Page 229 - Embarqué - Microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqué - Microprocesseurs

Dossiers 8 238
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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
hot P1022PSE2HFA
NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock5 904
2 Core, 32-Bit
1.067GHz
Security; SEC
DDR2, DDR3
No
LCD
10/100/1000 Mbps (2)
SATA 3Gbps (2)
USB 2.0 + PHY (2)
-
0°C ~ 105°C (TA)
Cryptography, Random Number Generator
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
MPC8543PXAQGB
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock7 440
1 Core, 32-Bit
1.0GHz
Signal Processing; SPE
DDR, DDR2, SDRAM
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
IDT79RC32V333-100DH
IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 100MHZ 208QFP

  • Core Processor: MIPS-II
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 100MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 560
1 Core, 32-Bit
100MHz
-
SDRAM
No
-
-
-
-
3.3V
0°C ~ 70°C (TA)
-
208-BFQFP
208-PQFP (28x28)
IDT79RC32T333-133DHI
IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 133MHZ 208QFP

  • Core Processor: MIPS-II
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 133MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock2 720
1 Core, 32-Bit
133MHz
-
SDRAM
No
-
-
-
-
2.5V, 3.3V
-40°C ~ 85°C (TA)
-
208-BFQFP
208-PQFP (28x28)
79RC32H435-350BCI
IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 350MHZ 256BGA

  • Core Processor: MIPS32
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 350MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-CABGA (17x17)
paquet: 256-LBGA
Stock2 320
1 Core, 32-Bit
350MHz
-
DDR
No
-
10/100 Mbps (1)
-
-
3.3V
-40°C ~ 85°C (TA)
-
256-LBGA
256-CABGA (17x17)
IDT79R3041-20PFG8
IDT, Integrated Device Technology Inc

IC MPU MIPS-I 20MHZ 100TQFP

  • Core Processor: MIPS-I
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: System Control; CP0
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-LQFP
Stock3 280
1 Core, 32-Bit
20MHz
System Control; CP0
DRAM
No
-
-
-
-
5.0V
0°C ~ 85°C (TC)
-
100-LQFP
100-TQFP (14x14)
KMPC8349ZUAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
paquet: 672-LBGA
Stock5 120
1 Core, 32-Bit
533MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
672-LBGA
672-TBGA (35x35)
KMPC8323ECVRADDC
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock7 232
1 Core, 32-Bit
266MHz
Communications; QUICC Engine, Security; SEC 2.2
DDR, DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
Cryptography
516-BBGA
516-FPBGA (27x27)
hot MPC8548EHXAUJ
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock23 652
1 Core, 32-Bit
1.333GHz
Signal Processing; SPE, Security; SEC
DDR, DDR2, SDRAM
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Cryptography, Random Number Generator
783-BBGA, FCBGA
783-FCPBGA (29x29)
MPC8360EVVAGDG
NXP

IC MPU MPC83XX 400MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
paquet: 740-LBGA
Stock2 704
1 Core, 32-Bit
400MHz
Communications; QUICC Engine, Security; SEC
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Cryptography, Random Number Generator
740-LBGA
740-TBGA (37.5x37.5)
hot EP7309-CVZ
Cirrus Logic Inc.

IC MPU EP7 74MHZ 208LQFP

  • Core Processor: ARM7TDMI
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 74MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD, Touchscreen
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: Hardware ID
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-LQFP
paquet: 208-LQFP
Stock17 088
1 Core, 32-Bit
74MHz
-
-
No
Keypad, LCD, Touchscreen
-
-
-
2.5V, 2.7V, 3.0V, 3.3V
0°C ~ 70°C (TA)
Hardware ID
208-LQFP
208-LQFP
hot XPC8260CZUIHBC
NXP

IC MPU MPC82XX 200MHZ 408TBGA

  • Core Processor: PowerPC G2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
paquet: 480-LBGA
Stock6 160
1 Core, 32-Bit
200MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
-
3.3V
-40°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
KMPC853TVR66A
NXP

IC MPU MPC8XX 166MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 166MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
paquet: 256-BBGA
Stock3 936
1 Core, 32-Bit
166MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
-
3.3V
0°C ~ 95°C (TA)
-
256-BBGA
256-PBGA (23x23)
KMPC8280CZUUPEA
NXP

IC MPU MPC82XX 450MHZ 408TBGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 450MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
paquet: 480-LBGA
Stock4 432
1 Core, 32-Bit
450MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
-40°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
MPC8247CVRPIEA
NXP

IC MPU MPC82XX 300MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock3 456
1 Core, 32-Bit
300MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (2)
-
USB 2.0 (1)
3.3V
-40°C ~ 105°C (TA)
-
516-BBGA
516-FPBGA (27x27)
MPC859DSLZP66A
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock5 920
1 Core, 32-Bit
66MHz
Communications; CPM
DRAM
No
-
10 Mbps (1), 10/100 Mbps (1)
-
-
3.3V
0°C ~ 95°C (TA)
-
357-BBGA
357-PBGA (25x25)
96MP2DD-3FB-6M7T1
Advantech Corp

CORE2 DUO DT 3.0G 13F 6M

  • Core Processor: Core2 DUO DT E8400
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 3.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 928
2 Core, 64-Bit
3.0GHz
-
-
-
-
-
-
-
-
-
-
-
-
hot MPC8541PXAPF
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 833MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock9 432
1 Core, 32-Bit
833MHz
-
DDR, SDRAM
No
-
10/100/1000 Mbps (2)
-
-
2.5V, 3.3V
0°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
hot P2020NSN2KFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock10 908
2 Core, 32-Bit
1.2GHz
-
DDR2, DDR3
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
-
0°C ~ 125°C (TA)
-
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
hot MC7448HX600ND
NXP

IC MPU MPC74XX 600MHZ 360FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 600MHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
paquet: 360-BCBGA, FCCBGA
Stock6 480
1 Core, 32-Bit
600MHz
Multimedia; SIMD
-
No
-
-
-
-
1.5V, 1.8V, 2.5V
0°C ~ 105°C (TA)
-
360-BCBGA, FCCBGA
360-FCCBGA (25x25)
OMAP3515ECUS72
Texas Instruments

IC MPU OMAP-35XX 720MHZ 423FCBGA

  • Core Processor: ARM? Cortex?-A8
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 720MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (3), USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Security Features: -
  • Package / Case: 423-LFBGA, FCBGA
  • Supplier Device Package: 423-FCBGA (16x16)
paquet: 423-LFBGA, FCBGA
Stock6 256
1 Core, 32-Bit
720MHz
Multimedia; NEON? SIMD
LPDDR
Yes
LCD
-
-
USB 1.x (3), USB 2.0 (1)
1.8V, 3.0V
0°C ~ 90°C (TJ)
-
423-LFBGA, FCBGA
423-FCBGA (16x16)
OMAPL138EZWTA4
Texas Instruments

IC MPU OMAP-L1X 375MHZ 361NFBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 456MHz
  • Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: Boot Security, Cryptography
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-NFBGA (16x16)
paquet: 361-LFBGA
Stock4 704
1 Core, 32-Bit
456MHz
Signal Processing; C674x, System Control; CP15
SDRAM
No
LCD
10/100 Mbps (1)
SATA 3Gbps (1)
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
1.8V, 3.3V
-40°C ~ 105°C (TJ)
Boot Security, Cryptography
361-LFBGA
361-NFBGA (16x16)
MCIMX6X3EVO10AC
NXP

I.MX 6SX ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 200MHz, 1GHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock4 512
2 Core, 32-Bit
200MHz, 1GHz
Multimedia; NEON™ MPE
LPDDR2, LVDDR3, DDR3
Yes
Keypad, LCD
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
1.8V, 2.5V, 2.8V, 3.15V
-20°C ~ 105°C (TJ)
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
400-LFBGA
400-MAPBGA (17x17)
MIMXRT1052CVL5A
NXP

I.MXRT1050

  • Core Processor: ARM® Cortex®-M7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
  • Package / Case: 196-LFBGA
  • Supplier Device Package: 196-MAPBGA (10x10)
paquet: 196-LFBGA
Stock7 344
1 Core, 32-Bit
528MHz
-
SDRAM
Yes
LCD
10/100 Mbps (1)
-
USB 2.0 OTG + PHY (2)
1.8V, 2.8V, 3.3V
-40°C ~ 105°C (TJ)
BEE, DCP, HAB, SJC, SNVS, TRNG
196-LFBGA
196-MAPBGA (10x10)
TCI6630K2LXCMSA2T
Texas Instruments

PROTOTYPE

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
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AGXD500AAXE0TC
Advanced Micro Devices

IC MPU 366MHZ 368EBGA

  • Core Processor: AMD Geode™ GX
  • Number of Cores/Bus Width: 1 Core
  • Speed: 366MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: TFT, VGA
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 368-BGA
  • Supplier Device Package: 368-EBGA (35x35)
paquet: -
Request a Quote
1 Core
366MHz
-
DDR
Yes
TFT, VGA
-
-
-
3.3V
0°C ~ 85°C (TC)
-
368-BGA
368-EBGA (35x35)
RH80532NC049256
Intel

IC MPU MOBILE CEL 2.2GHZ 478PPGA

  • Core Processor: Mobile Intel® Celeron®
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 2.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.3V
  • Operating Temperature: 100°C (TJ)
  • Security Features: -
  • Package / Case: 478-PGA
  • Supplier Device Package: 478-PPGA (31x31)
paquet: -
Request a Quote
1 Core, 32-Bit
2.2GHz
-
-
-
-
-
-
-
1.3V
100°C (TJ)
-
478-PGA
478-PPGA (31x31)
CP80C86-2S2580
Intersil

CMOS 16-BIT MICROPROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
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