Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC PSRAM 32MBIT 70NS 54VFBGA
|
paquet: 54-VFBGA |
Stock3 072 |
|
PSRAM | PSRAM (Pseudo SRAM) | 32Mb (2M x 16) | Parallel | - | 70ns | 70ns | 1.7 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 54-VFBGA | 54-VFBGA (6x8) |
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Microchip Technology |
IC FLASH 4MBIT 90NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock13 608 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Cypress Semiconductor Corp |
IC SRAM 256KBIT 70NS 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock89 100 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-DIP |
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Microchip Technology |
IC OTP 4MBIT 120NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock39 396 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Microchip Technology |
IC EEPROM 4KBIT 2.1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 688 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 100TQFP
|
paquet: 100-LQFP |
Stock2 512 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
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Micron Technology Inc. |
NOR FLASH 128MX4 3.0V SOIC
|
paquet: - |
Stock6 320 |
|
FLASH | FLASH - NOR | 512Mb (128M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
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Microchip Technology |
IC FLASH 64MBIT 90NS 48TSOP
|
paquet: 48-TFSOP (0.173", 4.40mm Width) |
Stock3 104 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.173", 4.40mm Width) | 48-TSOP |
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Alliance Memory, Inc. |
IC SRAM 2MBIT 55NS 32SOP
|
paquet: 32-SOIC (0.445", 11.30mm Width) |
Stock5 392 |
|
SRAM | SRAM - Asynchronous | 2Mb (256K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOP |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 15NS 28SOJ
|
paquet: 28-BSOJ (0.300", 7.62mm Width) |
Stock2 128 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
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Cypress Semiconductor Corp |
NOR
|
paquet: - |
Stock5 664 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 55NS 48MINIBGA
|
paquet: 48-TFBGA |
Stock5 360 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 55ns | 55ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-miniBGA (6x8) |
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Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock2 512 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
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Rohm Semiconductor |
IC EEPROM 64KBIT 1MHZ 8MSOP
|
paquet: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Stock302 256 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 9MBIT 200MHZ 100TQFP
|
paquet: 100-LQFP |
Stock61 260 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Fremont Micro Devices USA |
IC EEPROM 16KBIT 1MHZ SOT23-5
|
paquet: SC-74A, SOT-753 |
Stock56 802 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
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Macronix |
IC FLASH 512MBIT
|
paquet: - |
Stock4 608 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165TFBGA
|
paquet: 165-TBGA |
Stock5 424 |
|
SRAM | SRAM - Synchronous | 18Mb (1M x 18) | Parallel | 250MHz | - | 2.6ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
Cypress Semiconductor Corp |
IC FLASH NOR 48FBGA
|
paquet: - |
Stock6 736 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
1-W 20K EEPROM TDFN
|
paquet: 6-WDFN Exposed Pad |
Stock5 120 |
|
EEPROM | EEPROM | 20Kb (256 x 80) | 1-Wire® | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 6-WDFN Exposed Pad | 6-TDFN-EP (3x3) |
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Microchip Technology |
1K 128X8 1.8V SERIAL EE IND
|
paquet: SC-74A, SOT-753 |
Stock4 784 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3.5µs | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
ISSI, Integrated Silicon Solution Inc |
2G, 0.57-0.65V/1.06-1.17/1.70-1.
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
BYTe Semiconductor |
16 MBIT, 3.0V (2.7V TO 3.6V), -4
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O, QPI | 108 MHz | 50µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
BYTe Semiconductor |
2 MBIT, 1.8V (1.65V TO 2.0V), -4
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 2Mbit | SPI - Quad I/O | 85 MHz | 3ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 6-XFDFN | 6-USON (1.2x1.2) |
||
Winbond Electronics |
IC FLASH 4GBIT SPI/QUAD 24TFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND | 4Gbit | SPI - Quad I/O | 104 MHz | 250µs | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Microchip Technology |
IC FLASH 4MBIT SPI/QUAD 8WDFN
|
paquet: - |
Stock11 940 |
|
FLASH | FLASH | 4Mbit | SPI - Quad I/O | 104 MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Micron Technology Inc. |
LPDDR5 128GBIT 32 315/315 LFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | Parallel | 3.2 GHz | - | - | - | -40°C ~ 105°C | - | - | - |
||
Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X8, 933MH
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |