Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Micron Technology Inc. |
IC FLASH 256GBIT 83MHZ 132TBGA
|
paquet: - |
Stock6 992 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
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Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 66TSOP
|
paquet: 66-TSSOP (0.400", 10.16mm Width) |
Stock5 504 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
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Micron Technology Inc. |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock6 960 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock7 376 |
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DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Micron Technology Inc. |
IC SDRAM 512MBIT 125MHZ 90VFBGA
|
paquet: 90-VFBGA |
Stock5 776 |
|
DRAM | SDRAM - Mobile LPSDR | 512Mb (16M x 32) | Parallel | 125MHz | - | 7.5ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
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Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock270 000 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 1MBIT 55NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock6 352 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
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Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 712 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 200µs | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC OTP 512KBIT 150NS 28SOIC
|
paquet: 28-SOIC (0.342", 8.69mm Width) |
Stock3 648 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 150ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
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Microchip Technology |
IC FLASH 16MBIT 20MHZ 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock2 576 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 20MHz | 14ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 100NS SB48
|
paquet: 48-DIP (0.600", 15.24mm) |
Stock2 704 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 48-DIP (0.600", 15.24mm) | 48-SIDE BRAZED |
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Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
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paquet: - |
Stock5 424 |
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- | - | - | - | - | - | - | - | - | - | - | - |
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IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8NS 165CABGA
|
paquet: 165-TBGA |
Stock4 832 |
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SRAM | SRAM - Synchronous ZBT | 9Mb (512K x 18) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
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Alliance Memory, Inc. |
IC SRAM 4MBIT 15NS 44TSOP
|
paquet: 44-TSOP (0.400", 10.16mm Width) |
Stock23 040 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
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Alliance Memory, Inc. |
IC SRAM 4MBIT 55NS 36TFBGA
|
paquet: 36-TFBGA |
Stock4 400 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
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Adesto Technologies |
IC FLASH 8-UDFN IND TEMP 3V
|
paquet: 8-UDFN Exposed Pad |
Stock3 376 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI | 104MHz | 150µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 136 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Adesto Technologies |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 160 |
|
EEPROM | EEPROM | 256kb (64B Page Size) | SPI | 10MHz | 100µs, 5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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ON Semiconductor |
IC EEPROM 2KBIT 400KHZ 8UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock240 000 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN-EP (2x3) |
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Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 64BGA
|
paquet: 64-LBGA |
Stock5 424 |
|
FLASH | FLASH - NOR | 1Gb (64M x 16) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | 0°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 108MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock3 856 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
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IDT, Integrated Device Technology Inc |
IC SRAM 64K PARALLEL 84PLCC
|
paquet: 84-LCC (J-Lead) |
Stock5 520 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
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Cypress Semiconductor Corp |
IC SRAM MICROPOWER 44TSOP II
|
paquet: - |
Stock2 064 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8WSON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI | 104 MHz | 50µs, 3ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Renesas Electronics Corporation |
8K X 8 EEPROM CMOS, 32 LEAD PLCC
|
paquet: - |
Request a Quote |
|
EEPROM | EEPROM | 64Kbit | Parallel | - | 5ms | 90 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |
||
Winbond Electronics |
IC FLASH 2GBIT PARALLEL 63VFBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | Parallel | - | 25ns | 22 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
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Microchip Technology |
IC EEPROM 1KBIT 1-WIRE SOT23-3
|
paquet: - |
Stock14 910 |
|
EEPROM | EEPROM | 1Kbit | 1-Wire® | - | 5ms | - | 2.7V ~ 4.5V | -40°C ~ 85°C (TC) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
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Harris Corporation |
IC SRAM 1KBIT PARALLEL 16DIP
|
paquet: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Kbit | Parallel | - | 350ns | 250 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |