Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Multiplexer/Demultiplexer Circuit | Switch Circuit | Number of Channels | On-State Resistance (Max) | Voltage - Supply, Single (V+) | Voltage - Supply, Dual (V±) | -3db Bandwidth | Features | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Solutions Sdn Bhd. |
IC CROSSPOINT SW 12X12 196-FCBGA
|
paquet: 196-FCBGA |
Stock3 504 |
|
12:12 | - | 1 | - | 2.5V | - | - | - | - | 196-FCBGA | 196-FCBGA (15x15) |
||
Analog Devices Inc. |
IC VIDEO SWITCH SPST SOT23-6
|
paquet: SOT-23-6 |
Stock4 176 |
|
1:1 | SPST | 1 | 35 Ohm | 1.8 V ~ 5.5 V | - | 180MHz | T-Switch Configuration | -40°C ~ 85°C (TA) | SOT-23-6 | SOT-23-6 |
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IDT, Integrated Device Technology Inc |
IC SWITCH FABRIC 241-FCBGA
|
paquet: 241-BBGA, FCBGA |
Stock3 296 |
|
- | - | - | - | - | - | - | - | - | 241-BBGA, FCBGA | 241-FCBGA (40x40) |
||
Intersil |
IC USB SWITCH DUAL SPDT 10UTQFN
|
paquet: 10-UFQFN |
Stock3 840 |
|
2:1 | SPDT | 2 | 2.8 Ohm (Audio), 6.5 Ohm (USB) | 2.5 V ~ 5.5 V | - | 736MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (2.1x1.6) |
||
Fairchild/ON Semiconductor |
IC SWITCH DP3T 14DQFN
|
paquet: 14-WFQFN Exposed Pad |
Stock5 808 |
|
- | DP3T | 1 | 900 mOhm | 2.7 V ~ 5.5 V | - | 90MHz | Break-Before-Make | -40°C ~ 85°C (TA) | 14-WFQFN Exposed Pad | 14-DQFN (3x2.5) |
||
Maxim Integrated |
IC RF/VIDEO MUX DUAL 4CH 28-SSOP
|
paquet: 28-SSOP (0.209", 5.30mm Width) |
Stock3 088 |
|
4:1 | - | 2 | 60 Ohm | 2.7 V ~ 12 V | ±2.7 V ~ 6 V | 180MHz | Break-Before-Make, SPI, T-Switch Configration | 0°C ~ 70°C (TA) | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Maxim Integrated |
IC VIDEO CROSSPOINT SWIT 144TQFP
|
paquet: 144-TQFP |
Stock4 272 |
|
32:16 | - | 1 | - | 4.5 V ~ 5.5 V | ±3 V ~ 5 V | 70MHz | Buffered, SPI | -40°C ~ 85°C (TA) | 144-TQFP | 144-TQFP (20x20) |
||
Texas Instruments |
IC CROSSPOINT SWITCH 16X8 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock3 104 |
|
16:8 | - | 1 | - | - | ±3 V ~ 5.5 V | 550MHz | Buffered | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
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Broadcom Limited |
IC PCI EXPRESS SWITCH 1156FCBGA
|
paquet: - |
Stock4 624 |
|
- | - | - | - | - | - | - | Configurable | - | - | - |
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Maxim Integrated |
IC SWITCH 2:2 DUAL GRAPH 40TQFN
|
paquet: 40-WFQFN Exposed Pad |
Stock107 580 |
|
2:2 | - | 1 | 8 Ohm | 4.5 V ~ 5.5 V | - | 700MHz | Buffered, RGB | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN-EP (5x5) |
||
Maxim Integrated |
IC AUDIO/VIDEO SWITCH 10UMAX
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock6 576 |
|
1:1, 2:1 | SPST, SPDT | 1 | 65 Ohm | 2.7 V ~ 5.5 V | - | 300MHz | - | -40°C ~ 85°C (TA) | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Rohm Semiconductor |
IC VIDEO SIGNAL SWITCHERS 16SOP
|
paquet: 16-SOIC (0.173", 4.40mm Width) |
Stock158 040 |
|
2:1 | - | 3 | - | 4.5 V ~ 5.5 V | - | - | - | -40°C ~ 85°C (TA) | 16-SOIC (0.173", 4.40mm Width) | 16-SOP |
||
Diodes Incorporated |
IC MUX/DEMUX 2:1 3.3V 20TQFN
|
paquet: - |
Stock4 032 |
|
2:1 | - | 2 | - | 3 V ~ 3.6 V | - | 8.1GHz | Bi-Directional, SATA, USB 3.0 | -40°C ~ 85°C (TA) | - | - |
||
Texas Instruments |
AUTONOMOUS AUDIO HEADSET SWITCH
|
paquet: 16-WFQFN Exposed Pad |
Stock5 872 |
|
- | - | - | - | - | - | - | - | - | 16-WFQFN Exposed Pad | 16-WQFN (3x3) |
||
Broadcom Limited |
IC PCI EXPRESS SWITCH
|
paquet: - |
Stock6 756 |
|
- | - | - | - | - | - | - | Configurable | - | - | 676-FCBGA (27x27) |
||
NXP |
IC MUX/DEMUX 2:1 PCI 20DHVQFN
|
paquet: 20-VFQFN Exposed Pad |
Stock3 840 |
|
2:1 | - | 2 | 6 Ohm (Typ) | 3 V ~ 3.6 V | - | 10GHz | Bi-Directional, SATA | -40°C ~ 85°C (TA) | 20-VFQFN Exposed Pad | 20-DHVQFN (4.5x 2.5) |
||
Broadcom Limited |
IC PCI EXPRESS SWITCH
|
paquet: - |
Stock5 648 |
|
- | - | - | - | - | - | - | Configurable | - | - | 324-FCBGA (19x19) |
||
Texas Instruments |
IC ETHERNET SWITCH QUAD 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock23 460 |
|
2:1 | SPDT | 4 | 8 Ohm | 3 V ~ 3.6 V | - | 500MHz | 10/100 Base-T | -40°C ~ 85°C (TA) | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Maxim Integrated |
IC VIDEO SWITCH QUAD SPST 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock9 612 |
|
1:1 | SPST | 4 | 20 Ohm | 2.7 V ~ 12 V | ±2.7 V ~ 6 V | 300MHz | Bi-Directional, T-Switch Configuration | 0°C ~ 70°C (TA) | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC SWITCH ETHER GIGABIT 364-BGA
|
paquet: 364-BGA |
Stock12 228 |
|
- | - | - | - | 3.3V | - | - | - | - | 364-BGA | 364-BGA (23x23) |
||
Renesas Electronics America |
IC USB SWITCH DUAL SP3T 12TQFN
|
paquet: 12-WFQFN Exposed Pad |
Stock4 384 |
|
3:1 | SP3T | 2 | 2.8 Ohm (Audio), 8 Ohm (USB) | 2.7 V ~ 4.6 V | - | 700MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 12-WFQFN Exposed Pad | 12-TQFN (3x3) |
||
Texas Instruments |
TS5USBC400
|
paquet: 12-XFBGA, DSBGA |
Stock4 800 |
|
2:1, 1:2 | - | 2 | 9 Ohm | 2.3 V ~ 5.5 V | - | 1.1GHz | Bi-Directional | 0°C ~ 70°C | 12-XFBGA, DSBGA | 12-DSBGA |
||
Renesas Electronics America |
IC USB SWITCH SP3T DUAL 12TQFN
|
paquet: 12-WFQFN Exposed Pad |
Stock14 616 |
|
3:1 | SP3T | 2 | 15 Ohm | 2.7 V ~ 4.6 V | - | 800MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 12-WFQFN Exposed Pad | 12-TQFN (3x3) |
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Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock3 200 |
|
- | - | - | - | - | - | - | - | - | - | - |
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Diodes Incorporated |
PCIE SWITCH V-QFN3590-42
|
paquet: - |
Stock4 176 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Gennum |
CROSS POINT SWITCH, BIPOLAR
|
paquet: - |
Request a Quote |
|
1:1 | SPST | 1 | - | - | ±4.5V ~ 5.5V | 300MHz | - | 0°C ~ 70°C (TA) | 8-DIP | 8-PDIP |
||
Broadcom Limited |
IC PCI EXPRESS SWITCH
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
MULTIPLEXER
|
paquet: - |
Stock13 632 |
|
2:1, 1:2 | SPDT | 2 | 8Ohm | 2.7V ~ 3.6V | ±2.7V ~ 3.6V | 8GHz | USB 3.1 | -40°C ~ 105°C (TA) | 20-VFQFN Exposed Pad | 20-VQFN (2.5x4.5) |