Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC CODEC 2CH VOSLIC DTMF 44TQFP
|
paquet: 44-TQFP |
Stock112 500 |
|
PCM | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Maxim Integrated |
IC LIU 6PORT T3E3 484BGA
|
paquet: 484-BGA |
Stock5 808 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 16CH SH 484BGA
|
paquet: 484-LFBGA |
Stock5 952 |
|
E1, J1, T1 | 16 | 1.8V, 3.3V | - | 3.10W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-CABGA (19x19) |
||
Intersil |
IC SLIC ITU CO/PABX LP 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock7 488 |
|
- | 1 | 4.75 V ~ 5.25 V | - | 1.5W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC TXRX QUAD T1 3.3V 256-BGA
|
paquet: 256-BGA |
Stock7 248 |
|
T1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
NXP |
IC PHONE TONE RINGER 1KHZ 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock15 468 |
|
- | 1 | 5V | 20mA | 1W | -20°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Texas Instruments |
IC 1 LINE RING GEN CONTR 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock5 024 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC 1 LINE RING GEN CONTR 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock4 720 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock140 160 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
paquet: - |
Stock2 560 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC SLAC 1FXS/1FXO 1CH 48LQFP
|
paquet: - |
Stock134 580 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock3 088 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC SGL FXS ANLG 48-QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock7 904 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Solutions Sdn Bhd. |
16-PORT UNMANAGED SWITCH, I-TEMP
|
paquet: - |
Stock6 288 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Silicon Labs |
IC VOICE GLOBAL DAA PROGR 20QFN
|
paquet: 20-VFQFN Exposed Pad |
Stock7 908 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock4 048 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 512 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock6 816 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Analog Devices Inc./Maxim Integrated |
DS3252 DUAL DS3/E3/STS-1 LIU
|
paquet: - |
Request a Quote |
|
DS3, E3, STS-1 | 2 | 3.135V ~ 3.465V | 200mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA, CSPBGA | 144-TECSBGA (13x13) |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, PQCC28
|
paquet: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -16V ~ -100V, 4.75V ~ 5.25V | 5mA | 310 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Analog Devices Inc./Maxim Integrated |
IC INTEGRATED CIRCUIT
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4XGE L2+ MANAGED SWITCH
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
PCI-E GBE MAC/PHY PLUS TPM1.2 /
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
CS62180
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Agere Systems |
TFRA08C133 - OCTAL T1/E1 FRAMER
|
paquet: - |
Request a Quote |
|
E1, T1 | 8 | 3.14V ~ 3.47V | - | 1 W | -40°C ~ 85°C | Surface Mount | 352-BBGA | 352-PBGA (35x35) |
||
Harris Corporation |
5V LOW POWER DTMF RECEIVER
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Agere Systems |
LUC4AS01 - ATM SWITCH ELEMENT
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
VDSL 17A + 11AX WIFI INTEGRATED
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |