Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Winbond Electronics |
IC FLASH 256MBIT 104MHZ 24TFBGA
|
paquet: 24-TBGA |
Stock4 368 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 400MHZ 144BGA
|
paquet: 144-TFBGA |
Stock4 544 |
|
DRAM | DRAM | 576Mb (64M x 9) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
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Micron Technology Inc. |
IC SDRAM 128MBIT 200MHZ 60VFBGA
|
paquet: 60-VFBGA |
Stock5 008 |
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DRAM | SDRAM - Mobile LPDDR | 128Mb (8M x 16) | Parallel | 200MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 60-VFBGA | 60-VFBGA (8x9) |
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IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
paquet: 165-TBGA |
Stock4 064 |
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SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
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Micron Technology Inc. |
IC FLASH 128MBIT 50NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock49 992 |
|
FLASH | FLASH - NAND | 128Mb (16M x 8) | Parallel | - | 50ns | 50ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Microchip Technology |
IC OTP 2MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock7 728 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 688 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 4.5µs | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Maxim Integrated |
IC NVSRAM 256KBIT 150NS 28EDIP
|
paquet: 28-DIP Module (0.600", 15.24mm) |
Stock7 328 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 150ns | 150ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
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Microchip Technology |
IC FLASH 2MBIT 120NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock6 944 |
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FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 256KBIT 250NS 28PIN
|
paquet: 28-BCPGA |
Stock2 832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
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IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 25NS 64TQFP
|
paquet: 64-LQFP |
Stock3 072 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
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IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 100MHZ 165CABGA
|
paquet: 165-TBGA |
Stock6 848 |
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SRAM | SRAM - Synchronous ZBT | 9Mb (256K x 36) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
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Micron Technology Inc. |
LPDDR3 SPECIAL/CUSTOM PLASTIC GR
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paquet: - |
Stock6 192 |
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- | - | - | - | - | - | - | - | - | - | - | - |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 400MHZ 84BGA
|
paquet: 84-TFBGA |
Stock4 992 |
|
DRAM | SDRAM - DDR2 | 512Mb (32M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
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Micron Technology Inc. |
IC SDRAM 256MBIT 133MHZ 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock5 360 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC FLASH 32MBIT 104MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock4 896 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 104MHz | 5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Adesto Technologies |
IC FLASH 256KBIT 85MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 032 |
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FLASH | FLASH | 256Kb (32K x 8) | SPI | 104MHz | 8µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 736 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 64KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 048 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 64MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock10 236 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
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Macronix |
IC FLASH 64MBIT
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock2 256 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 50µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 1G PARALLEL 60TWBGA
|
paquet: 60-TFBGA |
Stock7 504 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TWBGA (8x10.5) |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 1G PARALLEL 60TWBGA
|
paquet: 60-TFBGA |
Stock5 040 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 400MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TWBGA (8x10.5) |
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Renesas Electronics Corporation |
IC EEPROM 1MBIT PARALLEL 32SOP
|
paquet: - |
Request a Quote |
|
EEPROM | EEPROM | 1Mbit | Parallel | - | 10ms | 150 ns | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOP |
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Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8SOIC
|
paquet: - |
Stock11 967 |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 104 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8WSON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Micron Technology Inc. |
IC DRAM 24GBIT 2.133GHZ FBGA QDP
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gbit | - | 2.133 GHz | - | - | 1.1V | -40°C ~ 125°C (TC) | - | - | - |
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Flexxon Pte Ltd |
IC FLSH 256GBIT EMMC 5.1 153FBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |