Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adesto Technologies |
IC FLASH 256KBIT 85MHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 936 |
|
FLASH | FLASH | 256Kb (32K x 8) | SPI | 104MHz | 8µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 90BGA
|
paquet: 90-TFBGA |
Stock7 536 |
|
DRAM | SDRAM - Mobile DDR | 256Mb (8M x 32) | Parallel | 166MHz | 15ns | 5.5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
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Micron Technology Inc. |
IC SDRAM 4GBIT 533MHZ 134FBGA
|
paquet: 134-WFBGA |
Stock5 248 |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gb (128M x 32) | Parallel | 533MHz | - | - | 1.14 V ~ 1.3 V | -30°C ~ 85°C (TC) | Surface Mount | 134-WFBGA | 134-FBGA (10x11.5) |
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Winbond Electronics |
IC SDRAM 64MBIT 200MHZ 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock9 348 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 200MHz | - | 5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock26 088 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Micron Technology Inc. |
IC PSRAM 16MBIT 70NS 48VFBGA
|
paquet: 48-VFBGA |
Stock5 904 |
|
PSRAM | PSRAM (Pseudo SRAM) | 16Mb (1M x 16) | Parallel | - | 70ns | 70ns | 1.7 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
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Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 776 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 1MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock7 200 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 150ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 100NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 120 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 72MBIT 250MHZ 165BGA
|
paquet: 165-TBGA |
Stock3 200 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 250MHz | - | 2.8ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
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Cypress Semiconductor Corp |
IC SRAM 36MBIT 167MHZ 165FBGA
|
paquet: 165-LBGA |
Stock5 136 |
|
SRAM | SRAM - Synchronous | 36Mb (1M x 36) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
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IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 15NS 100TQFP
|
paquet: 100-LQFP |
Stock7 408 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 35NS 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock3 856 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 55NS 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock6 528 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 928 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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SII Semiconductor Corporation |
IC EEPROM 8KBIT 5MHZ 8SOP
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 328 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 5MHz | 4ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
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Toshiba Semiconductor and Storage |
IC EEPROM 1GBIT 25NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock540 672 |
|
EEPROM | EEPROM - NAND | 1Gb (128M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
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Cypress Semiconductor Corp |
IC NVSRAM 8MBIT 45NS 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock5 424 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mb (512K x 16) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Maxim Integrated |
IC NVSRAM 256KBIT 150NS 28EDIP
|
paquet: 28-DIP Module (0.600", 15.24mm) |
Stock8 040 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 150ns | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
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Cypress Semiconductor Corp |
IC FLASH 16M PARALLEL 56MHZ DIE
|
paquet: Die |
Stock5 376 |
|
FLASH | FLASH - NOR | 16Mb (512K x 32) | Parallel | 56MHz | 60ns | 54ns | 1.65 V ~ 2.75 V | -40°C ~ 145°C (TA) | Surface Mount | Die | Die |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 16M PARALLEL 42SOJ
|
paquet: 42-BSOJ (0.400", 10.16mm Width) |
Stock3 264 |
|
DRAM | DRAM - EDO | 16Mb (1M x 16) | Parallel | - | - | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 42-BSOJ (0.400", 10.16mm Width) | 42-SOJ |
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Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 44FBGA
|
paquet: 44-VFBGA |
Stock2 640 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 108MHz | 60ns | 80ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 44-VFBGA | 44-FBGA (7.5x5) |
||
Alliance Memory, Inc. |
IC DRAM 1G 32MX32 LPDDR2 134-BGA
|
paquet: 134-VFBGA |
Stock6 000 |
|
DRAM | SDRAM - Mobile LPDDR2 | 1Gb (32M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-FBGA (10x11.5) |
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Cypress Semiconductor Corp |
IC FRAM 4MBIT 20MHZ 8GQFN
|
paquet: - |
Stock6 240 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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Micron Technology Inc. |
LPDDR5 16GBIT 16 315/315 TFBGA 1
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 16Gbit | Parallel | 4.266 GHz | - | - | 1.05V | -40°C ~ 95°C | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
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Macronix |
MEMORY
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 8Mbit | Parallel | - | 70ns, 300µs | 70 ns | 4.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 16MBIT SPI/QUAD 8USON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O, QPI | 133 MHz | 100µs, 4ms | 6 ns | 1.65V ~ 2.1V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (3x2) |
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Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 8SOIC
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 30µs, 800µs | 6 ns | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |