Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Cypress Semiconductor Corp |
IC SRAM 36MBIT 550MHZ 165FBGA
|
paquet: 165-LBGA |
Stock2 448 |
|
SRAM | SRAM - Synchronous, QDR II+ | 36Mb (1M x 36) | Parallel | 550MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
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IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 32TSOP
|
paquet: 32-SOIC (0.400", 10.16mm Width) |
Stock6 000 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
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Micron Technology Inc. |
IC FLASH 2MBIT 50MHZ 8SO
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock77 040 |
|
FLASH | FLASH - NOR | 2Mb (256K x 8) | SPI | 50MHz | 15ms, 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
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Micron Technology Inc. |
IC SDRAM 256MBIT 100MHZ 90VFBGA
|
paquet: 90-VFBGA |
Stock2 544 |
|
DRAM | SDRAM - Mobile LPDDR | 256Mb (8M x 32) | Parallel | 104MHz | 15ns | 7.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
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Microchip Technology |
IC EEPROM 64KBIT 20MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 944 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EEPROM 16KBIT 300NS 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock2 448 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 18MBIT 333MHZ 165BGA
|
paquet: 165-LBGA |
Stock3 648 |
|
SRAM | SRAM - Synchronous, QUADP | 18Mb (512K x 36) | Parallel | 333MHz | - | 8.4ns | 1.71 V ~ 1.89 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-LFBGA (15x17) |
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Alliance Memory, Inc. |
IC SRAM 4MBIT 10NS 36SOJ
|
paquet: 36-BSOJ (0.400", 10.16mm Width) |
Stock3 296 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
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IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 44SOJ
|
paquet: 44-BSOJ (0.400", 10.16mm Width) |
Stock7 856 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock3 152 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC FLASH 1GBIT 104MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock7 552 |
|
FLASH | FLASH - NAND | 1Gb (128M x 8) | SPI | 104MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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ON Semiconductor |
IC EEPROM 1MBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 832 |
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EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Microchip Technology |
IC EEPROM 4KBIT 10MHZ 8DFN
|
paquet: 8-VFDFN Exposed Pad |
Stock20 520 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
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Microchip Technology |
IC EEPROM 8KBIT 100KHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5 072 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | Single Wire | 100kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
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Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 800 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Rohm Semiconductor |
IC EEPROM 1KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 496 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock21 204 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 4.5µs | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
paquet: 32-TFSOP (0.488", 12.40mm Width) |
Stock19 992 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
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Cypress Semiconductor Corp |
IC FLASH 128MBIT 100NS 56TSOP
|
paquet: 56-TFSOP (0.724", 18.40mm Width) |
Stock37 248 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
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Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
paquet: - |
Stock7 920 |
|
DRAM | SDRAM - Mobile LPDDR4 | - | - | - | - | - | - | - | - | - | - |
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Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 133 MHz | -, 3ms | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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onsemi |
IC EEPROM 2KBIT MICROWIRE 8SOIC
|
paquet: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | Microwire | 2 MHz | - | 250 ns | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Micron Technology Inc. |
IC DRAM 32GBIT 2.133GHZ 200VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
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Renesas Electronics Corporation |
IC RAM
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 2MBIT SPI/QUAD I/O 8SOP
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 50µs, 2.4ms | - | 1.65V ~ 2.1V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 2MBIT SPI/QUAD I/O 8SOP
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 50µs, 2.4ms | - | 1.65V ~ 2.1V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 16MBIT SPI/QUAD 8SOP
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 120 MHz | 50µs, 2.4ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |