Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC MODULAR ISDN NT INTELL TQFP64
|
paquet: 64-LQFP |
Stock7 216 |
|
ISDN | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
paquet: 32-VQFN Exposed Pad |
Stock3 168 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC TXRX MAC/PHY 64-LQFP
|
paquet: 64-LQFP |
Stock4 544 |
|
SPI, UART | 1 | - | - | - | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock5 152 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC TXRX QUAD T1/E1/J1 256CSBGA
|
paquet: 256-LBGA, CSBGA |
Stock2 000 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 QUAD 256-CSBGA
|
paquet: 256-LBGA, CSBGA |
Stock3 312 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
paquet: 32-VQFN Exposed Pad |
Stock6 416 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
paquet: 256-BGA |
Stock5 872 |
|
- | 1 | 1.71 V ~ 1.89 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC VOICE LINE VCPNG 72CH 128TQFP
|
paquet: 128-TQFP |
Stock112 128 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microsemi Corporation |
IC CODEC U-LAW PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 512 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CODEC U-LAW CCITT PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 128 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock6 736 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DC-DC -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock4 848 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Solutions Sdn Bhd. |
MULTIRATE 11.5 GBPS QUAD RETIMER
|
paquet: - |
Stock7 984 |
|
2-Wire | 1 | 1.2V | - | - | - | Surface Mount | - | 48-QFN (5x9) |
||
Microsemi Solutions Sdn Bhd. |
PB-FREE DUAL-MEDIA OCTAL PHY
|
paquet: - |
Stock4 176 |
|
Ethernet | 1 | - | - | - | - | - | - | - |
||
Microsemi Solutions Sdn Bhd. |
X2 PCIE GEN 3 REDRIVER WITH CROS
|
paquet: - |
Stock8 676 |
|
- | 2 | 2.5V | - | - | - | Surface Mount | - | 32-QFN (5x5) |
||
Microsemi Corporation |
IC SIGNAL COND OCTAL 69-BGA
|
paquet: 69-FBGA |
Stock6 800 |
|
TTL/CMOS | 8 | 2.5V, 3.3V | - | 2.65W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Broadcom Limited |
MULTI LAYER SWITCH
|
paquet: - |
Stock2 192 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
TEMUX 168 PB FREE
|
paquet: - |
Stock7 168 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
paquet: - |
Stock5 568 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CNIC CIDCW CID 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 776 |
|
4-Wire | 1 | 2.7V ~ 5.5V | 2.8mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock8 988 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
paquet: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Intersil |
VOIP RINGING SLIC
|
paquet: - |
Request a Quote |
|
- | 1 | - | - | - | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Skyworks Solutions Inc. |
LINEAR IC'S
|
paquet: - |
Request a Quote |
|
GCI, PCM, SPI | 1 | 3.13V ~ 3.47V | 54mA | 1.4 W | - | Surface Mount | 47-VFQFN Exposed Pad | 47-QFN/LGA (6x8) |
||
Broadcom Limited |
16XGPON/16XEPON OLT, I-TEMP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | -40°C ~ 85°C | - | - | - |
||
Harris Corporation |
LOW COST 5 REN RINGING SLIC FOR
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Texas Instruments |
TELECOM CIRCUIT, 1-FUNC, BICMOS,
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |