Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC COMPONENT QUADFALC 160-LBGA
|
paquet: 160-LBGA |
Stock2 128 |
|
E1, J1, SCI, SPI, T1 | 4 | 1.8V, 3.3V | - | 150mW | -40°C ~ 85°C | Surface Mount | 160-LBGA | PG-LBGA-160 |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 208LBGA
|
paquet: 208-LBGA |
Stock13 704 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microsemi Corporation |
IC DGTL SWITCH DHS 100MQFP
|
paquet: 100-BQFP |
Stock71 472 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 100mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock25 320 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock4 720 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
paquet: 64-TQFP |
Stock5 568 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Exar Corporation |
IC LIU SH E1 16CH 289STBGA
|
paquet: 289-LFBGA |
Stock7 984 |
|
LIU | 16 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 289-LFBGA | 289-STBGA (15x15) |
||
Texas Instruments |
IC SOURCE RINGER CTRLR 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock7 808 |
|
- | 1 | 5V | 500µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
paquet: 256-LBGA Exposed Pad |
Stock4 992 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 590mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock10 260 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC SI2401 LINE-SIDE DAA 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock1 639 944 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU T3/E3/STS-1 48LQFP
|
paquet: 48-LQFP |
Stock13 836 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Exar Corporation |
IC FRAMR/LIU T1/E1/J1 QD 128LQFP
|
paquet: - |
Stock3 232 |
|
- | - | 3.3V | - | - | - | - | - | - |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100CSBGA
|
paquet: 100-LFBGA, CSPBGA |
Stock14 532 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Microsemi Corporation |
IC SLAC 4CH 3V GCI/PCM 64TQFP
|
paquet: 64-TQFP |
Stock39 408 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 20IO 44TQFP
|
paquet: 44-TQFP |
Stock396 000 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock5 520 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 150V 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock4 384 |
|
4-Wire | 1 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Texas Instruments |
IC ADAPTER DIG QDASL QUAD 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock4 192 |
|
ISDN | 4 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
TEMAP 168, LF BUMP
|
paquet: - |
Stock6 208 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET SWITCH 24PORT 672BGA
|
paquet: - |
Stock7 616 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microchip Technology |
IC ETHERNET SWITCH 302TQFP
|
paquet: - |
Stock4 224 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Microchip Technology |
IC ETHERNET SWITCH 302TQFP
|
paquet: - |
Stock7 504 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock2 528 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 392 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | 500mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC SYNCHRONIZER SONET/SDH 80LQFP
|
paquet: 80-LQFP |
Stock6 128 |
|
- | 1 | 3V ~ 3.6V | 150mA | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (14x14) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
paquet: 68-VFQFN Exposed Pad |
Stock7 176 |
|
GMII, MII, RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
paquet: - |
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