Page 33 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-160-2C1	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 000	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
SOMDM3730-31-1880AKIR	Logic	SYSTEM ON MODULE WIRELESS TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock5 568	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 85°C
SOMOMAP3503-10-1670HFCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 752	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
101-1007	Digi International	MODULE POWERCORE FLEX 3810 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 25.8MHz Flash Size: 512KB RAM Size: 256KB Connector Type: IDC Header 2x25, 2x5, 1x3mm Size / Dimension: 2.35" x 4" (60mm x 102mm) Operating Temperature: -40°C ~ 70°C	paquet: -	Stock4 272	Rabbit 3000	-	25.8MHz	512KB	256KB	IDC Header 2x25, 2x5, 1x3mm	2.35" x 4" (60mm x 102mm)	-40°C ~ 70°C
FS-335	Digi International	MODULE MOD520C 2MB FLASH Module/Board Type: MCU Core Core Processor: ElanSC520 Co-Processor: - Speed: 133MHz Flash Size: 2MB RAM Size: 16MB Connector Type: - Size / Dimension: - Operating Temperature: 0°C ~ 70°C	paquet: -	Stock7 040	ElanSC520	-	133MHz	2MB	16MB	-	-	0°C ~ 70°C
CENGPXA270-416-11-505HXR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -25°C ~ 85°C	paquet: -	Stock2 048	PXA270	-	416MHz	64MB	64MB	Edge Connector	2.37" x 2.67" (60.2mm x 67.8mm)	-25°C ~ 85°C
TE0715-04-30-1I3	Trenz Electronic GmbH	XILINX ZYNQ Z-7030 SOC MICROMODU Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock5 872	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TMP5704457BZWTQQ1	Texas Instruments	MODULE TMP5704457 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock5 488	-	-	-	-	-	-	-	-
CC-9U-T724-Z1	Digi International	MODULE 9U 32MB SDRAM 16MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock3 952	-	-	-	-	-	-	-	-
DC-EM-02T-S	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 960	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
TE0715-04-30-1I	Trenz Electronic GmbH	SOM ZYNQ XC7Z030-1I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 832	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
20-101-1319	Digi International	MINCORE MODULE RCM6710 Module/Board Type: MPU Core Core Processor: Rabbit 6000 Co-Processor: - Speed: 162.5MHz Flash Size: 1MB RAM Size: 1.032MB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock17 820	Rabbit 6000	-	162.5MHz	1MB	1.032MB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
XPDNC2000-01	Lantronix, Inc.	XPORT DIRECT PLUS DEVICE NETWORK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock7 568	-	-	-	-	-	-	-	-
TE0820-03-03EG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 80°C	paquet: -	Stock5 808	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 80°C
TE0803-02-04EV-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock4 144	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0803-02-04EG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock7 424	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
MYC-CZU4EV-V2-4E4D-1200-I	MYIR Tech Limited	MYC-CZU4EV-V2 CPU Module Module/Board Type: MCU, Ethernet Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I Speed: 2.4GHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 4GB Connector Type: Pin(s) Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I	2.4GHz	4GB eMMC, 128MB QSPI	4GB	Pin(s)	2.362" L x 2.047" W (60.00mm x 52.00mm)	-40°C ~ 85°C
TE0803-03-5DI21-A	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
MA-MA3-C6-7I-D10-R2	Enclustra FPGA Solutions	SOM CYCLONE V 5CSXFC6 1GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Cyclone V SX/SE Co-Processor: Cypress FX3 USB 3.0 Speed: 800MHz Flash Size: 64MB RAM Size: 1GB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock9	ARM® Cortex®-A9, Cyclone V SX/SE	Cypress FX3 USB 3.0	800MHz	64MB	1GB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0714-04-52I-8-A	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Artix-7 A50T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
TE0820-04-4BI21KL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0807-03-5AI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
CC-WST-DW69-NM	Digi	STM32MP157DUAL GPU 512M SLC NAND Module/Board Type: MPU Core Processor: STM32MP157C Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4 Speed: 650MHz, 209MHz Flash Size: 512MB (Boot) RAM Size: 512MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	STM32MP157C	Arm® Dual Cortex®-A7, ARM® Cortex®-M4	650MHz, 209MHz	512MB (Boot)	512MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
ME-SA2-D6-7I-D11-R1	Enclustra FPGA Solutions	SOM CYCLONE V 5CSTFD6 2GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: - Speed: 800MHz Flash Size: 64MB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock57	ARM® Dual-Core Cortex-A9	-	800MHz	64MB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0729-02-62I63MAK	Trenz Electronic GmbH	IC SOC MODULE ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
AM0010-02-4DE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU4EV Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq™ UltraScale+™ ZU4EV	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.220" L x 1.575" W (56.40mm x 40.00mm)	0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
ME-XU1-15EG-1E-D12E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C

TE0741-02-160-2C1

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 000

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

SOMDM3730-31-1880AKIR

Logic

SYSTEM ON MODULE WIRELESS TORP

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock5 568

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

-40°C ~ 85°C

SOMOMAP3503-10-1670HFCR

Logic

SYSTEM ON MODULE LV OMAP3503

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 752

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

101-1007

Digi International

MODULE POWERCORE FLEX 3810

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 25.8MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: IDC Header 2x25, 2x5, 1x3mm
Size / Dimension: 2.35" x 4" (60mm x 102mm)
Operating Temperature: -40°C ~ 70°C

paquet: -

Stock4 272

Rabbit 3000

-

25.8MHz

512KB

256KB

IDC Header 2x25, 2x5, 1x3mm

2.35" x 4" (60mm x 102mm)

-40°C ~ 70°C

FS-335

Digi International

MODULE MOD520C 2MB FLASH

Module/Board Type: MCU Core
Core Processor: ElanSC520
Co-Processor: -
Speed: 133MHz
Flash Size: 2MB
RAM Size: 16MB
Connector Type: -
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock7 040

ElanSC520

-

133MHz

2MB

16MB

-

0°C ~ 70°C

CENGPXA270-416-11-505HXR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 416MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: Edge Connector
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock2 048

PXA270

-

416MHz

64MB

Edge Connector

2.37" x 2.67" (60.2mm x 67.8mm)

-25°C ~ 85°C

TE0715-04-30-1I3

Trenz Electronic GmbH

XILINX ZYNQ Z-7030 SOC MICROMODU

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock5 872

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TMP5704457BZWTQQ1

Texas Instruments

MODULE TMP5704457

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock5 488

-

CC-9U-T724-Z1

Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock3 952

-

DC-EM-02T-S

Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 960

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

TE0715-04-30-1I

Trenz Electronic GmbH

SOM ZYNQ XC7Z030-1I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 832

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

20-101-1319

Digi International

MINCORE MODULE RCM6710

Module/Board Type: MPU Core
Core Processor: Rabbit 6000
Co-Processor: -
Speed: 162.5MHz
Flash Size: 1MB
RAM Size: 1.032MB
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock17 820

Rabbit 6000

-

162.5MHz

1MB

1.032MB

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

XPDNC2000-01

Lantronix, Inc.

XPORT DIRECT PLUS DEVICE NETWORK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock7 568

-

TE0820-03-03EG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 80°C

paquet: -

Stock5 808

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 80°C

TE0803-02-04EV-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock4 144

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0803-02-04EG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock7 424

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

MYC-CZU4EV-V2-4E4D-1200-I

MYIR Tech Limited

MYC-CZU4EV-V2 CPU Module

Module/Board Type: MCU, Ethernet Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
Speed: 2.4GHz
Flash Size: 4GB eMMC, 128MB QSPI
RAM Size: 4GB
Connector Type: Pin(s)
Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I

2.4GHz

4GB eMMC, 128MB QSPI

4GB

Pin(s)

2.362" L x 2.047" W (60.00mm x 52.00mm)

-40°C ~ 85°C

TE0803-03-5DI21-A

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

MA-MA3-C6-7I-D10-R2

Enclustra FPGA Solutions

SOM CYCLONE V 5CSXFC6 1GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Cyclone V SX/SE
Co-Processor: Cypress FX3 USB 3.0
Speed: 800MHz
Flash Size: 64MB
RAM Size: 1GB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock9

ARM® Cortex®-A9, Cyclone V SX/SE

Cypress FX3 USB 3.0

800MHz

64MB

1GB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

TE0714-04-52I-8-A

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A50T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

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Artix-7 A50T

Artix-7

-

16MB

-

1.570" L x 1.180" W (40.00mm x 30.00mm)

-40°C ~ 85°C

TE0820-04-4BI21KL

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

TE0807-03-5AI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

CC-WST-DW69-NM

Digi

STM32MP157DUAL GPU 512M SLC NAND

Module/Board Type: MPU
Core Processor: STM32MP157C
Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4
Speed: 650MHz, 209MHz
Flash Size: 512MB (Boot)
RAM Size: 512MB
Connector Type: Pin(s)
Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

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STM32MP157C

Arm® Dual Cortex®-A7, ARM® Cortex®-M4

650MHz, 209MHz

512MB (Boot)

512MB

Pin(s)

1.142" L x 1.142" W (29.00mm x 29.00mm)

-40°C ~ 85°C

ME-SA2-D6-7I-D11-R1

Enclustra FPGA Solutions

SOM CYCLONE V 5CSTFD6 2GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: -
Speed: 800MHz
Flash Size: 64MB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock57

ARM® Dual-Core Cortex-A9

-

800MHz

64MB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0729-02-62I63MAK

Trenz Electronic GmbH

IC SOC MODULE ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

512MB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

AM0010-02-4DE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU4EV
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

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Zynq™ UltraScale+™ ZU4EV

-

128MB

4GB

Board-to-Board (BTB) Socket

2.220" L x 1.575" W (56.40mm x 40.00mm)

0°C ~ 85°C

ME-XU7-15EG-2I-D12E-R4-1

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

ME-XU1-15EG-1E-D12E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C