Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLIC 1CH UNIV 10V 28PLCC
|
paquet: - |
Stock116 580 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Maxim Integrated |
IC TXRX QUAD T1/E1/J1 256CSBGA
|
paquet: 256-LBGA, CSBGA |
Stock2 672 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | - | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC SOFTWARE GENERATOR EBERT PLCC
|
paquet: 44-LCC (J-Lead) |
Stock7 248 |
|
E1, J1, T1 | 1 | 3 V ~ 3.6 V | 50mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176LQFP
|
paquet: 176-LQFP |
Stock6 800 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
paquet: 256-LBGA Exposed Pad |
Stock7 392 |
|
- | 4 | 3.135 V ~ 3.465 V | - | - | - | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC LINEFEED INTRFC 100V 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock137 724 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 110µA | 941mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock4 736 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8 FLTPK
|
paquet: 8-ESOP (0.250", 6.35mm Width) |
Stock3 456 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-ESOP (0.250", 6.35mm Width) | 8-Flatpack |
||
Maxim Integrated |
IC T1/E1/J1 64KCC ELEMENT 64LQFP
|
paquet: 64-LQFP |
Stock65 220 |
|
64KCC, E1, T1 | 1 | 3.14 V ~ 3.47 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Microsemi Corporation |
IC DGTL SWITCH IDX 64X64 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock5 456 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Maxim Integrated |
IC CHIPSET ETH OVER COAX CSBGA
|
paquet: - |
Stock6 944 |
|
- | - | - | - | - | - | - | - | - |
||
Exar Corporation |
IC LIU T1/E1/J1 SGL 64TQFP
|
paquet: 64-LQFP |
Stock7 728 |
|
- | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
paquet: - |
Stock14 100 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 528 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Rohm Semiconductor |
IC SOUND GENERATOR LSI QFN28V TR
|
paquet: 28-VFQFN |
Stock6 224 |
|
- | 1 | 2.7 V ~ 3.6 V | - | 370mW | -40°C ~ 85°C | Surface Mount | 28-VFQFN | 28-VQFN |
||
Microsemi Solutions Sdn Bhd. |
26 PORT MANAGED LAYER 2-SWITCH
|
paquet: - |
Stock5 856 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microsemi Corporation |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
paquet: 1292-BGA, FCBGA |
Stock4 912 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microsemi Corporation |
SONET/SDH INTERFACE FOR 622 & 15
|
paquet: 196-BGA |
Stock7 840 |
|
Serial | - | - | - | - | - | Surface Mount | 196-BGA | 196-CABGA (15x15) |
||
Microchip Technology |
IC DGTL SWITCH 4K X 2K 220BGA
|
paquet: 220-BGA |
Stock3 712 |
|
- | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 220-BGA | 220-BGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
paquet: 256-BGA |
Stock5 792 |
|
- | 1 | 1.71V ~ 1.89V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
IC CODEC A-LAW CCITT PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 096 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC ECHO CANCELLER DUAL 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock6 736 |
|
Serial | 2 | 4.5V ~ 5.5V | 70mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 40QFN
|
paquet: - |
Stock4 400 |
|
Serial | 2 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |
||
Infineon Technologies |
LANTIQ PEF22553 TELECOMS IC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SLIC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
SDFE-2 SYMMETRIC DSL FRONT END,
|
paquet: - |
Request a Quote |
|
HDLC, Serial, TDM | 2 | - | - | 500 mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | P-LBGA-324 |
||
Texas Instruments |
GLS240 DEVICE WITH 100% BURN IN
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IPAC-X ISDN PC ADAPTER CIRCUIT
|
paquet: - |
Request a Quote |
|
HDLC, ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-MQFP-64-1 |