Page 170 - Embarqué - Microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqué - Microprocesseurs

Dossiers 8 238
Page  170/295
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
AM3352ZCED50
Texas Instruments

IC MPU SITARA 500MHZ 298NFBGA

  • Core Processor: ARM? Cortex?-A8
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 500MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR, DDR2, DDR3, DDR3L
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, Touchscreen
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 90°C (TJ)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 298-LFBGA
  • Supplier Device Package: 298-NFBGA (13x13)
paquet: 298-LFBGA
Stock3 824
1 Core, 32-Bit
500MHz
Multimedia; NEON? SIMD
LPDDR, DDR2, DDR3, DDR3L
Yes
LCD, Touchscreen
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
1.8V, 3.3V
-40°C ~ 90°C (TJ)
Cryptography, Random Number Generator
298-LFBGA
298-NFBGA (13x13)
AM1802BZCED3
Texas Instruments

IC MPU SITARA 300MHZ 361NFBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: System Control; CP15
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 90°C (TJ)
  • Security Features: -
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-NFBGA (13x13)
paquet: 361-LFBGA
Stock6 176
1 Core, 32-Bit
300MHz
System Control; CP15
LPDDR, DDR2
No
LCD
10/100 Mbps (1)
-
USB 2.0 + PHY (1)
1.8V, 3.3V
-40°C ~ 90°C (TJ)
-
361-LFBGA
361-NFBGA (13x13)
PPC8572EPXAULC
NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
paquet: 1023-BFBGA, FCBGA
Stock5 136
2 Core, 32-Bit
1.333GHz
Signal Processing; SPE, Security; SEC
DDR2, DDR3
No
-
10/100/1000 Mbps (4)
-
-
1.5V, 1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Cryptography, Random Number Generator
1023-BFBGA, FCBGA
1023-FCPBGA (33x33)
hot MPC8313EVRAFFB
NXP

IC MPU MPC83XX 333MHZ 516BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA Exposed Pad
  • Supplier Device Package: 516-TEPBGA (27x27)
paquet: 516-BBGA Exposed Pad
Stock5 408
1 Core, 32-Bit
333MHz
Security; SEC 2.2
DDR, DDR2
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Cryptography
516-BBGA Exposed Pad
516-TEPBGA (27x27)
MPC8360CZUAJDGA
NXP

IC MPU MPC83XX 533MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
paquet: 740-LBGA
Stock4 992
1 Core, 32-Bit
533MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
740-LBGA
740-TBGA (37.5x37.5)
MC68MH360CZQ25L
NXP

IC MPU M683XX 25MHZ 357BGA

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock5 568
1 Core, 32-Bit
25MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
-
5.0V
-40°C ~ 85°C (TA)
-
357-BBGA
357-PBGA (25x25)
MC68EC040FE40A
NXP

IC MPU M680X0 40MHZ 184CQFP

  • Core Processor: 68040
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 40MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 184-BCQFP
  • Supplier Device Package: 184-CQFP (31.3x31.3)
paquet: 184-BCQFP
Stock2 496
1 Core, 32-Bit
40MHz
-
-
No
-
-
-
-
5.0V
0°C ~ 70°C (TA)
-
184-BCQFP
184-CQFP (31.3x31.3)
KMPC8270ZUUPEA
NXP

IC MPU MPC82XX 450MHZ 408TBGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 450MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
paquet: 480-LBGA
Stock7 584
1 Core, 32-Bit
450MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
0°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
hot MPC860SRZQ80D4
NXP

IC MPU MPC8XX 80MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock6 848
1 Core, 32-Bit
80MHz
Communications; CPM
DRAM
No
-
10 Mbps (4)
-
-
3.3V
0°C ~ 95°C (TA)
-
357-BBGA
357-PBGA (25x25)
MPC8379VRAJFA
NXP

IC MPU MPC83XX 533MHZ 689TEBGA

  • Core Processor: PowerPC e300c4s
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (4)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock7 344
1 Core, 32-Bit
533MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (2)
SATA 3Gbps (4)
USB 2.0 + PHY (1)
1.8V, 2.5V, 3.3V
0°C ~ 125°C (TA)
-
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
MPC852TZT80A
NXP

IC MPU MPC8XX 80MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
paquet: 256-BBGA
Stock3 440
1 Core, 32-Bit
80MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
-
3.3V
0°C ~ 95°C (TA)
-
256-BBGA
256-PBGA (23x23)
MPC8306SVMAFDCA
NXP

IC MPU MPC83XX 333MHZ 369BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 369-LFBGA
  • Supplier Device Package: 369-PBGA (19x19)
paquet: 369-LFBGA
Stock3 504
1 Core, 32-Bit
333MHz
Communications; QUICC Engine
DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 3.3V
0°C ~ 105°C (TA)
-
369-LFBGA
369-PBGA (19x19)
Z8S18033FEG
Zilog

IC MPU Z180 33MHZ 80QFP

  • Core Processor: Z8S180
  • Number of Cores/Bus Width: 1 Core, 8-Bit
  • Speed: 33MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 100°C (TA)
  • Security Features: -
  • Package / Case: 80-BQFP
  • Supplier Device Package: 80-QFP
paquet: 80-BQFP
Stock7 728
1 Core, 8-Bit
33MHz
-
DRAM
No
-
-
-
-
5.0V
-40°C ~ 100°C (TA)
-
80-BQFP
80-QFP
MCIMX6X3CVO08AB
NXP

IC MPU I.MX6SX 800MHZ 400MAPBGA

  • Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 200MHz, 800MHz
  • Co-Processors/DSP: Multimedia; NEON? MPE
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
paquet: 400-LFBGA
Stock4 480
2 Core, 32-Bit
200MHz, 800MHz
Multimedia; NEON? MPE
LPDDR2, LVDDR3, DDR3
Yes
Keypad, LCD
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
1.8V, 2.5V, 2.8V, 3.15V
-40°C ~ 105°C (TA)
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
400-LFBGA
400-MAPBGA (17x17)
KC80524KX366128SL3C7
Intel

IC MPU MOB CELERON 366MHZ 615BGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: 366MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Security Features: -
  • Package / Case: 615-BBGA
  • Supplier Device Package: 615-BGA (35.15x31.15)
paquet: 615-BBGA
Stock4 848
-
366MHz
-
-
No
-
-
-
-
-
0°C ~ 100°C (TJ)
-
615-BBGA
615-BGA (35.15x31.15)
FC80960HT75SL2GT
Intel

IC MPU I960 75MHZ 208QFP

  • Core Processor: i960
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 75MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 208-QFP
  • Supplier Device Package: 208-PQFP
paquet: 208-QFP
Stock6 304
1 Core, 32-Bit
75MHz
-
DRAM
No
-
-
-
-
3.3V
0°C ~ 85°C (TC)
-
208-QFP
208-PQFP
NG80960JD3V40
Intel

IC MPU I960 40MHZ 132QFP

  • Core Processor: i960
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 40MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 100°C (TC)
  • Security Features: -
  • Package / Case: 132-QFP
  • Supplier Device Package: 132-QFP
paquet: 132-QFP
Stock3 920
1 Core, 32-Bit
40MHz
-
-
No
-
-
-
-
3.3V
0°C ~ 100°C (TC)
-
132-QFP
132-QFP
AM3352BZCEA30
Texas Instruments

IC MPU SITARA 300MHZ 298NFBGA

  • Core Processor: ARM? Cortex?-A8
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR, DDR2, DDR3, DDR3L
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, Touchscreen
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 298-LFBGA
  • Supplier Device Package: 298-NFBGA (13x13)
paquet: 298-LFBGA
Stock13 458
1 Core, 32-Bit
300MHz
Multimedia; NEON? SIMD
LPDDR, DDR2, DDR3, DDR3L
Yes
LCD, Touchscreen
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
1.8V, 3.3V
-40°C ~ 105°C (TJ)
Cryptography, Random Number Generator
298-LFBGA
298-NFBGA (13x13)
ATSAMA5D23B-CN
Microchip Technology

IC MCU 32BIT 196TFBGA

  • Core Processor: ARM® Cortex®-A5
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 500MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keyboard, LCD, Touchscreen
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + HSIC
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
  • Package / Case: 196-TFBGA, CSBGA
  • Supplier Device Package: 196-TFBGA (11x11)
paquet: 196-TFBGA, CSBGA
Stock2 336
1 Core, 32-Bit
500MHz
Multimedia; NEON™ MPE
LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Yes
Keyboard, LCD, Touchscreen
10/100 Mbps (1)
-
USB 2.0 + HSIC
3.3V
-40°C ~ 105°C (TA)
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
196-TFBGA, CSBGA
196-TFBGA (11x11)
96MPXE-2.0-27M36A
Advantech Corp

XEON 2G 27.5M 3647P 20C 6138T 94

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 520
-
-
-
-
-
-
-
-
-
-
-
-
-
-
LS1021ASE7HNB
NXP

LS1 32BIT ARM SOC 800MHZ DDR3/

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
paquet: 525-FBGA, FCBGA
Stock6 160
-
-
-
-
-
-
-
-
-
-
-
-
525-FBGA, FCBGA
525-FCPBGA (19x19)
LS1018ASN7NQA
NXP

IC MPU QORIQ 1.3GHZ 448FBGA

  • Core Processor: ARM® Cortex®-A72
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 1.3GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: 1Gbps (1), 2.5Gbps (5)
  • SATA: SATA 6Gbps (1)
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 448-BFBGA
  • Supplier Device Package: 448-FBGA (17x17)
paquet: -
Request a Quote
1 Core, 64-Bit
1.3GHz
-
DDR3L SDRAM, DDR4 SDRAM
-
-
1Gbps (1), 2.5Gbps (5)
SATA 6Gbps (1)
-
-
-40°C ~ 105°C (TA)
-
448-BFBGA
448-FBGA (17x17)
NE80546RE077256
Intel

LOW VOLTAGE INTEL XEON PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
FWIXP420BD
Intel

IC MPU 533MHZ 492BGA

  • Core Processor: Xscale
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100Mbps (2)
  • SATA: -
  • USB: USB 1.1 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 492-BBGA
  • Supplier Device Package: 492-BGA (35x35)
paquet: -
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1 Core, 32-Bit
533MHz
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
SDRAM
No
-
10/100Mbps (2)
-
USB 1.1 (1)
3.3V
0°C ~ 70°C (TA)
-
492-BBGA
492-BGA (35x35)
R9A07G044C16GBG-BC0
Renesas Electronics Corporation

IC MPU RZ 200MHZ/1.2GHZ 361BGA

  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 200MHz, 1.2GHz
  • Co-Processors/DSP: ARM® Mali-G31
  • RAM Controllers: DDR3L, DDR4
  • Graphics Acceleration: No
  • Display & Interface Controllers: MIPI/CSI, MIPI/DSI
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-BGA (13x13)
paquet: -
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2 Core, 64-Bit
200MHz, 1.2GHz
ARM® Mali-G31
DDR3L, DDR4
No
MIPI/CSI, MIPI/DSI
10/100/1000Mbps (2)
-
USB 2.0 (2)
1.8V, 3.3V
-40°C ~ 85°C (TA)
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
361-LFBGA
361-BGA (13x13)
STM32MP135CAF3T
STMicroelectronics

Linear IC's

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 650MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
  • Package / Case: 320-TFBGA
  • Supplier Device Package: 320-TFBGA (11x11)
paquet: -
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1 Core, 32-Bit
650MHz
Multimedia; NEON™ SIMD
DDR3, DDR3L, LPDDR2, LPDDR3
Yes
LCD
10/100/1000Mbps (2)
-
USB 2.0 (2)
1.8V, 2.5V, 3.3V
-40°C ~ 125°C (TJ)
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
320-TFBGA
320-TFBGA (11x11)
S7100PH-HI3
MaxLinear, Inc.

IC PROCESSOR 1.2V 484FCBGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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-
-
-
-
-
-
-
-
-
-
-
-
-
-
AU1350-667MBDA2
Broadcom Limited

AU1350 A2 IC SD MEDIA PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
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-
-
-
-
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-
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