Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 50K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock318 012 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 128K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock2 352 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 200K I-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 336 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 36K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 192 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 4M CONFIG MEM 44TQFP
|
paquet: 44-TQFP |
Stock3 440 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 520 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 232 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32-TQFP
|
paquet: 32-TQFP |
Stock3 328 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 488 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 184 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 30000 I-TEMP 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 272 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 200000 I-TEMP 44VQFP
|
paquet: 44-TQFP |
Stock5 488 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 5K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock127 392 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 100000 C-TEMP 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 192 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock13 800 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 976 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 36K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock116 232 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 264 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock2 304 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL 16MB 44-VQFN
|
paquet: 44-TQFP |
Stock2 880 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TJ) | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
XC18V02PCG44C0100
|
paquet: 44-LCC (J-Lead) |
Stock7 280 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 1MB PROM
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 832 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 32TQFP
|
paquet: 32-TQFP |
Stock4 352 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC FLASH CONFIG 4MBIT 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock4 400 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC FLASH CONFIG 16M 8LAP
|
paquet: 8-TDFN |
Stock6 420 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Intel |
IC CONFIG DEVICE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 656 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 88UBGA
|
paquet: 88-LFBGA |
Stock6 480 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
AMD |
CONFIG MEMORY, 1M BITS, SERIAL
|
paquet: - |
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