Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIEAL 10K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 464 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 200K C-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 392 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 36K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock11 892 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 8M 32TQFP
|
paquet: 32-TQFP |
Stock4 752 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 800 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 008 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 32TQFP
|
paquet: 32-TQFP |
Stock3 760 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SER 50000 I-TEMP 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 920 |
|
500kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 50000 C-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock12 840 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 200K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 112 |
|
200kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock60 816 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC 3V PROM PROG 50K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 520 |
|
50kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 904 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock13 524 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 1K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 392 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CNFIG PROM 2M 3.3V 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock15 168 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 8MBIT 100QFP
|
paquet: 100-BQFP |
Stock55 980 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Microchip Technology |
IC FLASH CONFIG 16M 8LAP
|
paquet: 8-TDFN |
Stock7 360 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 440 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock99 660 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 1MB PROM
|
paquet: 20-LCC (J-Lead) |
Stock4 320 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
paquet: 44-TQFP |
Stock5 136 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 256MBIT 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock23 040 |
|
256Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE
|
paquet: 88-LFBGA |
Stock3 040 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
paquet: 100-BQFP |
Stock3 360 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 400KBIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock17 040 |
|
440kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 65KBIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 144 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 4MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock11 316 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |