Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SHDSL TRANSCEIVER LBGA-324
|
paquet: 324-LBGA |
Stock6 384 |
|
ISDN, SHDSL | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 324-LBGA | P-LBGA-324 |
||
Maxim Integrated |
IC TDM/PACKET TRANSPORT 676BGA
|
paquet: 676-BGA |
Stock2 624 |
|
TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-PBGA (27x27) |
||
Maxim Integrated |
IC HDLC CONTROLLER 256-BGA
|
paquet: 256-BGA |
Stock3 344 |
|
Serial | - | 3 V ~ 3.6 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Intersil |
IC SLIC UNIVERSAL LP 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock5 840 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock6 976 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock124 632 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock457 464 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX QUAD T1/E1 3.3V 256-BGA
|
paquet: 256-BGA |
Stock6 848 |
|
T1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8 FLTPK
|
paquet: 8-ESOP (0.250", 6.35mm Width) |
Stock7 056 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-ESOP (0.250", 6.35mm Width) | 8-Flatpack |
||
IXYS Integrated Circuits Division |
IC MOD PH-LINE 1.07X1.07X0.4"PCB
|
paquet: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Stock2 880 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Maxim Integrated |
IC TXRX T1/E1 QUAD 3.3V 256-BGA
|
paquet: 256-BGA |
Stock3 264 |
|
T1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 24K CH 484BGA
|
paquet: 484-BGA |
Stock7 920 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Intersil |
IC LINE DVR DIFF 300MHZ 16QFN
|
paquet: 16-VQFN Exposed Pad |
Stock26 784 |
|
- | 1 | 4.5 V ~ 13.2 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad | 16-QFN (4x4) |
||
Microsemi Corporation |
IC LINE DRIVER CLASS AB 16QFN
|
paquet: - |
Stock4 096 |
|
- | 1 | - | - | - | - | Surface Mount | - | 16-QFN |
||
IXYS Integrated Circuits Division |
IC LITELINK III FULL RING 32SOIC
|
paquet: 32-SOIC (0.295", 7.50mm Width) |
Stock262 764 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
NXP |
CABLE FST DEMOD
|
paquet: - |
Stock5 040 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
EIGHT CHANNEL COMBINED T1/E1/J1
|
paquet: 256-BGA |
Stock6 608 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Microchip Technology |
IC DGTL SWITCH RCDX 144BGA
|
paquet: 144-BGA |
Stock2 912 |
|
- | 1 | 3V ~ 3.6V | 52mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA | 144-PBGA (23x23) |
||
Microchip Technology |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 616 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock7 600 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Lantiq |
GEMINAX-A8+ MAX 8 CHANNEL ADSL2+
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
TRANSVR IC GPY115C0VI VQFN56 SLN
|
paquet: - |
Stock11 766 |
|
PHY, Serial, SGMII, SPI | 1 | 0.97V ~ 1.03V, 3.13V ~ 3.46V | 275mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Lantiq |
GEMINAX-A8+ MAX 8 CHANNEL ADSL2+
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
ZARLINK TELECOM CIRCUIT 1-FUNC
|
paquet: - |
Request a Quote |
|
- | - | 3.75V | 15mA | - | -40°C ~ 85°C | Surface Mount | 64-QFP | 64-QFP |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
paquet: - |
Request a Quote |
|
ADSL, DSL | - | - | - | - | - | - | - | - |
||
Lantiq |
Q-SMINT SECOND GEN. MODULAR ISDN
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
SICOFI-TE TWO CHANNEL CODEC
|
paquet: - |
Request a Quote |
|
IOM-2 PCM, SPI | 2 | 5V | 18mA | 90 mW | - | Surface Mount | 64-QFP | P-MQFP-64 |