Page 179 - Embarqué - Microprocesseurs | Circuits intégrés (CI)

LS101MAXE7DFA

NXP

IC PROCESSOR DUAL CORE

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 650MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 448-FBGA Exposed Pad
Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

paquet: 448-FBGA Exposed Pad

Stock4 384

1 Core, 32-Bit

650MHz

-

DDR2

No

-

GbE (2)

-

USB 2.0 + PHY (1)

-

-40°C ~ 85°C (TA)

-

448-FBGA Exposed Pad

448-PBGA w/Heat Spreader (23x23)

PPC8309VMADDCA

NXP

IC MPU MPC83XX 266MHZ 369BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 369-LFBGA
Supplier Device Package: 369-PBGA (19x19)

paquet: 369-LFBGA

Stock7 184

1 Core, 32-Bit

266MHz

Communications; QUICC Engine

DDR2

No

-

10/100 Mbps (3)

-

USB 2.0 (1)

1.8V, 3.3V

0°C ~ 105°C (TA)

-

369-LFBGA

369-PBGA (19x19)

MC8641DVU1000NE

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

paquet: 1023-BCBGA, FCCBGA

Stock5 648

2 Core, 32-Bit

1.0GHz

-

DDR, DDR2

No

-

10/100/1000 Mbps (4)

-

1.8V, 2.5V, 3.3V

0°C ~ 105°C (TA)

-

1023-BCBGA, FCCBGA

1023-FCCBGA (33x33)

MC8641DTVU1000GE

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

paquet: 1023-BCBGA, FCCBGA

Stock3 808

2 Core, 32-Bit

1.0GHz

-

DDR, DDR2

No

-

10/100/1000 Mbps (4)

-

1.8V, 2.5V, 3.3V

-40°C ~ 105°C (TA)

-

1023-BCBGA, FCCBGA

1023-FCCBGA (33x33)

MPC8379VRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock3 936

1 Core, 32-Bit

667MHz

-

DDR, DDR2

No

-

10/100/1000 Mbps (2)

SATA 3Gbps (4)

USB 2.0 + PHY (1)

1.8V, 2.5V, 3.3V

0°C ~ 125°C (TA)

-

689-BBGA Exposed Pad

689-TEPBGA II (31x31)

79RC32H434-350BC

IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 350MHZ 256BGA

Core Processor: MIPS32
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 350MHz
Co-Processors/DSP: -
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 256-LBGA
Supplier Device Package: 256-CABGA (17x17)

paquet: 256-LBGA

Stock7 920

1 Core, 32-Bit

350MHz

-

DDR

No

-

10/100 Mbps (1)

-

3.3V

0°C ~ 70°C (TA)

-

256-LBGA

256-CABGA (17x17)

IDT79R3041-33PF8

IDT, Integrated Device Technology Inc

IC MPU MIPS-I 33MHZ 100TQFP

Core Processor: MIPS-I
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: System Control; CP0
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 85°C (TC)
Security Features: -
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

paquet: 100-LQFP

Stock4 160

1 Core, 32-Bit

33MHz

System Control; CP0

DRAM

No

-

5.0V

0°C ~ 85°C (TC)

-

100-LQFP

100-TQFP (14x14)

KMC8358CVVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

paquet: 740-LBGA

Stock5 392

1 Core, 32-Bit

400MHz

Communications; QUICC Engine

DDR, DDR2

No

-

10/100/1000 Mbps (1)

-

USB 1.x (1)

1.8V, 2.5V, 3.3V

-40°C ~ 105°C (TA)

-

740-LBGA

740-TBGA (37.5x37.5)

XPC850DEZT50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BGA
Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BGA

Stock43 344

1 Core, 32-Bit

50MHz

Communications; CPM

DRAM

No

-

10 Mbps (1)

-

USB 1.x (1)

3.3V

0°C ~ 95°C (TA)

-

256-BGA

256-PBGA (23x23)

KMPC8275ZQMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

Stock3 232

1 Core, 32-Bit

266MHz

Communications; RISC CPM

DRAM, SDRAM

No

-

10/100 Mbps (3)

-

USB 2.0 (1)

3.3V

0°C ~ 105°C (TA)

-

516-BBGA

516-FPBGA (27x27)

KM68LC302AF20VCT

NXP

IC MPU M683XX 20MHZ 100LQFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 20MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

Stock7 168

1 Core, 8/16-Bit

20MHz

Communications; RISC CPM

DRAM

No

-

3.3V

0°C ~ 70°C (TA)

-

100-LQFP

100-LQFP (14x14)

MC68MH360AI33L

NXP

IC MPU M683XX 33MHZ 240FQFP

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 240-BFQFP
Supplier Device Package: 240-FQFP (32x32)

paquet: 240-BFQFP

Stock4 528

1 Core, 32-Bit

33MHz

Communications; CPM

DRAM

No

-

10 Mbps (1)

-

5.0V

0°C ~ 70°C (TA)

-

240-BFQFP

240-FQFP (32x32)

MPC8540VTAQFC

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 784-BBGA, FCBGA

Stock5 936

1 Core, 32-Bit

1.0GHz

-

DDR, SDRAM

No

-

10/100 Mbps (1), 10/100/1000 Mbps (2)

-

2.5V, 3.3V

0°C ~ 105°C (TA)

-

784-BBGA, FCBGA

783-FCPBGA (29x29)

P2041NSN7MMC

NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

paquet: 780-BBGA, FCBGA

Stock6 480

4 Core, 32-Bit

1.2GHz

-

DDR3, DDR3L

No

-

10/100/1000 Mbps (5), 10 Gbps (1)

SATA 3Gbps (2)

USB 2.0 + PHY (2)

1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V

0°C ~ 105°C (TA)

-

780-BBGA, FCBGA

780-FCPBGA (23x23)

MPC860DPVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock5 136

1 Core, 32-Bit

66MHz

Communications; CPM

DRAM

No

-

10 Mbps (2), 10/100 Mbps (1)

-

3.3V

0°C ~ 95°C (TA)

-

357-BBGA

357-PBGA (25x25)

MPC8313ZQAGDC

NXP

IC MPU MPC83XX 400MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

Stock3 840

1 Core, 32-Bit

400MHz

-

DDR, DDR2

No

-

10/100/1000 Mbps (2)

-

USB 2.0 + PHY (1)

1.8V, 2.5V, 3.3V

0°C ~ 105°C (TA)

-

516-BBGA Exposed Pad

516-TEPBGA (27x27)

GCIXP1250BC

Intel

IC MPU STRONGARM 232MHZ 520BGA

Core Processor: StrongARM
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 232MHz
Co-Processors/DSP: Data; Microengine
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 520-LFBGA
Supplier Device Package: 520-HL-PBGA (40x40)

paquet: 520-LFBGA

Stock7 680

1 Core, 32-Bit

232MHz

Data; Microengine

SDRAM

No

-

3.3V

0°C ~ 70°C (TA)

-

520-LFBGA

520-HL-PBGA (40x40)

MPC8280VVUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 450MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

paquet: 480-LBGA

Stock6 304

1 Core, 32-Bit

450MHz

Communications; RISC CPM

DRAM, SDRAM

No

-

10/100 Mbps (3)

-

USB 2.0 (1)

3.3V

0°C ~ 105°C (TA)

-

480-LBGA

408-TBGA (37.5x37.5)

Z8018006FSG

Zilog

IC MPU Z180 6MHZ 80QFP

Core Processor: Z80180
Number of Cores/Bus Width: 1 Core, 8-Bit
Speed: 6MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 80-BQFP
Supplier Device Package: 80-QFP

paquet: 80-BQFP

Stock6 160

1 Core, 8-Bit

6MHz

-

DRAM

No

-

5.0V

0°C ~ 70°C (TA)

-

80-BQFP

80-QFP

96MPXE-2.1-16M36

Advantech Corp

XEON 2.1G 16.5M 3647P 12C 4116 7

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock4 976

-

MIMXRT1051CVL5B

NXP

I.MXRT1050 A1

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

paquet: 196-LFBGA

Stock15 264

1 Core, 32-Bit

528MHz

-

SDRAM

Yes

LCD

10/100 Mbps (1)

-

USB 2.0 OTG + PHY (2)

1.8V, 2.8V, 3.3V

-40°C ~ 105°C (TJ)

BEE, DCP, HAB, SJC, SNVS, TRNG

196-LFBGA

196-MAPBGA (10x10)

STM32MP157CAB3

STMicroelectronics

MPU WITH ARM DUAL CORTEX-A7 650

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock6 192

-

STM32MP151CAB3

STMicroelectronics

MPU WITH ARM CORTEX-A7 650 MHZ,

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock7 680

-

S32G399ASCK1VUCR

NXP

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

Request a Quote

4 Core, 64-Bit/8 Core, 32-Bit

400MHz, 1.3GHz

Multimedia; NEON

DDR3L SDRAM, LPDDR4 DRAM

No

-

2.5Gbps (3)

-

USB 2.0 OTG (1)

1.8V, 3.3V

-40°C ~ 105°C (TA)

ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC

525-FBGA, FCBGA

525-FCPBGA (19x19)

HD64413ASFV

Renesas Electronics Corporation

GRAPHICS PROCESSOR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Request a Quote

-

R9A07G075M22GBA-AC0

Renesas Electronics Corporation

IC MPU RZ/T2M 600/800MHZ 225FBGA

Core Processor: ARM® Cortex®-R52
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 600MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-FBGA (13x13)

paquet: -

Stock324

2 Core, 32-Bit

600MHz, 800MHz

Multimedia; NEON™ SIMD

-

No

-

10/100/1000Mbps (2)

-

USB 2.0 (1)

1.8V, 3.3V

-40°C ~ 125°C (TJ)

-

225-LFBGA

225-FBGA (13x13)

R9A07G044C26GBG-AC0

Renesas Electronics Corporation

IC MPU RZ 200MHZ/1.2GHZ 361BGA

Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width: 3 Core, 64-Bit
Speed: 200MHz, 1.2GHz
Co-Processors/DSP: ARM® Mali-G31
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI/CSI, MIPI/DSI
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Package / Case: 361-LFBGA
Supplier Device Package: 361-BGA (13x13)

paquet: -

Stock288

3 Core, 64-Bit

200MHz, 1.2GHz

ARM® Mali-G31

DDR3L, DDR4

No

MIPI/CSI, MIPI/DSI

10/100/1000Mbps (2)

-

USB 2.0 (2)

1.8V, 3.3V

-40°C ~ 85°C (TA)

AES, RSA, SHA-1, SHA-224, SHA-256, TRNG

361-LFBGA

361-BGA (13x13)

LX2120SE71826B

NXP

IC MPU QORLQ 1.8GHZ 1517FCPBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 12 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 100Gbps (2)
SATA: SATA 3.0 (4)
USB: USB 3.0 (2) + PHY (2)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Operating Temperature: 0°C ~ 105°C (TJ)
Security Features: Secure Boot, TrustZone®
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

paquet: -

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12 Core, 64-Bit

1.8GHz

-

DDR4

Yes

-

100Gbps (2)

SATA 3.0 (4)

USB 3.0 (2) + PHY (2)

1.2V, 1.8V, 3.3V

0°C ~ 105°C (TJ)

Secure Boot, TrustZone®

1517-BBGA, FCBGA

1517-FCPBGA (40x40)

Référence	Fabricant	Description	paquet	Stock	Number of Cores/Bus Width	Speed	Co-Processors/DSP	RAM Controllers	Graphics Acceleration	Display & Interface Controllers	Ethernet	SATA	USB	Voltage - I/O	Operating Temperature	Security Features	Package / Case	Supplier Device Package
LS101MAXE7DFA	NXP	IC PROCESSOR DUAL CORE Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)	paquet: 448-FBGA Exposed Pad	Stock4 384	1 Core, 32-Bit	650MHz	-	DDR2	No	-	GbE (2)	-	USB 2.0 + PHY (1)	-	-40°C ~ 85°C (TA)	-	448-FBGA Exposed Pad	448-PBGA w/Heat Spreader (23x23)
PPC8309VMADDCA	NXP	IC MPU MPC83XX 266MHZ 369BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19x19)	paquet: 369-LFBGA	Stock7 184	1 Core, 32-Bit	266MHz	Communications; QUICC Engine	DDR2	No	-	10/100 Mbps (3)	-	USB 2.0 (1)	1.8V, 3.3V	0°C ~ 105°C (TA)	-	369-LFBGA	369-PBGA (19x19)
MC8641DVU1000NE	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	paquet: 1023-BCBGA, FCCBGA	Stock5 648	2 Core, 32-Bit	1.0GHz	-	DDR, DDR2	No	-	10/100/1000 Mbps (4)	-	-	1.8V, 2.5V, 3.3V	0°C ~ 105°C (TA)	-	1023-BCBGA, FCCBGA	1023-FCCBGA (33x33)
MC8641DTVU1000GE	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	paquet: 1023-BCBGA, FCCBGA	Stock3 808	2 Core, 32-Bit	1.0GHz	-	DDR, DDR2	No	-	10/100/1000 Mbps (4)	-	-	1.8V, 2.5V, 3.3V	-40°C ~ 105°C (TA)	-	1023-BCBGA, FCCBGA	1023-FCCBGA (33x33)
MPC8379VRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock3 936	1 Core, 32-Bit	667MHz	-	DDR, DDR2	No	-	10/100/1000 Mbps (2)	SATA 3Gbps (4)	USB 2.0 + PHY (1)	1.8V, 2.5V, 3.3V	0°C ~ 125°C (TA)	-	689-BBGA Exposed Pad	689-TEPBGA II (31x31)
79RC32H434-350BC	IDT, Integrated Device Technology Inc	IC MPU INTERPRISE 350MHZ 256BGA Core Processor: MIPS32 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 256-LBGA Supplier Device Package: 256-CABGA (17x17)	paquet: 256-LBGA	Stock7 920	1 Core, 32-Bit	350MHz	-	DDR	No	-	10/100 Mbps (1)	-	-	3.3V	0°C ~ 70°C (TA)	-	256-LBGA	256-CABGA (17x17)
IDT79R3041-33PF8	IDT, Integrated Device Technology Inc	IC MPU MIPS-I 33MHZ 100TQFP Core Processor: MIPS-I Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: System Control; CP0 RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 85°C (TC) Security Features: - Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	paquet: 100-LQFP	Stock4 160	1 Core, 32-Bit	33MHz	System Control; CP0	DRAM	No	-	-	-	-	5.0V	0°C ~ 85°C (TC)	-	100-LQFP	100-TQFP (14x14)
KMC8358CVVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	paquet: 740-LBGA	Stock5 392	1 Core, 32-Bit	400MHz	Communications; QUICC Engine	DDR, DDR2	No	-	10/100/1000 Mbps (1)	-	USB 1.x (1)	1.8V, 2.5V, 3.3V	-40°C ~ 105°C (TA)	-	740-LBGA	740-TBGA (37.5x37.5)
XPC850DEZT50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	paquet: 256-BGA	Stock43 344	1 Core, 32-Bit	50MHz	Communications; CPM	DRAM	No	-	10 Mbps (1)	-	USB 1.x (1)	3.3V	0°C ~ 95°C (TA)	-	256-BGA	256-PBGA (23x23)
KMPC8275ZQMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	paquet: 516-BBGA	Stock3 232	1 Core, 32-Bit	266MHz	Communications; RISC CPM	DRAM, SDRAM	No	-	10/100 Mbps (3)	-	USB 2.0 (1)	3.3V	0°C ~ 105°C (TA)	-	516-BBGA	516-FPBGA (27x27)
KM68LC302AF20VCT	NXP	IC MPU M683XX 20MHZ 100LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	paquet: 100-LQFP	Stock7 168	1 Core, 8/16-Bit	20MHz	Communications; RISC CPM	DRAM	No	-	-	-	-	3.3V	0°C ~ 70°C (TA)	-	100-LQFP	100-LQFP (14x14)
MC68MH360AI33L	NXP	IC MPU M683XX 33MHZ 240FQFP Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32)	paquet: 240-BFQFP	Stock4 528	1 Core, 32-Bit	33MHz	Communications; CPM	DRAM	No	-	10 Mbps (1)	-	-	5.0V	0°C ~ 70°C (TA)	-	240-BFQFP	240-FQFP (32x32)
MPC8540VTAQFC	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 784-BBGA, FCBGA	Stock5 936	1 Core, 32-Bit	1.0GHz	-	DDR, SDRAM	No	-	10/100 Mbps (1), 10/100/1000 Mbps (2)	-	-	2.5V, 3.3V	0°C ~ 105°C (TA)	-	784-BBGA, FCBGA	783-FCPBGA (29x29)
P2041NSN7MMC	NXP	IC MPU Q OR IQ 1.2GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	paquet: 780-BBGA, FCBGA	Stock6 480	4 Core, 32-Bit	1.2GHz	-	DDR3, DDR3L	No	-	10/100/1000 Mbps (5), 10 Gbps (1)	SATA 3Gbps (2)	USB 2.0 + PHY (2)	1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V	0°C ~ 105°C (TA)	-	780-BBGA, FCBGA	780-FCPBGA (23x23)
MPC860DPVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock5 136	1 Core, 32-Bit	66MHz	Communications; CPM	DRAM	No	-	10 Mbps (2), 10/100 Mbps (1)	-	-	3.3V	0°C ~ 95°C (TA)	-	357-BBGA	357-PBGA (25x25)
MPC8313ZQAGDC	NXP	IC MPU MPC83XX 400MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	paquet: 516-BBGA Exposed Pad	Stock3 840	1 Core, 32-Bit	400MHz	-	DDR, DDR2	No	-	10/100/1000 Mbps (2)	-	USB 2.0 + PHY (1)	1.8V, 2.5V, 3.3V	0°C ~ 105°C (TA)	-	516-BBGA Exposed Pad	516-TEPBGA (27x27)
GCIXP1250BC	Intel	IC MPU STRONGARM 232MHZ 520BGA Core Processor: StrongARM Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 232MHz Co-Processors/DSP: Data; Microengine RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 520-LFBGA Supplier Device Package: 520-HL-PBGA (40x40)	paquet: 520-LFBGA	Stock7 680	1 Core, 32-Bit	232MHz	Data; Microengine	SDRAM	No	-	-	-	-	3.3V	0°C ~ 70°C (TA)	-	520-LFBGA	520-HL-PBGA (40x40)
MPC8280VVUPEA	NXP	IC MPU MPC82XX 450MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 450MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	paquet: 480-LBGA	Stock6 304	1 Core, 32-Bit	450MHz	Communications; RISC CPM	DRAM, SDRAM	No	-	10/100 Mbps (3)	-	USB 2.0 (1)	3.3V	0°C ~ 105°C (TA)	-	480-LBGA	408-TBGA (37.5x37.5)
Z8018006FSG	Zilog	IC MPU Z180 6MHZ 80QFP Core Processor: Z80180 Number of Cores/Bus Width: 1 Core, 8-Bit Speed: 6MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 80-BQFP Supplier Device Package: 80-QFP	paquet: 80-BQFP	Stock6 160	1 Core, 8-Bit	6MHz	-	DRAM	No	-	-	-	-	5.0V	0°C ~ 70°C (TA)	-	80-BQFP	80-QFP
96MPXE-2.1-16M36	Advantech Corp	XEON 2.1G 16.5M 3647P 12C 4116 7 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock4 976	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MIMXRT1051CVL5B	NXP	I.MXRT1050 A1 Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	paquet: 196-LFBGA	Stock15 264	1 Core, 32-Bit	528MHz	-	SDRAM	Yes	LCD	10/100 Mbps (1)	-	USB 2.0 OTG + PHY (2)	1.8V, 2.8V, 3.3V	-40°C ~ 105°C (TJ)	BEE, DCP, HAB, SJC, SNVS, TRNG	196-LFBGA	196-MAPBGA (10x10)
STM32MP157CAB3	STMicroelectronics	MPU WITH ARM DUAL CORTEX-A7 650 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock6 192	-	-	-	-	-	-	-	-	-	-	-	-	-	-
STM32MP151CAB3	STMicroelectronics	MPU WITH ARM CORTEX-A7 650 MHZ, Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock7 680	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S32G399ASCK1VUCR	NXP	8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	paquet: -	Request a Quote	4 Core, 64-Bit/8 Core, 32-Bit	400MHz, 1.3GHz	Multimedia; NEON	DDR3L SDRAM, LPDDR4 DRAM	No	-	2.5Gbps (3)	-	USB 2.0 OTG (1)	1.8V, 3.3V	-40°C ~ 105°C (TA)	ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC	525-FBGA, FCBGA	525-FCPBGA (19x19)
HD64413ASFV	Renesas Electronics Corporation	GRAPHICS PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-	-	-	-	-	-	-
R9A07G075M22GBA-AC0	Renesas Electronics Corporation	IC MPU RZ/T2M 600/800MHZ 225FBGA Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: - Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13x13)	paquet: -	Stock324	2 Core, 32-Bit	600MHz, 800MHz	Multimedia; NEON™ SIMD	-	No	-	10/100/1000Mbps (2)	-	USB 2.0 (1)	1.8V, 3.3V	-40°C ~ 125°C (TJ)	-	225-LFBGA	225-FBGA (13x13)
R9A07G044C26GBG-AC0	Renesas Electronics Corporation	IC MPU RZ 200MHZ/1.2GHZ 361BGA Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13x13)	paquet: -	Stock288	3 Core, 64-Bit	200MHz, 1.2GHz	ARM® Mali-G31	DDR3L, DDR4	No	MIPI/CSI, MIPI/DSI	10/100/1000Mbps (2)	-	USB 2.0 (2)	1.8V, 3.3V	-40°C ~ 85°C (TA)	AES, RSA, SHA-1, SHA-224, SHA-256, TRNG	361-LFBGA	361-BGA (13x13)
LX2120SE71826B	NXP	IC MPU QORLQ 1.8GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 12 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	paquet: -	Request a Quote	12 Core, 64-Bit	1.8GHz	-	DDR4	Yes	-	100Gbps (2)	SATA 3.0 (4)	USB 3.0 (2) + PHY (2)	1.2V, 1.8V, 3.3V	0°C ~ 105°C (TJ)	Secure Boot, TrustZone®	1517-BBGA, FCBGA	1517-FCPBGA (40x40)