Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO24-8
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock35 880 |
|
- | 1 | 5V | 2.8mA | 730mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Microsemi Corporation |
IC VOICEPORT FXS 8KHZ 44LQFP
|
paquet: 44-LQFP |
Stock48 000 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
paquet: 32-VQFN Exposed Pad |
Stock7 200 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
paquet: 304-BBGA |
Stock2 000 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-BBGA | 304-PBGA (31x31) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
paquet: 256-LBGA Exposed Pad |
Stock5 360 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
paquet: 32-VQFN Exposed Pad |
Stock7 088 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 75°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microchip Technology |
IC MONO FEATURE PHONE 44SSOP
|
paquet: 44-SOP (0.291", 7.40mm Width) |
Stock4 272 |
|
- | 1 | - | - | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
paquet: 28-VDFN Exposed Pad |
Stock5 664 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Maxim Integrated |
IC MUX TEMPE T3/E3 IND 256-BGA
|
paquet: 256-BGA |
Stock3 712 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Maxim Integrated |
IC LIU T3/E3/STS-1 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock12 024 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 2CH SHORT 80TQFP
|
paquet: 80-LQFP |
Stock4 704 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 56QFN
|
paquet: - |
Stock7 264 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 232 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
paquet: - |
Stock3 760 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DC-DC -135V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock2 864 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
ams |
IC LINE INTERFACE/SPKRPH 28-SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock106 596 |
|
Serial | 1 | - | 3mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
ARROW-1X192
|
paquet: 1292-BGA, FCBGA |
Stock5 392 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
paquet: - |
Stock3 776 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH NGCC 28QFN 4X5
|
paquet: 28-VFQFN Exposed Pad |
Stock7 504 |
|
2-Wire | - | - | - | - | - | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN |
||
Microchip Technology |
IC LINE DRIVER CLASS AB 16QFN
|
paquet: - |
Stock5 920 |
|
- | 1 | - | - | - | - | Surface Mount | - | 16-QFN |
||
Microchip Technology |
IC CNIC1.1 CLIP CID TYPE1 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock7 696 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
paquet: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Broadcom Limited |
1TB ETHERNET CONNECTIVITY SWITCH
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Texas Instruments |
TELECOM CIRCUIT, 1-FUNC, PBGA289
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
10G ASSYMETRIC XPON HGW
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
DUSLIC DUAL CHANNEL SUBSCRIBER L
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SLIC EIA/ITU PABX 24-SOIC
|
paquet: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 75°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
MaxLinear, Inc. |
CODEC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |