Memory, Inc. |
IC SDRAM 128MBIT 166MHZ 54BGA
|
paquet: 54-TFBGA |
Stock2 704 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 166MHz | 2ns | 5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
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Alliance Memory, Inc. |
IC SDRAM 128MBIT 166MHZ 86TSOP
|
paquet: 86-TFSOP (0.400", 10.16mm Width) |
Stock5 104 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 166MHz | 2ns | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
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Renesas Electronics America |
IC SRAM 4MBIT 55NS 32TSOP
|
paquet: 32-SOIC (0.400", 10.16mm Width) |
Stock5 472 |
|
SRAM | SRAM | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
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Cypress Semiconductor Corp |
IC SRAM 1MBIT 70NS 32SOIC
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock4 544 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
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Microchip Technology |
IC EEPROM 256KBIT 20MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 752 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Maxim Integrated |
IC NVSRAM 256KBIT 100NS 28EDIP
|
paquet: 28-DIP Module (0.600", 15.24mm) |
Stock2 640 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 100ns | 100ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
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Microchip Technology |
IC OTP 1MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock4 608 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 368 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock110 460 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 8MBIT 10NS 48BGA
|
paquet: 48-TFBGA |
Stock7 072 |
|
SRAM | SRAM - Asynchronous | 8Mb (512K x 16) | Parallel | - | 10ns | 10ns | 2.4 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFBGA | 48-BGA (6x8) |
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Cypress Semiconductor Corp |
NOR
|
paquet: - |
Stock3 904 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | SPI - Quad I/O | 80MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 105°C (TA) | - | - | - |
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IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 55NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock5 520 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
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Cypress Semiconductor Corp |
NAND
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paquet: - |
Stock6 160 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | 45ns | 45ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 90BGA
|
paquet: 90-TFBGA |
Stock7 952 |
|
DRAM | SDRAM | 64Mb (2M x 32) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
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Microchip Technology |
IC EEPROM 1KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 104 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock61 428 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Fremont Micro Devices USA |
IC EEPROM 64KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 800kHz | 5ms | 700ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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STMicroelectronics |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 600 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 40MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 104 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | SPI | 40MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Alliance Memory, Inc. |
IC SDRAM 256MBIT 166MHZ 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock13 296 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 166MHz | 12ns | 5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC FLASH 32MBIT 104MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock42 504 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 104MHz | 5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Micron Technology Inc. |
IC DRAM 1.125G PARALLEL 1200MHZ
|
paquet: - |
Stock2 384 |
|
DRAM | DRAM | 1.125Gb (32Mb x 36) | Parallel | 1200MHz | - | 6.67ns | 1.28 V ~ 1.42 V | 0°C ~ 95°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
paquet: 64-LBGA |
Stock7 472 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 60ns | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
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Microchip Technology |
256K 32KX8 2.5V SER EEPROM
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Cypress Semiconductor Corp |
IC SRAM 4MBIT PARALLEL 36VFBGA
|
paquet: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 55ns | 55 ns | 2.7V ~ 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 36-VFBGA | 36-VFBGA (6x8) |
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Everspin Technologies Inc. |
IC RAM 1MBIT SPI/QUAD 16SOIC
|
paquet: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 1Mbit | SPI - Quad I/O, QPI | 40 MHz | - | 7 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Micron Technology Inc. |
IC DRAM 4GBIT 2.133GHZ FBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | - | 2.133 GHz | - | - | 1.1V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
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Winbond Electronics |
IC DRAM 1GBIT HSUL 12 178VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | HSUL_12 | 933 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 178-VFBGA | 178-VFBGA (11x11.5) |