Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH PAR NOR SLC 2MX8 PQFP
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paquet: - |
Stock7 120 |
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- | - | - | - | - | - | - | - | - | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 288MBIT 300MHZ 144BGA
|
paquet: 144-TFBGA |
Stock5 904 |
|
DRAM | DRAM | 288Mb (16M x 18) | Parallel | 300MHz | - | 20ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
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Micron Technology Inc. |
IC FLASH 8MBIT 55NS 44SO
|
paquet: 44-SOIC (0.496", 12.60mm Width) |
Stock4 304 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 44-SOIC (0.496", 12.60mm Width) | 44-SO |
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ON Semiconductor |
IC EEPROM 512KBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock3 504 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | Parallel | - | 5ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 90BGA
|
paquet: 90-TFBGA |
Stock7 200 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
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Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 84FBGA
|
paquet: 84-TFBGA |
Stock6 560 |
|
DRAM | SDRAM - DDR2 | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 600ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (12x12.5) |
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Micron Technology Inc. |
IC FLASH 8MBIT 90NS 44SOP
|
paquet: 44-SOIC (0.496", 12.60mm Width) |
Stock5 376 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-SOIC (0.496", 12.60mm Width) | 44-SOP |
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Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock4 432 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8MAP
|
paquet: 8-UDFN Exposed Pad |
Stock6 960 |
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EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
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Microchip Technology |
IC FLASH 2MBIT 120NS 32VSOP
|
paquet: 32-TFSOP (0.488", 12.40mm Width) |
Stock6 416 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
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Microchip Technology |
IC FLASH 4MBIT 120NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock5 440 |
|
FLASH | FLASH | 4Mb (512K x 8, 256K x 16) | Parallel | - | 30µs | 120ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Micron Technology Inc. |
IC FLASH 1.5TBIT 333MHZ 132VBGA
|
paquet: - |
Stock3 344 |
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FLASH | FLASH - NAND | 1.5Tb (192G x 8) | Parallel | 333MHz | - | - | 2.5 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
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Maxim Integrated |
IC NVSRAM 4MBIT 100NS 32EDIP
|
paquet: 32-DIP Module (0.600", 15.24mm) |
Stock2 176 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (512K x 8) | Parallel | - | 100ns | 100ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 32-DIP Module (0.600", 15.24mm) | 32-EDIP |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 84PLCC
|
paquet: 84-LCC (J-Lead) |
Stock3 488 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
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Winbond Electronics |
IC SDRAM 128MBIT 200MHZ 66TSOP
|
paquet: 66-TSSOP (0.400", 10.16mm Width) |
Stock7 888 |
|
DRAM | SDRAM - DDR | 128Mb (8M x 16) | Parallel | 200MHz | 15ns | 50ns | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
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SII Semiconductor Corporation |
IC EEPROM 8KBIT 5MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 592 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 5MHz | 4ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Cypress Semiconductor Corp |
IC FLASH 512MBIT 100NS 64BGA
|
paquet: 64-LBGA |
Stock7 752 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
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Cypress Semiconductor Corp |
IC FLASH
|
paquet: - |
Stock16 320 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | 45ns | 45ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165PBGA
|
paquet: 165-TBGA |
Stock6 768 |
|
SRAM | SRAM - Quad Port, Synchronous | 18Mb (512K x 36) | Parallel | 250MHz | - | 2.6ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-PBGA (13x15) |
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Cypress Semiconductor Corp |
IC FLASH
|
paquet: - |
Stock4 320 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Rohm Semiconductor |
MEMORY EEPROM
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock28 104 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
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Micron Technology Inc. |
IC SDRAM GDDR6 180FBGA
|
paquet: 180-TFBGA |
Stock3 488 |
|
DRAM | SGRAM - GDDR6 | 16Gb (512M x 32) | Parallel | 8GHz | - | - | 1.31V ~ 1.391V | 0°C ~ 95°C (TC) | Surface Mount | 180-TFBGA | 180-FBGA (12x14) |
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Kioxia America, Inc. |
IC FLASH 512G MMC 153FBGA
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | - | 153-VFBGA (11.5x13) |
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Infineon Technologies |
FRAM
|
paquet: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 8Mbit | SPI | 40 MHz | - | 9 ns | 1.8V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFLGA | 8-UFLGA (3.28x3.23) |
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ATP Electronics, Inc. |
IC FLASH 256GBIT EMMC 153BGA
|
paquet: - |
Stock39 |
|
FLASH | FLASH - NAND (MLC) | 256Gbit | eMMC | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-FBGA | 153-BGA (11.5x13) |
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Winbond Electronics |
IC DRAM 256MBIT LVCMOS 60VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR | 256Mbit | LVCMOS | 200 MHz | 15ns | 5 ns | 1.7V ~ 1.9V | -25°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-VFBGA (8x9) |
||
Winbond Electronics |
IC DRAM 256MBIT LVCMOS 60VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR | 256Mbit | LVCMOS | 200 MHz | 15ns | 5 ns | 1.7V ~ 1.9V | -40°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-VFBGA (8x9) |
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Micron Technology Inc. |
LPDDR4 4G 256MX16 FBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -30°C ~ 85°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |