Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AKM Semiconductor Inc. |
IC INTERFACE PRESS SENSOR 16UQFN
|
paquet: 16-UFQFN Exposed Pad |
Stock3 200 |
|
Analog Voltage | Analog Voltage | Serial | 2.85mA | -40°C ~ 105°C | Surface Mount | 16-UFQFN Exposed Pad | 16-UQFN (3x3) |
||
Maxim Integrated |
IC SIGNAL COND QUAD 68-QFN
|
paquet: 68-VFQFN Exposed Pad |
Stock5 136 |
|
CML | CML | LVTTL | 495mA | 0°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN Exposed Pad (10x10) |
||
ON Semiconductor |
IC TEMP MONITOR 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 568 |
|
Logic | Logic | 2-Wire SMBus | 4mA | -40°C ~ 120°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC AMP DIFF SINGLE SUPPLY 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 728 |
|
Voltage | Analog | Differential | 200µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC THERMOCOUP TO DGTL 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 880 |
|
Logic | Logic | 3-Wire SPI Serial | 2mA | 20°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 14-SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock19 008 |
|
Differential | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Semtech Corporation |
IC DAS ZOOM ADC 2INPUT 16MLPQ
|
paquet: 16-WQFN Exposed Pad |
Stock5 936 |
|
Differential | Digital | I2C | - | -40°C ~ 125°C | Surface Mount | 16-WQFN Exposed Pad | 16-MLPQ-EP (4x4) |
||
Intersil |
IC SENSOR ENGINE KNOCK 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock75 696 |
|
Logic | Logic | SPI | 8mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC SENSOR SIGNAL COND 20QFN
|
paquet: 20-VFQFN Exposed Pad |
Stock6 912 |
|
- | - | - | 6mA | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
IC PHOTOELECTR SMOKE DET 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock173 820 |
|
Photoelectric | Voltage | - | 1µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Diodes Incorporated |
PIR CONTROLLER SO-16
|
paquet: - |
Stock5 936 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock6 816 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
SII Semiconductor Corporation |
PHOTOCURRENT DETECTION IC
|
paquet: SC-74A, SOT-753 |
Stock5 824 |
|
Analog Current | Logic | - | 10nA | -40°C ~ 85°C | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Diodes Incorporated |
PIR CONTROLLER SO-16
|
paquet: - |
Stock4 768 |
|
- | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC TOUCH SENSOR CAP 4CH 16SOIC
|
paquet: 16-WFQFN Exposed Pad |
Stock5 024 |
|
- | - | I2C | 173µA | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Melexis Technologies NV |
IC SENSOR PROG INTERFACE 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock6 128 |
|
Analog, Digital | Analog, Digital | - | 2.1mA | -40°C ~ 140°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC SENSOR SIGNAL COND 20HTSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Stock7 104 |
|
- | - | - | 6mA | -40°C ~ 125°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-HTSSOP |
||
Texas Instruments |
IC 4-20MA TRANSMITTER 14-SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock4 480 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
Texas Instruments |
IC TWO-WIRE TRANSMITTER 14 DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock15 552 |
|
Differential | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Texas Instruments |
AUTOMOTIVE ULTRASONIC SIGNAL PRO
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock7 044 |
|
- | - | UART/USART | 500µA | -40°C ~ 105°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
Analog | 1-Wire®, I2C | - | 7 mA | -40°C ~ 150°C (TA) | Surface Mount | Die | Die |
||
Analog Devices Inc./Maxim Integrated |
LOW-COST PRECISION SENSOR SIGNAL
|
paquet: - |
Request a Quote |
|
Analog | Digital, Serial | - | 2.5 mA | -40°C ~ 125°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 12BIT 48-LQFP
|
paquet: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Azoteq (Pty) Ltd |
TOUCH CONTROLLER
|
paquet: - |
Stock10 149 |
|
Capacitive, Inductive | I2C | - | - | -40°C ~ 85°C (TA) | Surface Mount | 16-UFBGA, WLCSP | 16-WLCSP (1.62x1.62) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Microchip Technology |
ION COMP, LOW CURRENT
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |