Page 27 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-KD47-VM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock5 552	-	-	-	-	-	-	-	-
CC-MX-LB47-ZM-B	Digi International	MODULE I.MX51 128MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock4 800	-	-	-	-	-	-	-	-
SOMDM3730-30-1780AKIR	Logic	SYSTEM ON MODULE TORP+ DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 336	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 85°C
COMMPC8360E-10-2752FCR	Logic	KIT 256MB DDR 8MB NOR 64MB NAND Module/Board Type: MPU Core Core Processor: PowerQUICC, MPC8360E Co-Processor: - Speed: 667MHz Flash Size: 64MB (NAND), 8MB (NOR) RAM Size: 256KB Connector Type: - Size / Dimension: 3.74" x 3.74" (95mm x 95mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 800	PowerQUICC, MPC8360E	-	667MHz	64MB (NAND), 8MB (NOR)	256KB	-	3.74" x 3.74" (95mm x 95mm)	0°C ~ 70°C
101-1087	Digi International	MODULE RABBITCORE RCM 3365 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), xD-Picture Card (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 016	Rabbit 3000	-	44.2MHz	512KB (Internal), xD-Picture Card (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
DBRF5110C	Dave Embedded Systems	SYSTEM ON MODULE XC7Z020 1GB Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, XC7Z020-3 Co-Processor: Artix-7 Speed: 800MHz Flash Size: 1GB (NAND), 32MB (NOR) RAM Size: 1GB Connector Type: 3 x 140 Pins 0.6mm Pitch Size / Dimension: - Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 112	ARM? Cortex?-A9, XC7Z020-3	Artix-7	800MHz	1GB (NAND), 32MB (NOR)	1GB	3 x 140 Pins 0.6mm Pitch	-	0°C ~ 70°C
DC-SP-01-C-25	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 816	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
M5475JFEE	Logic	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: - Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 000	ColdFire V4e, MCF5475	-	266MHz	16MB	64MB	-	-	0°C ~ 70°C
CC-MX-MB47-ZM	Digi International	MODULE I.MX51 600MHZ 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 768	-	-	-	-	-	-	-	-
CC-9M-NA49-Z1	Digi International	MOD 9M 128MB SDRAM 512MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 512MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 976	ARM920T, SC2443	-	533MHz	512MB	128MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
20-101-0522	Digi International	MODULE RABBITCORE RCM3220 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 544	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
TE0600-03I	Trenz Electronic GmbH	SOM GIGABEE 2X128MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 864	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
SOMOMAPL138-10-1502QHCR	Logic	SYSTEM ON MODULE LV OMAPL138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C6748 Speed: 375MHz Flash Size: 8MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock7 824	ARM926EJ-S, OMAP-L138	TMS320C6748	375MHz	8MB	64MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
DC-ME4-01T-IPM	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 592	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
OSD3358-512M-BCB	Octavo Systems LLC	AM3358 512MB DDR3L 4KB EEPROM TP Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: 4GB RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock4 688	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	0°C ~ 85°C
TE0803-02-04CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock2 704	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0713-02-200-2C	Trenz Electronic GmbH	IC MOD ARTIX7 XC7A200T-2F 200MHZ Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-2FBG484C Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 000	Artix-7 XC7A200T-2FBG484C	-	200MHz	32MB	1GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 70°C
G400D-SM-400	GHI Electronics, LLC	IC MOD ARM926EJ-S 400MHZ 32KB Module/Board Type: MPU Core Core Processor: ARM926EJ-S Co-Processor: - Speed: 400MHz Flash Size: 4MB (External) RAM Size: 32KB (Internal), 128MB (External) Connector Type: - Size / Dimension: 2.67" x 1.26" (67.7mm x 31.9mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock8 208	ARM926EJ-S	-	400MHz	4MB (External)	32KB (Internal), 128MB (External)	-	2.67" x 1.26" (67.7mm x 31.9mm)	-40°C ~ 85°C
TE0741-03-410-2IF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
CYCLONE-10-GX	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0630-03-S001	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
MA-ZX3-20-2I-D10-R7-1	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 1GB Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 64MB, 512MB (NAND) RAM Size: 1GB Connector Type: SO-DIMM-200 Size / Dimension: 0.220" L x 0.118" W (5.60mm x 3.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock120	ARM® Cortex®-A9	Zynq-7000 (Z-7020)	-	64MB, 512MB (NAND)	1GB	SO-DIMM-200	0.220" L x 0.118" W (5.60mm x 3.00mm)	-40°C ~ 85°C
FORLINX-FET1046A-C-182GQE01IA13	Forlinx Embedded	NXP LS1046ASOM,2GB DDR4,8GB eMMC Module/Board Type: MPU Core Processor: ARM® Cortex®-A72 Co-Processor: - Speed: 1.8GHz Flash Size: 8GB eMMC, 16Mb QSPI RAM Size: 2GB Connector Type: Board-to-Board (BTB) 2 x 110 Pin Size / Dimension: 3.307" L x 2.165" W (84.00mm x 55.00mm) Operating Temperature: -40°C ~ 75°C	paquet: -	Request a Quote	ARM® Cortex®-A72	-	1.8GHz	8GB eMMC, 16Mb QSPI	2GB	Board-to-Board (BTB) 2 x 110 Pin	3.307" L x 2.165" W (84.00mm x 55.00mm)	-40°C ~ 75°C
TE0890-01-P1C-5-A	Trenz Electronic GmbH	MOD SPARTAN-7 64MB FLASH SO8W Module/Board Type: FPGA Core Core Processor: Xilinx Spartan-7 XC7S25 Co-Processor: - Speed: 100MHz Flash Size: 64Mbit RAM Size: 64Mbit Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector Size / Dimension: 1.060" L x 2.050" W (27.00mm x 52.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Xilinx Spartan-7 XC7S25	-	100MHz	64Mbit	64Mbit	Dual-pinout DIP-40 or 50mil 80 pin connector	1.060" L x 2.050" W (27.00mm x 52.00mm)	0°C ~ 70°C
ME-XU8-4CG-1E-D11E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU4CG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock165	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0630-03-82I22-A	Trenz Electronic GmbH	IC MODULE LX150 100MHZ 128MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-03-72C36-L	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A100T-2C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Artix-7 XC7A100T-2C	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0807-03-7DE21-AZ	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C

CC-WMX-KD47-VM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock5 552

-

CC-MX-LB47-ZM-B

Digi International

MODULE I.MX51 128MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock4 800

-

SOMDM3730-30-1780AKIR

Logic

SYSTEM ON MODULE TORP+ DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 336

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.3" (15mm x 33mm)

-40°C ~ 85°C

COMMPC8360E-10-2752FCR

Logic

KIT 256MB DDR 8MB NOR 64MB NAND

Module/Board Type: MPU Core
Core Processor: PowerQUICC, MPC8360E
Co-Processor: -
Speed: 667MHz
Flash Size: 64MB (NAND), 8MB (NOR)
RAM Size: 256KB
Connector Type: -
Size / Dimension: 3.74" x 3.74" (95mm x 95mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 800

PowerQUICC, MPC8360E

-

667MHz

64MB (NAND), 8MB (NOR)

256KB

-

3.74" x 3.74" (95mm x 95mm)

0°C ~ 70°C

101-1087

Digi International

MODULE RABBITCORE RCM 3365

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), xD-Picture Card (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 016

Rabbit 3000

-

44.2MHz

512KB (Internal), xD-Picture Card (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

DBRF5110C

Dave Embedded Systems

SYSTEM ON MODULE XC7Z020 1GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, XC7Z020-3
Co-Processor: Artix-7
Speed: 800MHz
Flash Size: 1GB (NAND), 32MB (NOR)
RAM Size: 1GB
Connector Type: 3 x 140 Pins 0.6mm Pitch
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 112

ARM? Cortex?-A9, XC7Z020-3

Artix-7

800MHz

1GB (NAND), 32MB (NOR)

1GB

3 x 140 Pins 0.6mm Pitch

-

0°C ~ 70°C

DC-SP-01-C-25

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 816

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

M5475JFEE

Logic

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 000

ColdFire V4e, MCF5475

-

266MHz

16MB

64MB

-

0°C ~ 70°C

CC-MX-MB47-ZM

Digi International

MODULE I.MX51 600MHZ 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 768

-

CC-9M-NA49-Z1

Digi International

MOD 9M 128MB SDRAM 512MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 512MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 976

ARM920T, SC2443

-

533MHz

512MB

128MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

20-101-0522

Digi International

MODULE RABBITCORE RCM3220

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 544

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

TE0600-03I

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 864

Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

SOMOMAPL138-10-1502QHCR

Logic

SYSTEM ON MODULE LV OMAPL138

Module/Board Type: MPU, DSP Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C6748
Speed: 375MHz
Flash Size: 8MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock7 824

ARM926EJ-S, OMAP-L138

TMS320C6748

375MHz

8MB

64MB

Board-to-Board (BTB) Socket - 300

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

DC-ME4-01T-IPM

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 592

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

OSD3358-512M-BCB

Octavo Systems LLC

AM3358 512MB DDR3L 4KB EEPROM TP

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: 400-BGA
Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock4 688

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

4GB

512MB

400-BGA

1.06" x 1.06" (27.0mm x 27.0mm)

0°C ~ 85°C

TE0803-02-04CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock2 704

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0713-02-200-2C

Trenz Electronic GmbH

IC MOD ARTIX7 XC7A200T-2F 200MHZ

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-2FBG484C
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 000

Artix-7 XC7A200T-2FBG484C

-

200MHz

32MB

1GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 70°C

G400D-SM-400

GHI Electronics, LLC

IC MOD ARM926EJ-S 400MHZ 32KB

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S
Co-Processor: -
Speed: 400MHz
Flash Size: 4MB (External)
RAM Size: 32KB (Internal), 128MB (External)
Connector Type: -
Size / Dimension: 2.67" x 1.26" (67.7mm x 31.9mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock8 208

ARM926EJ-S

-

400MHz

4MB (External)

32KB (Internal), 128MB (External)

-

2.67" x 1.26" (67.7mm x 31.9mm)

-40°C ~ 85°C

TE0741-03-410-2IF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Xilinx Kintex-7 FPGA XC7K410T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

CYCLONE-10-GX

Intel

PROTOTYPE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

TE0630-03-S001

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

MA-ZX3-20-2I-D10-R7-1

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 1GB

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 64MB, 512MB (NAND)
RAM Size: 1GB
Connector Type: SO-DIMM-200
Size / Dimension: 0.220" L x 0.118" W (5.60mm x 3.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock120

ARM® Cortex®-A9

Zynq-7000 (Z-7020)

-

64MB, 512MB (NAND)

1GB

SO-DIMM-200

0.220" L x 0.118" W (5.60mm x 3.00mm)

-40°C ~ 85°C

FORLINX-FET1046A-C-182GQE01IA13

Forlinx Embedded

NXP LS1046ASOM,2GB DDR4,8GB eMMC

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A72
Co-Processor: -
Speed: 1.8GHz
Flash Size: 8GB eMMC, 16Mb QSPI
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) 2 x 110 Pin
Size / Dimension: 3.307" L x 2.165" W (84.00mm x 55.00mm)
Operating Temperature: -40°C ~ 75°C

paquet: -

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ARM® Cortex®-A72

-

1.8GHz

8GB eMMC, 16Mb QSPI

2GB

Board-to-Board (BTB) 2 x 110 Pin

3.307" L x 2.165" W (84.00mm x 55.00mm)

-40°C ~ 75°C

TE0890-01-P1C-5-A

Trenz Electronic GmbH

MOD SPARTAN-7 64MB FLASH SO8W

Module/Board Type: FPGA Core
Core Processor: Xilinx Spartan-7 XC7S25
Co-Processor: -
Speed: 100MHz
Flash Size: 64Mbit
RAM Size: 64Mbit
Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector
Size / Dimension: 1.060" L x 2.050" W (27.00mm x 52.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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Xilinx Spartan-7 XC7S25

-

100MHz

64Mbit

Dual-pinout DIP-40 or 50mil 80 pin connector

1.060" L x 2.050" W (27.00mm x 52.00mm)

0°C ~ 70°C

ME-XU8-4CG-1E-D11E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU4CG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock165

ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0630-03-82I22-A

Trenz Electronic GmbH

IC MODULE LX150 100MHZ 128MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

TE0712-03-72C36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A100T-2C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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Artix-7 XC7A100T-2C

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0807-03-7DE21-AZ

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C