Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
IC SENSOR ELECTRIC FIELD 54SOIC
|
paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3 552 |
|
Logic | Logic | ISO9141 | 7mA | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC W EP |
|
|
NXP |
IC SMOKE DETECT PHOTOELEC 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock2 100 |
|
Photoelectric | Voltage | - | 8µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
Analog Devices Inc. |
IC AMP DIFF SINGLE SUPPLY 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 832 |
|
Voltage | Analog | Differential | 200µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
ON Semiconductor |
IC SENSOR QUAD 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock3 776 |
|
- | - | Differential | 24mA | - | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
|
|
Texas Instruments |
IC 4-20MA 2WIRE TRANS 14-CDIP
|
paquet: 14-CDIP (0.300", 7.62mm) |
Stock5 600 |
|
Differential | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-CDIP (0.300", 7.62mm) | 14-CDIP |
|
|
Texas Instruments |
IC 4-20MA I-TRANSMITTER 14-DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock3 136 |
|
Differential | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
|
|
Maxim Integrated |
IC SENSOR SIGNAL COND 28-SSOP
|
paquet: 28-SSOP (0.209", 5.30mm Width) |
Stock15 600 |
|
Analog | Logic | SPI | 890µA | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
|
|
Exar Corporation |
SENSOR
|
paquet: 24-WFQFN Exposed Pad |
Stock6 752 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
|
|
Texas Instruments |
IC ADAPTIVE SENSE AMP 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock168 540 |
|
Logic | Logic | - | 6mA | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
|
|
Microchip Technology |
IC SENSOR FUSION HUB 28QFN
|
paquet: - |
Stock3 040 |
|
- | - | I2C | - | -40°C ~ 125°C | - | - | - |
|
|
|
Diodes Incorporated |
PIR CONTROLLER SO-16
|
paquet: - |
Stock36 000 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
|
Microchip Technology |
IC DRIVER HORN PIEZO W/BO 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 808 |
|
Voltage | Voltage | CMOS | 300µA | -10°C ~ 60°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Analog Devices Inc. |
IC PROCESSOR CCD 14BIT 48-LFCSP
|
paquet: 48-VFQFN Exposed Pad, CSP |
Stock67 332 |
|
Logic | Logic | 3-Wire Serial | 48mA | -25°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
|
|
Texas Instruments |
IC AFE PH SENSOR 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock16 620 |
|
- | - | - | 50µA | -40°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
|
|
Maxim Integrated |
IC CURR LOOP PROT 4-20MA 6TDFN
|
paquet: 6-WDFN Exposed Pad |
Stock54 486 |
|
4 ~ 20mA | 4 ~ 20mA | - | 40µA | -40°C ~ 125°C | Surface Mount | 6-WDFN Exposed Pad | 6-TDFN-EP (3x3) |
|
|
|
Analog Devices Inc. |
OPTICAL BIOMETRIC TRANS RED & IN
|
paquet: 12-LLGA |
Stock4 656 |
|
- | I²C | - | - | - | Surface Mount | 12-LLGA | 12-LGA-CAV (5x2.8) |
|
|
|
ams |
TDC-GP22 1K QFN32 LF T&R
|
paquet: 32-VFQFN Exposed Pad |
Stock7 120 |
|
- | - | 4-Wire SPI Serial | 100nA | -40°C ~ 125°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN |
|
|
|
Renesas Electronics Corporation |
SMART SENSOR -> BUMPED DIE
|
paquet: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | - | - | - |
|
|
|
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
Differential | I2C, Serial, SPI | - | 1.5 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
|
|
|
Renesas Electronics Corporation |
RESISTIVE SENSOR SIGNAL CONDITIO
|
paquet: - |
Stock2 271 |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 18 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Wafer |
|
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 96CSPBGA
|
paquet: - |
Request a Quote |
|
Logic | Logic | - | - | -25°C ~ 85°C | Surface Mount | 96-LFBGA, CSPBGA | 96-CSPBGA (8x8) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC THERMOCOUPLE
|
paquet: - |
Stock8 580 |
|
Thermocouple | I2C | - | 300 µA | -40°C ~ 125°C (TA) | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
|
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROC/GEN 64-CSPBGA
|
paquet: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 64-LFBGA, CSPBGA | 64-CSPBGA (9x9) |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
