Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
LPDDR4 16G 256MX64 FBGA DDP
|
paquet: - |
Stock6 432 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32GBIT WAFER
|
paquet: Die |
Stock4 880 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 143MHZ 60TFBGA
|
paquet: 60-TFBGA |
Stock2 736 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (6.4x10.1) |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 12NS 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock3 296 |
|
SRAM | SRAM - Asynchronous | 16Mb (1M x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 66TSOP
|
paquet: 66-TSSOP (0.400", 10.16mm Width) |
Stock6 448 |
|
DRAM | SDRAM - DDR | 256Mb (32M x 8) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC FLASH 256KBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 184 |
|
FLASH | FLASH | 256Kb (32K x 8) | Parallel | - | 20ms | 150ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock4 832 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 10ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock237 000 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 208CABGA
|
paquet: 208-LFBGA |
Stock7 568 |
|
SRAM | SRAM - Dual Port, Synchronous | 9Mb (256K x 36) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 72MBIT 166MHZ 100LQFP
|
paquet: 100-LQFP |
Stock2 640 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 166MHz | - | 3.8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC FLASH 512GBIT 167MHZ 152TBGA
|
paquet: - |
Stock6 544 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 166MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 25NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock5 600 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock26 832 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 568 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 500MHZ 165FBGA
|
paquet: 165-LBGA |
Stock4 464 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 500MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock21 456 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 110NS 64BGA
|
paquet: 64-LBGA |
Stock8 856 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | Parallel | - | 60ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
Microchip Technology |
IC EEPROM 16K SGL WIRE 100KHZ
|
paquet: Die |
Stock3 760 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Winbond Electronics |
IC DRAM 64MBIT HYPERBUS 24TFBGA
|
paquet: - |
Request a Quote |
|
DRAM | HyperRAM | 64Mbit | HyperBus | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 85°C (TC) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Kingston Technology |
IC FLASH 256GBIT EMMC 153FBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | eMMC | - | - | - | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 153-FBGA | 153-FBGA (11.5x13) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Sanyo |
SERIAL SPI EEPROM
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC EPROM 128KBIT PARALLEL
|
paquet: - |
Request a Quote |
|
EPROM | EPROM - UV | 128Kbit | Parallel | - | - | 65 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | - | - | - |
||
Silicon Motion, Inc. |
IC FLASH 4TBIT EMMC 153BGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 4Tbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
Renesas Electronics Operations Services Limited |
16 MBIT, WIDE VCC (1.65V TO 3.6V
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O | 133 MHz | 32µs, 6.5ms | 8 ns | 1.65V ~ 3.75V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Infineon Technologies |
IC FLASH 64MBIT PARALLEL 48TSOP
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | Parallel | - | 60ns | 90 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Intelligent Memory Ltd. |
LPDDR4X 8GB 512MX16 2133MHZ FBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 8Gbit | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -25°C ~ 85°C (TC) | Surface Mount | 200-VFBGA | 200-FBGA (10x15) |