Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock2 544 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
ON Semiconductor |
IC SENSOR DUAL VAR-RELUCT 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 888 |
|
Logic | Logic | Dual, Serial or Parallel | 5mA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
NXP |
IC DSI SLAVE FOR R-SENSE 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock97 692 |
|
Logic | Logic | 2 Line, I2C (CLK, Address/Data) | - | -40°C ~ 150°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Analog Devices Inc. |
IC THERMCPL SGNL COND ISOL 38DIP
|
paquet: 38-DIP (0.800", 20.32mm), 12 Leads |
Stock4 576 |
|
Voltage | Voltage | - | 12mA | -40°C ~ 85°C | Through Hole | 38-DIP (0.800", 20.32mm), 12 Leads | - |
|
|
Texas Instruments |
IC 4-20MA I-TRANSMITTER 14-SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock5 712 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
|
|
Diodes Incorporated |
PIR CONTROLLER SO-16
|
paquet: - |
Stock2 640 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
|
|
Diodes Incorporated |
PIR CONTROLLER PDIP-16
|
paquet: - |
Stock5 760 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
|
Microchip Technology |
IC SMOKE DETECTOR CMOS 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock4 864 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
ON Semiconductor |
IC PIR DETECTOR CTLR 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock7 840 |
|
Digital | Digital | CMOS | 50µA | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
|
|
Texas Instruments |
12-BIT CAPACITANCE-TO-DIGITAL CO
|
paquet: 12-WFDFN Exposed Pad |
Stock6 736 |
|
Capacitive | I2C | I2C | 2.1mA | -40°C ~ 125°C | Surface Mount | 12-WFDFN Exposed Pad | 12-WSON (4x4) |
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
paquet: 32-WFQFN Exposed Pad, CSP |
Stock256 068 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
|
|
Maxim Integrated |
IC OCTAL HIGH SPEED DGTL TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad |
Stock7 616 |
|
Digital | Digital | - | 1.6mA | -40°C ~ 125°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) Exposed Pad | 38-TSSOP-EP |
|
|
ams |
ULTRASONIC FLOW SENSOR 44TQFP
|
paquet: 44-LQFP |
Stock9 540 |
|
- | - | - | 1.5µA | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
|
|
Interlink Electronics |
ASSY, TAPE AND REEL, UPROC, USB
|
paquet: - |
Stock25 794 |
|
Analog | Digital | USB | 12mA | -40°C ~ 125°C | Panel Mount | - | - |
|
|
Texas Instruments |
IC AMP ADAPTIVE SENSOR 14-DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock10 572 |
|
Logic | Logic | - | 6mA | -40°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
|
|
Maxim Integrated |
IC THERMISTOR TO DGTL 8UMAX
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock14 952 |
|
Logic | Logic | 3-Wire SPI Serial | 29µA | -55°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
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|
ams |
TDC-GP21 1K VQFN32 LF T&R
|
paquet: 32-VFQFN Exposed Pad |
Stock4 736 |
|
- | - | 4-Wire SPI Serial | - | -40°C ~ 125°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
|
|
|
Azoteq (Pty) Ltd |
IC SENSOR PROX FUSION I2C 20QFN
|
paquet: - |
Request a Quote |
|
Capacitive | I2C | - | - | -40°C ~ 85°C (TA) | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN (3x3) |
|
|
|
Renesas Electronics Corporation |
IC INTERFACE
|
paquet: - |
Request a Quote |
|
Thermocouple | Digital | - | - | -40°C ~ 150°C | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
|
|
|
Texas Instruments |
ULTRASONIC SENSOR I/F FOR PARK A
|
paquet: - |
Stock16 809 |
|
Analog, Digital | SPI | - | 13 mA | -25°C ~ 105°C (TA) | Surface Mount | 20-WFQFN Exposed Pad | 20-QFN (4x4) |
|
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|
Analog Devices Inc. |
IC D/A CONV
|
paquet: - |
Request a Quote |
|
Voltage | - | - | 150 µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
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|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
ZSSC3230BI6B (WAFER UNSAWN, 725,
|
paquet: - |
Request a Quote |
|
Analog, Digital | I2C, Serial | - | 1.1 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
|
|
|
Renesas Electronics Corporation |
MSIG RDC-IC 48LQFP FULL CARTON
|
paquet: - |
Request a Quote |
|
Analog, Digital | Serial | - | 40 mA | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LFQFP (7x7) |
|
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 56-LFCSP
|
paquet: - |
Request a Quote |
|
Logic | Logic | - | 30 mA | -20°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad, CSP | 56-LFCSP-VQ (8x8) |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
paquet: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 18 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Wafer |
|
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|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
