Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 4MBIT 75MHZ 8SO
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock7 168 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 75MHz | 15ms, 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SO W |
||
Micron Technology Inc. |
IC FLASH 32MBIT 70NS 56VFBGA
|
paquet: 56-VFBGA |
Stock3 280 |
|
FLASH | FLASH - NOR | 32Mb (2M x 16) | Parallel | 66MHz | 70ns | 70ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFBGA (7.7x9) |
||
Adesto Technologies |
IC FLASH 4MBIT 66MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock1 054 272 |
|
FLASH | FLASH | 4Mb (264 Bytes x 2048 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 200MHZ 60VFBGA
|
paquet: 60-VFBGA |
Stock3 520 |
|
DRAM | SDRAM - Mobile LPDDR | 256Mb (16M x 16) | Parallel | 200MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 60-VFBGA | 60-VFBGA (8x9) |
||
Micron Technology Inc. |
IC FLASH 4GBIT 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock7 664 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | 25ns | 25ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC FLASH 32MBIT 70NS 47TFBGA
|
paquet: 47-TFBGA |
Stock7 248 |
|
FLASH | FLASH - NOR | 32Mb (2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 47-TFBGA | 47-TFBGA (6.39x6.37) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 7.5NS 100TQFP
|
paquet: 100-LQFP |
Stock5 040 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 166MHZ 100TQFP
|
paquet: 100-LQFP |
Stock3 392 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 8NS 54TSOP
|
paquet: 54-TSOP (0.400", 10.16mm Width) |
Stock4 256 |
|
SRAM | SRAM - Asynchronous | 16Mb (1M x 16) | Parallel | - | 8ns | 8ns | 3 V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Winbond Electronics |
IC FLASH 2MBIT 75MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock4 528 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 75MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 66TSOP
|
paquet: 66-TSSOP (0.400", 10.16mm Width) |
Stock2 864 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock5 696 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 408 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 667MHZ 96BGA
|
paquet: 96-TFBGA |
Stock6 272 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 15NS 48CABGA
|
paquet: 48-TFBGA |
Stock5 808 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-CABGA (7x7) |
||
Winbond Electronics |
IC SDRAM 1GBIT 400MHZ 168WFBGA
|
paquet: 168-WFBGA |
Stock5 456 |
|
DRAM | SDRAM - Mobile LPDDR2 | 1Gb (64M x 16) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Maxim Integrated |
IC NVSRAM 64KBIT 70NS 28EDIP
|
paquet: 28-DIP Module (0.600", 15.24mm) |
Stock6 832 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 70ns | 70ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock14 640 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
paquet: Die |
Stock5 088 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC SRAM 9M PARALLEL 100TQFP
|
paquet: 100-LQFP |
Stock3 792 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC FLASH MEM NOR 48FBGA
|
paquet: 48-VFBGA |
Stock2 704 |
|
FLASH | FLASH - NOR | 32Mb (2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -25°C ~ 85°C | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Renesas Electronics America |
IC SRAM 256KBIT 70NS 28TSOP
|
paquet: 28-TSSOP (0.465", 11.80mm Width) |
Stock5 248 |
|
SRAM | SRAM | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
256MB, OCTAL FLASH, 3V, 24-BALL
|
paquet: - |
Stock720 |
|
FLASH | FLASH | 256Mbit | SPI - Octal I/O | 133 MHz | 1.8ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Silicon Motion, Inc. |
IC FLASH 320GBIT UFS3.1 153BGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 320Gbit | UFS3.1 | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
Micron Technology Inc. |
LPDDR4 32G 512MX64 FBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 125°C (TC) | Surface Mount | 556-TFBGA | 556-WFBGA (12.4x12.4) |
||
Fairchild Semiconductor |
IC EEPROM 2KBIT MICROWIRE 8TSSOP
|
paquet: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | Microwire | 250 kHz | 15ms | - | 2.7V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Renesas Electronics Corporation |
IC RAM 8MBIT SPI 108MHZ 8SOIC
|
paquet: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 8Mbit | SPI | 108 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 16MBIT SPI/QUAD 8SOP
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O | 133 MHz | 70µs, 2ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |