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Embarqués - Microcontrôleurs

Dossiers 91 098
Page  2 142/3 254
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
C8051F991-GMR
Silicon Labs

IC MCU 8BIT 8KB FLASH 20QFN

  • Core Processor: CIP-51 8051
  • Core Size: 8-Bit
  • Speed: 25MHz
  • Connectivity: SMBus (2-Wire/I2C), SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Cap Sense, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-UFQFN Exposed Pad
  • Supplier Device Package: 20-QFN (3x3)
paquet: 20-UFQFN Exposed Pad
Stock6 992
8-Bit
25MHz
SMBus (2-Wire/I2C), SPI, UART/USART
Brown-out Detect/Reset, Cap Sense, POR, PWM, WDT
16
8KB (8K x 8)
FLASH
-
512 x 8
1.8 V ~ 3.6 V
-
Internal
-40°C ~ 85°C (TA)
-
20-UFQFN Exposed Pad
20-QFN (3x3)
hot MCF5249CVM140
NXP

IC MCU 32BIT ROMLESS 160MAPBGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 140MHz
  • Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
  • Peripherals: DMA, I2S, POR, Serial Audio, WDT
  • Number of I/O: 47
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 4x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BGA
  • Supplier Device Package: 160-MAPBGA (15x15)
paquet: 160-BGA
Stock5 344
32-Bit
140MHz
I2C, IDE, Memory Card, SPI, UART/USART
DMA, I2S, POR, Serial Audio, WDT
47
-
ROMless
-
96K x 8
3 V ~ 3.6 V
A/D 4x12b
External
-40°C ~ 85°C (TA)
-
160-BGA
160-MAPBGA (15x15)
MC908GZ60CFJE
NXP

IC MCU 8BIT 60KB FLASH 32LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: CAN, SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 21
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 24x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock5 120
8-Bit
8MHz
CAN, SCI, SPI
LVD, POR, PWM
21
60KB (60K x 8)
FLASH
-
2K x 8
3 V ~ 5.5 V
A/D 24x10b
Internal
-40°C ~ 85°C (TA)
-
32-LQFP
32-LQFP (7x7)
ZGP323LEP4004C
Zilog

IC MCU 8BIT 4KB OTP 40DIP

  • Core Processor: Z8
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: HLVD, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 237 x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 40-DIP (0.620", 15.75mm)
  • Supplier Device Package: -
paquet: 40-DIP (0.620", 15.75mm)
Stock4 704
8-Bit
8MHz
-
HLVD, POR, WDT
32
4KB (4K x 8)
OTP
-
237 x 8
2 V ~ 3.6 V
-
Internal
-40°C ~ 105°C (TA)
-
40-DIP (0.620", 15.75mm)
-
PIC16LC770T-I/SS
Microchip Technology

IC MCU 8BIT 3.5KB OTP 20SSOP

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SPI
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: 3.5KB (2K x 14)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
  • Data Converters: A/D 6x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
paquet: 20-SSOP (0.209", 5.30mm Width)
Stock5 152
8-Bit
20MHz
I2C, SPI
Brown-out Detect/Reset, POR, PWM, WDT
15
3.5KB (2K x 14)
OTP
-
256 x 8
2.5 V ~ 5.5 V
A/D 6x12b
Internal
-40°C ~ 85°C (TA)
-
20-SSOP (0.209", 5.30mm Width)
20-SSOP
MB90020PMT-GS-164-BND
Cypress Semiconductor Corp

IC MCU 16B FFMC-16F-0.35 120LQFP

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 024
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MB90439PFV-G-366E1
Cypress Semiconductor Corp

IC MCU 16BIT 256KB MROM 100LQFP

  • Core Processor: F2MC-16LX
  • Core Size: 16-Bit
  • Speed: 16MHz
  • Connectivity: EBI/EMI, SCI, Serial I/O, UART/USART
  • Peripherals: POR, WDT
  • Number of I/O: 81
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: Mask ROM
  • EEPROM Size: -
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8/10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock7 904
16-Bit
16MHz
EBI/EMI, SCI, Serial I/O, UART/USART
POR, WDT
81
256KB (256K x 8)
Mask ROM
-
6K x 8
4.5 V ~ 5.5 V
A/D 8x8/10b
External
-40°C ~ 105°C (TA)
-
100-LQFP
100-LQFP (14x14)
SPC5603PEF1MLL6R
NXP

IC MCU 32BIT 384KB FLASH 100LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 45
  • Program Memory Size: 384KB (384K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 36K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 30x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock6 720
32-Bit
64MHz
CAN, FlexRay, LIN, SPI, UART/USART
DMA, POR, PWM, WDT
45
384KB (384K x 8)
FLASH
64K x 8
36K x 8
3 V ~ 5.5 V
A/D 30x10b
Internal
-40°C ~ 125°C (TA)
-
100-LQFP
100-LQFP (14x14)
DSPIC33FJ64GS610T-I/PF
Microchip Technology

IC MCU 16BIT 64KB FLASH 100TQFP

  • Core Processor: dsPIC
  • Core Size: 16-Bit
  • Speed: 40 MIPs
  • Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 9K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 24x10b, D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-TQFP
Stock2 624
16-Bit
40 MIPs
CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
85
64KB (64K x 8)
FLASH
-
9K x 8
3 V ~ 3.6 V
A/D 24x10b, D/A 1x10b
Internal
-40°C ~ 85°C (TA)
-
100-TQFP
100-TQFP (14x14)
TM4C1230E6PMTR
Texas Instruments

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M4F
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.63 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 600
32-Bit
80MHz
CAN, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Brown-out Detect/Reset, DMA, POR, WDT
49
128KB (128K x 8)
FLASH
2K x 8
32K x 8
1.08 V ~ 3.63 V
A/D 12x12b
Internal
-40°C ~ 105°C (TA)
-
64-LQFP
64-LQFP (10x10)
PIC24FJ128GC010T-I/BG
Microchip Technology

IC MCU 16BIT 128KB FLASH 121BGA

  • Core Processor: PIC
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 128KB (43K x 24)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: A/D 50x12b, 2x16b, D/A 2x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-TFBGA (10x10)
paquet: 121-TFBGA
Stock5 888
16-Bit
32MHz
I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
85
128KB (43K x 24)
FLASH
-
8K x 8
2 V ~ 3.6 V
A/D 50x12b, 2x16b, D/A 2x10b
Internal
-40°C ~ 85°C (TA)
-
121-TFBGA
121-TFBGA (10x10)
R5F51104ADFK#30
Renesas Electronics America

IC MCU 32BIT 96KB FLASH 64LQFP

  • Core Processor: RX
  • Core Size: 32-Bit
  • Speed: 32MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 14x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (14x14)
paquet: 64-LQFP
Stock6 688
32-Bit
32MHz
I2C, SCI, SPI
DMA, LVD, POR, PWM, WDT
50
96KB (96K x 8)
FLASH
-
16K x 8
1.8 V ~ 3.6 V
A/D 14x12b
Internal
-40°C ~ 85°C (TA)
-
64-LQFP
64-LQFP (14x14)
hot PIC16C57C-20/SS
Microchip Technology

IC MCU 8BIT 3KB OTP 28SSOP

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: -
  • Peripherals: POR, WDT
  • Number of I/O: 20
  • Program Memory Size: 3KB (2K x 12)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 72 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 28-SSOP
paquet: 28-SSOP (0.209", 5.30mm Width)
Stock60 288
8-Bit
20MHz
-
POR, WDT
20
3KB (2K x 12)
OTP
-
72 x 8
3 V ~ 5.5 V
-
External
0°C ~ 70°C (TA)
-
28-SSOP (0.209", 5.30mm Width)
28-SSOP
PIC24FJ256GB610-I/BG
Microchip Technology

IC MCU 16BIT 256KB FLASH 121BGA

  • Core Processor: PIC
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 256KB (85.5K x 24)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: A/D 24x10b/12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-TFBGA (10x10)
paquet: 121-TFBGA
Stock11 700
16-Bit
32MHz
I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
85
256KB (85.5K x 24)
FLASH
-
32K x 8
2 V ~ 3.6 V
A/D 24x10b/12b
Internal
-40°C ~ 85°C (TA)
-
121-TFBGA
121-TFBGA (10x10)
EFM32GG11B420F2048GQ100-AR
Silicon Labs

EFM32 GIANT GECKO 11 ULTRA LOW P

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
  • Number of I/O: 83
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.8 V
  • Data Converters: A/D 16x12b SAR, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-TQFP
Stock4 896
32-Bit
72MHz
CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
83
2MB (2M x 8)
FLASH
-
512K x 8
1.8 V ~ 3.8 V
A/D 16x12b SAR, D/A 2x12b
Internal
-40°C ~ 85°C (TA)
-
100-TQFP
100-TQFP (14x14)
MB90F997JBSPMC-GSE1
Cypress Semiconductor Corp

IC MCU 16BIT 160KB FLASH 48LQFP

  • Core Processor: F²MC-16LX
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, LINbus, SCI, UART/USART
  • Peripherals: LVD, POR, WDT
  • Number of I/O: 36
  • Program Memory Size: 160KB (160K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16x8/10b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock3 952
16-Bit
32MHz
CANbus, LINbus, SCI, UART/USART
LVD, POR, WDT
36
160KB (160K x 8)
FLASH
-
8K x 8
3 V ~ 5.5 V
A/D 16x8/10b, D/A 1x8b
Internal
-40°C ~ 105°C (TA)
-
48-LQFP
48-LQFP (7x7)
TMPM366FYFG
Toshiba Semiconductor and Storage

INTEGRATED CIRCUIT MICROCONTROLL

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 504
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DSPIC33CK64MP505T-I/M4
Microchip Technology

16 BIT DSC 64KB FLASH 8KB RAM 10

  • Core Processor: dsPIC
  • Core Size: 16-Bit
  • Speed: 100MHz
  • Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
  • Number of I/O: 39
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 19x12b, D/A 3x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-UFQFN Exposed Pad
  • Supplier Device Package: 48-UQFN (6x6)
paquet: 48-UFQFN Exposed Pad
Stock6 592
16-Bit
100MHz
CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
39
64KB (64K x 8)
FLASH
-
8K x 8
3 V ~ 3.6 V
A/D 19x12b, D/A 3x12b
Internal
-40°C ~ 85°C (TA)
-
48-UFQFN Exposed Pad
48-UQFN (6x6)
PIC32MZ1024EFG144-I/JWX
Microchip Technology

FLASH, 512KB RAM

  • Core Processor: MIPS32® M-Class
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 120
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 2.1 V ~ 3.6 V
  • Data Converters: A/D 48x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-TFBGA
  • Supplier Device Package: 144-TFBGA (7x7)
paquet: 144-TFBGA
Stock14 904
32-Bit
200MHz
EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
120
1MB (1M x 8)
FLASH
-
512K x 8
2.1 V ~ 3.6 V
A/D 48x12b
Internal
-40°C ~ 85°C (TA)
-
144-TFBGA
144-TFBGA (7x7)
SPC5646CCF0VLT1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock6 928
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP
208-TQFP (28x28)
R7F100GJL3CFA-AA0
Renesas Electronics Corporation

IC MCU 16BIT 512KB FLASH 52LQFP

  • Core Processor: RL78
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CSI, I2C, LINbus, SPI, UART/USART
  • Peripherals: Capacitive Touch, LVD, POR, PWM, WDT
  • Number of I/O: 44
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 8K x 8
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 12x8/10b/12b; D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 52-LQFP
  • Supplier Device Package: 52-LQFP (10x10)
paquet: -
Stock1 440
16-Bit
32MHz
CSI, I2C, LINbus, SPI, UART/USART
Capacitive Touch, LVD, POR, PWM, WDT
44
512KB (512K x 8)
FLASH
8K x 8
48K x 8
1.8V ~ 5.5V
A/D 12x8/10b/12b; D/A 2x8b
Internal
-40°C ~ 105°C (TA)
Surface Mount
52-LQFP
52-LQFP (10x10)
R7F7017103ABG-C-HC1
Renesas Electronics Corporation

32BIT MCU RH850/F1KH-D8

  • Core Processor: RH850G3KH
  • Core Size: 32-Bit Dual-Core
  • Speed: 240MHz
  • Connectivity: CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 174
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256K x 8
  • RAM Size: 896K x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
  • Data Converters: A/D 38x10b, 32x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 233-FBGA
  • Supplier Device Package: 233-FBGA (15x15)
paquet: -
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32-Bit Dual-Core
240MHz
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
DMA, PWM, WDT
174
6MB (6M x 8)
FLASH
256K x 8
896K x 8
3V ~ 5.5V
A/D 38x10b, 32x12b
Internal
-40°C ~ 105°C (TA)
Surface Mount
233-FBGA
233-FBGA (15x15)
R5F566TEADFN-30
Renesas Electronics Corporation

IC MCU 32BIT 512KB FLASH 80LFQFP

  • Core Processor: RXv3
  • Core Size: 32-Bit Single-Core
  • Speed: 160MHz
  • Connectivity: CANbus, EBI/EMI, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 52
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 32K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 19x12b; D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LFQFP (12x12)
paquet: -
Stock1 680
32-Bit Single-Core
160MHz
CANbus, EBI/EMI, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
DMA, LVD, POR, PWM, WDT
52
512KB (512K x 8)
FLASH
32K x 8
64K x 8
2.7V ~ 5.5V
A/D 19x12b; D/A 2x12b
Internal
-40°C ~ 85°C (TA)
Surface Mount
80-LQFP
80-LFQFP (12x12)
MSP430F2418TZCA
Texas Instruments

IC MCU 16BIT 116KB FLSH 113NFBGA

  • Core Processor: MSP430 CPU16
  • Core Size: 16-Bit
  • Speed: 16MHz
  • Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: 116KB (116K x 8 + 256B)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 8x12b; D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 113-VFBGA
  • Supplier Device Package: 113-NFBGA (7x7)
paquet: -
Stock300
16-Bit
16MHz
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Brown-out Detect/Reset, DMA, POR, PWM, WDT
64
116KB (116K x 8 + 256B)
FLASH
-
8K x 8
1.8V ~ 3.6V
A/D 8x12b; D/A 2x12b
Internal
-40°C ~ 105°C (TA)
Surface Mount
113-VFBGA
113-NFBGA (7x7)
R7F7016904AFP-C-KA1
Renesas Electronics Corporation

IC MCU 32BIT 1MB FLASH 64LFQFP

  • Core Processor: RH850G3KH
  • Core Size: 32-Bit Single-Core
  • Speed: 120MHz
  • Connectivity: CANbus, CSI, I2C, LINbus, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 49
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
  • Data Converters: A/D 10x10b, 11x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-LFQFP
paquet: -
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32-Bit Single-Core
120MHz
CANbus, CSI, I2C, LINbus, SPI, UART/USART
DMA, PWM, WDT
49
1MB (1M x 8)
FLASH
64K x 8
128K x 8
3V ~ 5.5V
A/D 10x10b, 11x12b
Internal
-40°C ~ 125°C (TA)
Surface Mount
64-QFP
64-LFQFP
R7F101G6E4CSP-HA1
Renesas Electronics Corporation

16-BIT GENERAL MCU RL78/G24 64K

  • Core Processor: RL78
  • Core Size: 16-Bit
  • Speed: 48MHz
  • Connectivity: CSI, I2C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
  • Data Converters: A/D 12x8/10b/12b; D/A 3x8/10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-LSSOP
paquet: -
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16-Bit
48MHz
CSI, I2C, LINbus, SPI, UART/USART
LVD, POR, PWM, WDT
15
64KB (64K x 8)
FLASH
4K x 8
12K x 8
1.6V ~ 5.5V
A/D 12x8/10b/12b; D/A 3x8/10b
Internal
-40°C ~ 125°C (TA)
Surface Mount
20-LSSOP (0.173", 4.40mm Width)
20-LSSOP
MC9SDG128BMFUR2
Motorola

IC MCU 16BIT 128KB FLASH 80QFP

  • Core Processor: CPU12
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
  • Data Converters: A/D 8x10b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
paquet: -
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16-Bit
50MHz
CANbus, SCI, SPI
PWM, WDT
59
128KB (128K x 8)
FLASH
2K x 8
8K x 8
2.35V ~ 2.75V
A/D 8x10b
External, Internal
-40°C ~ 125°C (TA)
Surface Mount
80-QFP
80-QFP (14x14)
FT901Q-C-T
Bridgetek Pte Ltd.

IC MCU 32BIT 256KB FLASH 100QFN

  • Core Processor: FT32
  • Core Size: 32-Bit Single-Core
  • Speed: 100MHz
  • Connectivity: Ethernet, I2C, SD, SPI, UART/USART, USB
  • Peripherals: I2S, POR, PWM, WDT
  • Number of I/O: 65
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 320K x 8
  • Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
  • Data Converters: A/D 7x10b; D/A 2x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-VFQFN Exposed Pad
  • Supplier Device Package: 100-QFN (12x12)
paquet: -
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32-Bit Single-Core
100MHz
Ethernet, I2C, SD, SPI, UART/USART, USB
I2S, POR, PWM, WDT
65
256KB (256K x 8)
FLASH
-
320K x 8
2.97V ~ 3.63V
A/D 7x10b; D/A 2x10b
Internal
-40°C ~ 85°C (TA)
Surface Mount
100-VFQFN Exposed Pad
100-QFN (12x12)