Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microchip Technology |
IC TOUCH SENSOR PROX 8SOIC
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paquet: - |
Stock7 584 |
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- | - | - | - | - | Surface Mount | - | - |
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Allegro MicroSystems, LLC |
IC SMOKE DETECTOR ION 16DIP
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paquet: 16-DIP (0.300", 7.62mm) |
Stock57 120 |
|
Ionization | Voltage | - | 12µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
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Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
paquet: 32-WFQFN Exposed Pad, CSP |
Stock24 552 |
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Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
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|
Maxim Integrated |
IC TIME-TO-DGTL CONV W/AFE TQFP
|
paquet: 32-TQFP Exposed Pad |
Stock6 576 |
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- | - | 4-Wire SPI Serial | 100nA | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (5x5) |
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Maxim Integrated |
IC TIME-TO-DIGITAL CNVTR 32TQFN
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paquet: - |
Stock5 136 |
|
Logic | CMOS | SPI | 1µA | -40°C ~ 85°C | - | - | - |
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|
Maxim Integrated |
IC THRMOCPLE TO DIG CONV 10TDFN
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paquet: 10-WFDFN Exposed Pad |
Stock3 552 |
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Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
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|
NXP |
IC DSI INTERFACE 2CH 16SOIC
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paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock6 064 |
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Logic | Logic | SPI | 1mA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Diodes Incorporated |
PIR CONTROLLER SO-16
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paquet: - |
Stock6 320 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
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Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
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paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock7 744 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
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Microchip Technology |
IC SMOKE DETECTOR CMOS 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock5 648 |
|
Ionization | Voltage | - | 9µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 640 |
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Logic | Logic | Logic | 100nA | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
paquet: 32-WFQFN Exposed Pad, CSP |
Stock148 644 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
|
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Maxim Integrated |
IC SENSOR SIGNAL COND 16-SSOP
|
paquet: 16-SSOP (0.209", 5.30mm Width) |
Stock972 780 |
|
Analog | Analog | Serial | 2.5mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
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Texas Instruments |
IC PRESSURE SENSOR SC 36VQFN
|
paquet: 36-VFQFN Exposed Pad |
Stock6 576 |
|
- | - | 1-Wire?, SPI | 13.6mA | -40°C ~ 125°C | Surface Mount | 36-VFQFN Exposed Pad | 36-VQFN (6x6) |
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Analog Devices Inc. |
IC TRANSMITTER 4-20MA 16-SOIC
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paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock13 548 |
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Voltage | Voltage | - | 23mA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Analog Devices Inc. |
IC CAP CONV 1CH ULT LP 10MSOP
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock21 642 |
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Voltage | Digital | 2-Wire Serial | 70µA | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
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Maxim Integrated |
IC CTRLR KEY-SW I2C 24TQFN
|
paquet: 24-WFQFN Exposed Pad |
Stock25 974 |
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Logic | Logic | I2C, 2-Wire Serial | 50µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (3.5x3.5) |
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|
Maxim Integrated |
IC SENSOR INTERFACE VARI 10MSOP
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock9 072 |
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Differential | Logic | Differential | 5mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
|
|
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5 008 |
|
Differential | Analog | - | 250µA | 25°C ~ 100°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
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|
Analog Devices Inc. |
OPTICAL AFE FOR HEALTH MONITORIN
|
paquet: 16-UFBGA, WLCSP |
Stock4 992 |
|
Photodiode | I²C | - | 184µA | -40°C ~ 85°C | Surface Mount | 16-UFBGA, WLCSP | 16-WLCSP (2.46x1.4) |
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|
ams |
IC ULTRASONIC FLOW SENSOR 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock103 740 |
|
- | - | 4-Wire SPI Serial | 100nA | -40°C ~ 125°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN |
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Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
paquet: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
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Renesas Electronics Corporation |
RESISTIVE 2-CHANNEL SENSOR SIGNA
|
paquet: - |
Request a Quote |
|
Analog, Digital | I2C, SPI | - | 15 mA | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) |
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Renesas Electronics Corporation |
MSIG (MIXEDSIGNAL) RDC-IC 48LQFP
|
paquet: - |
Request a Quote |
|
Analog, Digital | Serial, SPI | - | 40 mA | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | 48-LFQFP (7x7) |
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Texas Instruments |
PROTOTYPE
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paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
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Microchip Technology |
IC THERMOCOUPLE
|
paquet: - |
Request a Quote |
|
Thermocouple | I2C | - | 300 µA | -40°C ~ 125°C (TA) | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
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Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
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Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
