Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 48TQFP
|
paquet: - |
Stock15 396 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 552BGA
|
paquet: 552-BGA |
Stock4 256 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
paquet: - |
Stock4 976 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64LQFP
|
paquet: 64-LQFP |
Stock6 512 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
||
Maxim Integrated |
IC 12CH DS3/3 FRAMER 349BGA
|
paquet: 349-BGA Exposed Pad |
Stock5 840 |
|
LIU | - | 3.135 V ~ 3.465 V | 960mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-TE-PBGA-2 (27x27) |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 384 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
paquet: 16-VDFN Exposed Pad |
Stock6 272 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Microsemi Corporation |
IC DGTL SWITCH QDX QUAD 160BGA
|
paquet: 160-BGA |
Stock4 480 |
|
- | 4 | 3 V ~ 3.6 V | 64mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (23x23) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 432 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 36QFN
|
paquet: - |
Stock5 392 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 40QFN
|
paquet: - |
Stock6 672 |
|
3-Wire | 1 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38QFN
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock4 000 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
STMicroelectronics |
IC OFDM PWR SOC IND/ASIC 100TQFP
|
paquet: 48-VFQFN Exposed Pad |
Stock15 834 |
|
I2C, SPI | 1 | 8 V ~ 18 V | - | - | -40°C ~ 80°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Maxim Integrated |
IC TXRX E1 QUAD 100-LQFP
|
paquet: 100-LQFP |
Stock14 268 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Renesas Electronics America |
IC LINE DVR DIFF 300MHZ 10HMSOP
|
paquet: 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Stock16 344 |
|
- | 1 | 4.5 V ~ 12 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HMSOP |
||
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE
|
paquet: - |
Stock5 968 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ABS VOICEPORT 2CH 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock4 800 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microchip Technology |
IC FXO CODEC 1CH 3V 44QFN
|
paquet: 44-QFN |
Stock6 160 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-QFN | 44-QFN (7x7) |
||
Microchip Technology |
IC LINE DRIVER VDSL2 16QFN
|
paquet: - |
Stock5 040 |
|
- | 1 | - | - | - | - | Surface Mount | - | 16-QFN |
||
Microchip Technology |
25PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock7 744 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Infineon Technologies |
TIME SLOT ASSIGNER
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
28GE+4X10GE+2XHG[42]
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
IP PHONE CHIP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISAC-S ISDN ACCESS CONTROLLER
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
paquet: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.5mA | 150 mW | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
GEMINAX-D32 XXS 32 CHANNEL ADSL2
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
XWAY HIGH-END SINGLE-CHIP ADSL2/
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |