Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Exar Corporation |
IC LIU E1 QUAD 80TQFP
|
paquet: 80-LQFP |
Stock5 744 |
|
LIU | - | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Microsemi Corporation |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
paquet: 36-BSOP (0.295", 7.50mm Width) |
Stock3 376 |
|
Serial | 1 | 2.7 V ~ 3.6 V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 208LBGA
|
paquet: 208-LBGA |
Stock3 200 |
|
LIU | 1 | 1.6 V ~ 2 V | 40mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
paquet: 64-TQFP |
Stock5 184 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS -135V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock7 280 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Exar Corporation |
IC FRAMER DS3/E3 SGL 100QFP
|
paquet: 100-BQFP |
Stock5 040 |
|
- | - | 3.3V | 120mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-QFP (14x20) |
||
Silicon Labs |
IC LINEFEED INTRFC SI321X 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock362 844 |
|
PCM, Serial, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 800mW | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC TESTER BIT ERROR 3.3V 32-TQFP
|
paquet: 32-TQFP |
Stock4 592 |
|
T1 | 1 | 3 V ~ 3.6 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock5 952 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
|
paquet: - |
Stock5 664 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 56QFN
|
paquet: - |
Stock3 568 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Intersil |
IC SLIC EIA/ITU PABX 24-SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock2 928 |
|
- | 1 | - | - | 550mW | 0°C ~ 75°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
ams |
IC LINE INTERFACE/SPKRPH 28-SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock7 616 |
|
Serial | 1 | - | 3mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC SWITCH LCAS PROT SCR 16-SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock5 760 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | - | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
paquet: 144-LQFP Exposed Pad |
Stock5 744 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Microsemi Corporation |
40G VT/TU SWITCHING ELEMENT
|
paquet: 672-BGA, FCBGA |
Stock6 096 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
||
Microchip Technology |
10GBE XAUI OR XGMII TO XFI LAN/W
|
paquet: - |
Stock6 624 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock5 232 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock4 816 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA
|
paquet: 256-BGA |
Stock5 872 |
|
- | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC DGTL SWITCH 2048X2048 120BGA
|
paquet: 120-BGA |
Stock3 920 |
|
- | 1 | 3V ~ 3.6V | 45mA | - | -40°C ~ 85°C | Surface Mount | 120-BGA | 120-PBGA (23x23) |
||
Microchip Technology |
17PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock8 172 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Broadcom Limited |
DUAL 40GBE/OCTAL 10GBE QSFP+ XLP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
10G XPON B-ONT CHIP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BCM63137SV00W1
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
VDSL 17/ADSL SOC WITH DECT+VOIP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
SLIC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH FABRIC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |