Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
paquet: - |
Stock6 416 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | - | - |
||
Altera |
IC CONFIG DEVICE 16MBIT 88UBGA
|
paquet: 88-LFBGA |
Stock7 080 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Xilinx Inc. |
IC PROM SERIAL 65K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 776 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL 256K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 920 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL 128K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 096 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FLASH CONFIG 7MBIT 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock3 104 |
|
7Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 384 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 736 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock2 208 |
|
8Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 50000 I-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 968 |
|
500kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 744 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 112 |
|
200kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150000 C-TEMP 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock7 040 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC 3V PROM SER 10K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 440 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock136 920 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 608 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 64K 3.3V 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 480 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 16MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 304 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock5 120 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 1MB PROM
|
paquet: 20-LCC (J-Lead) |
Stock5 328 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-LAP
|
paquet: 8-TDFN |
Stock6 464 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock186 480 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 16MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock1 597 836 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 44-VQFP
|
paquet: 44-TQFP |
Stock80 160 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Intel |
IC QUAD-SERIAL CONFIG DEVICE 512
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock7 552 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 008 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 65KBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 448 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
paquet: 24-TBGA |
Stock6 960 |
|
512MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |