Page 166 - Embarqué - Microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqué - Microprocesseurs

Dossiers 8 238
Page  166/295
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
OMAPL138BZCG4
Texas Instruments

IC MPU OMAP-L1X 456MHZ 361NFBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 456MHz
  • Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Security Features: Boot Security, Cryptography
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-NFBGA (13x13)
paquet: 361-LFBGA
Stock5 344
1 Core, 32-Bit
456MHz
Signal Processing; C674x, System Control; CP15
SDRAM
No
LCD
10/100 Mbps (1)
SATA 3Gbps (1)
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
1.8V, 3.3V
0°C ~ 90°C (TJ)
Boot Security, Cryptography
361-LFBGA
361-NFBGA (13x13)
PPC8306SCVMABDCA
NXP

IC MPU MPC83XX 133MHZ 369BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 133MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 369-LFBGA
  • Supplier Device Package: 369-PBGA (19x19)
paquet: 369-LFBGA
Stock7 808
1 Core, 32-Bit
133MHz
Communications; QUICC Engine
DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 3.3V
-40°C ~ 105°C (TA)
-
369-LFBGA
369-PBGA (19x19)
hot OMAPL137BZKB3
Texas Instruments

IC MPU OMAP-L1X 375MHZ 256BGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 375MHz
  • Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Security Features: -
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-BGA (17x17)
paquet: 256-BGA
Stock3 920
1 Core, 32-Bit
375MHz
Signal Processing; C674x, System Control; CP15
SDRAM
No
LCD
10/100 Mbps (1)
-
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
1.8V, 3.3V
0°C ~ 90°C (TJ)
-
256-BGA
256-BGA (17x17)
MC8640THX1067NE
NXP

IC MPU MPC86XX 1.067GHZ 994BGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 994-BCBGA, FCCBGA
  • Supplier Device Package: 994-FCCBGA (33x33)
paquet: 994-BCBGA, FCCBGA
Stock3 680
1 Core, 32-Bit
1.067GHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
994-BCBGA, FCCBGA
994-FCCBGA (33x33)
hot MPC8533EVTARJ
NXP

IC MPU MPC85XX 1.067GHZ 783BGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock4 592
1 Core, 32-Bit
1.067GHz
Security; SEC
DDR, DDR2
No
-
10/100/1000 Mbps (2)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 90°C (TA)
Cryptography, Random Number Generator
783-BBGA, FCBGA
783-FCPBGA (29x29)
IDT79RC32V334-100BB
IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 100MHZ 256BGA

  • Core Processor: MIPS-II
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 100MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (17x17)
paquet: 256-BBGA
Stock4 384
1 Core, 32-Bit
100MHz
-
SDRAM
No
-
-
-
-
3.3V
0°C ~ 70°C (TA)
-
256-BBGA
256-PBGA (17x17)
MPC8358ZQADDDA
NXP

IC MPU MPC83XX 266MHZ 668BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 668-BBGA Exposed Pad
  • Supplier Device Package: 668-PBGA-PGE (29x29)
paquet: 668-BBGA Exposed Pad
Stock3 152
1 Core, 32-Bit
266MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
668-BBGA Exposed Pad
668-PBGA-PGE (29x29)
MPC8358ZUAGDG
NXP

IC MPU MPC83XX 400MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
paquet: 740-LBGA
Stock7 312
1 Core, 32-Bit
400MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
740-LBGA
740-TBGA (37.5x37.5)
MC9328MXLDVM20R2
NXP

IC MPU I.MXL 200MHZ 256MAPBGA

  • Core Processor: ARM920T
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: -30°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 256-LFBGA
  • Supplier Device Package: -
paquet: 256-LFBGA
Stock2 128
1 Core, 32-Bit
200MHz
-
SDRAM
No
LCD
-
-
USB 1.x (1)
1.8V, 3.0V
-30°C ~ 70°C (TA)
-
256-LFBGA
-
MC7447AVS1420LB
NXP

IC MPU MPC74XX 1.42GHZ 360FCCLGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.42GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-CLGA, FCCLGA
  • Supplier Device Package: 360-FCCLGA (25x25)
paquet: 360-CLGA, FCCLGA
Stock2 336
1 Core, 32-Bit
1.42GHz
Multimedia; SIMD
-
No
-
-
-
-
1.8V, 2.5V
0°C ~ 105°C (TA)
-
360-CLGA, FCCLGA
360-FCCLGA (25x25)
T4160NXN7PQB
NXP

IC SOC 64BIT 16X 1.5GHZ 1932BGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 8 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (13), 10 Gbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FCPBGA (45x45)
paquet: 1932-BBGA, FCBGA
Stock3 344
8 Core, 64-Bit
1.8GHz
-
DDR3, DDR3L
No
-
1 Gbps (13), 10 Gbps (2)
SATA 3Gbps (2)
USB 2.0 + PHY (2)
-
-40°C ~ 105°C (TA)
-
1932-BBGA, FCBGA
1932-FCPBGA (45x45)
MPC8280CVVQLDA
NXP

IC MPU MPC82XX 333MHZ 408TBGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
paquet: 480-LBGA
Stock6 048
1 Core, 32-Bit
333MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
-40°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
3530ECBCAMERCURY
Texas Instruments

IC PROCESSOR APPL SPEC 515FCBGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 720
-
-
-
-
-
-
-
-
-
-
-
-
-
-
hot P1024NXE5DFB
NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 561-FBGA
  • Supplier Device Package: 561-TEPBGA1 (23x23)
paquet: 561-FBGA
Stock4 624
2 Core, 32-Bit
667MHz
Security; SEC 3.3
DDR3
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
-
-40°C ~ 125°C (TA)
Cryptography, Random Number Generator
561-FBGA
561-TEPBGA1 (23x23)
hot M68LC302CAF16VCT
NXP

IC MPU M683XX 166MHZ 100LQFP

  • Core Processor: M68000
  • Number of Cores/Bus Width: 1 Core, 8/16-Bit
  • Speed: 166MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock12 828
1 Core, 8/16-Bit
166MHz
Communications; RISC CPM
DRAM
No
-
-
-
-
3.3V
-40°C ~ 85°C (TA)
-
100-LQFP
100-LQFP (14x14)
MPC8323VRADDCA
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock2 112
1 Core, 32-Bit
266MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
516-BBGA
516-FPBGA (27x27)
MCIMX6DP7CVT8AA
NXP

IC MPU I.MX6DP 800MHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, DDR3L, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
paquet: 624-FBGA, FCBGA
Stock7 728
2 Core, 32-Bit
800MHz
Multimedia; NEON? SIMD
LPDDR2, DDR3L, DDR3
Yes
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
10/100/1000 Mbps (1)
SATA 3Gbps (1)
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
1.8V, 2.5V, 2.8V, 3.3V
-40°C ~ 105°C (TA)
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
624-FBGA, FCBGA
624-FCBGA (21x21)
AM4376BZDND30
Texas Instruments

MOD ARM CORTEX-A9 491NFBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: TSC, WXGA
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 90°C (TJ)
  • Security Features: Crypto Accelerator
  • Package / Case: 491-LFBGA
  • Supplier Device Package: 491-NFBGA (17x17)
paquet: 491-LFBGA
Stock5 168
1 Core, 32-Bit
300MHz
Multimedia; NEON? SIMD
LPDDR2, DDR3, DDR3L
No
TSC, WXGA
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
1.8V, 3.3V
-40°C ~ 90°C (TJ)
Crypto Accelerator
491-LFBGA
491-NFBGA (17x17)
XLP432RX0800-22
Broadcom Limited

IC PROCESSOR MULTI-CORE 800MHZ

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 424
-
-
-
-
-
-
-
-
-
-
-
-
-
-
T4161NSE7QTB
NXP

QORIQ 64B POWER 16X 1.67GHZ TH

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 856
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MCIMX6S6AVM08AD
NXP

I.MX6SOLO ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
paquet: 624-LFBGA
Stock4 176
1 Core, 32-Bit
800MHz
Multimedia; NEON™ SIMD
LPDDR2, LVDDR3, DDR3
Yes
Keypad, LCD
10/100/1000 Mbps (1)
-
USB 2.0 + PHY (4)
1.8V, 2.5V, 2.8V, 3.3V
-40°C ~ 125°C (TJ)
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
624-LFBGA
624-MAPBGA (21x21)
PS32V234CMN1AVUB
NXP

PRE-QUAL ISP GPU NO CSE1GHZ

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
  • Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
  • Speed: 1.0GHz, 133MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
  • Ethernet: 1 Gbps
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.0V, 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
  • Package / Case: 621-FBGA, FCBGA
  • Supplier Device Package: 621-FCPBGA (17x17)
paquet: 621-FBGA, FCBGA
Stock7 824
4 Core, 64-Bit/1 Core, 32-Bit
1.0GHz, 133MHz
Multimedia; NEON™ MPE
LPDDR2, DDR3, DDR3L
Yes
APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
1 Gbps
-
-
1.0V, 1.8V, 3.3V
-40°C ~ 105°C (TA)
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
621-FBGA, FCBGA
621-FCPBGA (17x17)
N80960SA20
Intel

IC MPU I960 20MHZ 84PLCC

  • Core Processor: i960
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: -
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1 Core, 32-Bit
20MHz
-
-
No
-
-
-
-
5V
0°C ~ 85°C (TC)
-
84-LCC (J-Lead)
84-PLCC (29.31x29.31)
A8028612
Intel

IC MPU IAPX86 12MHZ 68CPGA

  • Core Processor: 80286
  • Number of Cores/Bus Width: -
  • Speed: 12MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 68-CPGA
  • Supplier Device Package: 68-CPGA
paquet: -
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-
12MHz
-
-
No
-
-
-
-
5V
0°C ~ 85°C (TC)
-
68-CPGA
68-CPGA
FS32V234BLN2VUB
NXP

IC MPU FS32V23 800MHZ 621FCPBGA

  • Core Processor: ARM® Cortex®-A53
  • Number of Cores/Bus Width: 4 Core, 32/64-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: ARM® Cortex®-M4
  • RAM Controllers: DDR3, DDR3L, LPDDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
  • Ethernet: GbE
  • SATA: -
  • USB: -
  • Voltage - I/O: 1V, 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
  • Package / Case: 621-FBGA, FCBGA
  • Supplier Device Package: 621-FCPBGA (17x17)
paquet: -
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4 Core, 32/64-Bit
800MHz
ARM® Cortex®-M4
DDR3, DDR3L, LPDDR2
No
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
GbE
-
-
1V, 1.8V, 3.3V
-40°C ~ 125°C (TJ)
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
621-FBGA, FCBGA
621-FCPBGA (17x17)
AGXD500AAXE0TD
Advanced Micro Devices

IC MPU 366MHZ 368EBGA

  • Core Processor: AMD Geode™ GX
  • Number of Cores/Bus Width: 1 Core
  • Speed: 366MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: TFT, VGA
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 368-BGA
  • Supplier Device Package: 368-EBGA (35x35)
paquet: -
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1 Core
366MHz
-
DDR
Yes
TFT, VGA
-
-
-
3.3V
0°C ~ 85°C (TC)
-
368-BGA
368-EBGA (35x35)
AM5718BABCXSR
Texas Instruments

IC MPU SITARA 1.5GHZ 760FCBGA

  • Core Processor: ARM® Cortex®-A15
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
  • RAM Controllers: DDR3, SRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, LCD
  • Ethernet: 10/100/1000Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Security Features: 3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
  • Package / Case: 760-BFBGA, FCBGA
  • Supplier Device Package: 760-FCBGA (23x23)
paquet: -
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1 Core, 32-Bit
1.5GHz
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
DDR3, SRAM
Yes
HDMI, LCD
10/100/1000Mbps (1)
SATA 3Gbps (1)
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
1.8V, 3.3V
0°C ~ 90°C (TJ)
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
760-BFBGA, FCBGA
760-FCBGA (23x23)
TN80C186EB-16
Rochester Electronics, LLC

IC MPU I186 16MHZ 84PLCC

  • Core Processor: 80C186
  • Number of Cores/Bus Width: 1 Core, 16-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC
paquet: -
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1 Core, 16-Bit
16MHz
-
DRAM
No
-
-
-
-
5.0V
0°C ~ 70°C (TA)
-
84-LCC (J-Lead)
84-PLCC