Page 23 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs

Dossiers 1 650
Page  23/59
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
TE0600-02IVF
Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 328
Spartan-6 LX-150
-
125MHz
16MB
256MB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
CC-MX-LD79-QTC-1
Digi International

CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock4 960
-
-
-
-
-
-
-
-
SOMDM3730-31-1780AKIR
Logic

SYSTEM ON MODULE WIRELESS TORP

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 192
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
800MHz
512MB
256MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.3" (15mm x 33mm)
-40°C ~ 85°C
FS-3026
Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock6 656
-
-
-
-
-
-
-
-
CC-9C-V226-ZA-B
Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 64MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock5 808
ARM926EJ-S, NS9360
-
155MHz
64MB
32MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
CENGLH79524-10-403HCR
Logic

CARD ENGINE 16MB FLASH 32MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM720T, LH79524
  • Co-Processor: -
  • Speed: 77.4MHz
  • Flash Size: 16MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 400
ARM720T, LH79524
-
77.4MHz
16MB
32MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
FS-365
Digi International

MODULE A9M2410 32MB SDRAM FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock5 456
-
-
-
-
-
-
-
-
101-0675
Digi International

MODULE RABBITCORE RCM3710

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: IDC Header 2x20
  • Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 848
Rabbit 3000
-
22.1MHz
256KB
128KB
IDC Header 2x20
1.2" x 2.95" (30mm x 75mm)
0°C ~ 70°C
CC-MX-L86C-Z1
Digi International

MOD WI-I.MX6 50 PCS PACK

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A9, i.MX6Dual
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 4GB
  • RAM Size: 512MB
  • Connector Type: -
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock3 696
ARM? Cortex?-A9, i.MX6Dual
-
800MHz
4GB
512MB
-
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
DC-ME-01T-NS-50
Digi International

MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock2 832
-
-
-
-
-
-
-
-
L138-FG-226-RC
Critical Link LLC

MITYDSP-L138F W/ OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
  • Speed: 456MHz
  • Flash Size: 512MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock5 552
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
456MHz
512MB (NAND), 8MB (NOR)
8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
SO-DIMM-200
2.66" x 2" (67.6mm x 50.8mm)
0°C ~ 70°C
CC-MX-LC47-Z1
Digi International

MODULE I.MX51 I.MX512 800MHZ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock4 944
-
-
-
-
-
-
-
-
DC-ME-01T-JT
Digi International

MODULE ME CUSTOMIZABLE JTAG

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock3 264
ARM7TDMI, NS7520
-
55MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
100-1254-2
Bluetechnix GmbH

MODULE BF527-C-C-Q50S64F8

  • Module/Board Type: MPU Core
  • Core Processor: CM-BF527
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 8MB
  • RAM Size: 64MB
  • Connector Type: Expansion 2 x 60
  • Size / Dimension: 1.22" x 1.42" (31mm x 36mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 336
CM-BF527
-
600MHz
8MB
64MB
Expansion 2 x 60
1.22" x 1.42" (31mm x 36mm)
0°C ~ 70°C
CC-MX-K650-Z1-1
Digi International

RF MODULE CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock2 640
-
-
-
-
-
-
-
-
TE0713-01-200-2C
Trenz Electronic GmbH

SOM ARTIX-7 XC7A200T-2C 1GB DDR3

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock7 984
Artix-7 A200T
-
200MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
ATSAMA5D27-SOM1
Microchip Technology

SAMA5D2 SYST.ON MODULE 1

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A5
  • Co-Processor: -
  • Speed: 500MHz
  • Flash Size: 64Mb Flash, 1Kb EEPROM
  • RAM Size: 1Gb (128K x 8)
  • Connector Type: Edge Connector
  • Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C (TA)
paquet: -
Stock6 792
ARM® Cortex®-A5
-
500MHz
64Mb Flash, 1Kb EEPROM
1Gb (128K x 8)
Edge Connector
1.18" x 1.57" (30mm x 40mm)
-40°C ~ 85°C (TA)
TE0803-02-04EG-1E3
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Stock5 840
Zynq UltraScale+ XCZU4EG-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
A10S-P9-X5E-RC-SA
Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 6GB

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A9, Arria 10 SX
  • Co-Processor: NEON™ SIMD
  • Speed: 1.2GHz
  • Flash Size: -
  • RAM Size: 6GB
  • Connector Type: Board-to-Board (BTB)
  • Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock2 416
ARM® Cortex®-A9, Arria 10 SX
NEON™ SIMD
1.2GHz
-
6GB
Board-to-Board (BTB)
4" x 4" (101.5mm x 101.5mm)
0°C ~ 70°C
TE0725LP-01-72C-1T
Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 25MHZ 64MB

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 25MHz
  • Flash Size: 64MB
  • RAM Size: -
  • Connector Type: 50 Pin
  • Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock3 136
Artix-7 A100T
-
25MHz
64MB
-
50 Pin
2.87" x 1.38" (73mm x 35mm)
0°C ~ 70°C
L138-FG-325-RC
Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 16MB (NOR)
  • RAM Size: 128MB
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
456MHz
256MB (NAND), 16MB (NOR)
128MB
SO-DIMM-200
2.660" L x 2.000" W (67.60mm x 50.80mm)
0°C ~ 70°C
MYC-C7Z020-V2-4E1D-766-I
MYIR Tech Limited

System-On-Module, Zynq-7020

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: 866MHz
  • Flash Size: 4GB eMMC, 32MB QSPI
  • RAM Size: 1GB
  • Connector Type: Pin(s)
  • Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A9
Zynq-7000 (Z-7020)
866MHz
4GB eMMC, 32MB QSPI
1GB
Pin(s)
2.953" L x 2.165" W (75.00mm x 55.00mm)
-40°C ~ 85°C
CR00107-01
Trenz Electronic GmbH

CRUVI CARRIER BOARD WITH AMD SPA

  • Module/Board Type: FPGA
  • Core Processor: Spartan-7
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB QSPI
  • RAM Size: 8MB
  • Connector Type: USB
  • Size / Dimension: 2.264" L x 1.766" W (57.50mm x 44.85mm)
  • Operating Temperature: -
paquet: -
Request a Quote
Spartan-7
-
100MHz
32MB QSPI
8MB
USB
2.264" L x 1.766" W (57.50mm x 44.85mm)
-
TE0724-04-61I32-A
Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ XC7Z020-1CLG400I
  • Co-Processor: ARM Cortex-A9
  • Speed: 667MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: 1 x 160 Pin
  • Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Zynq™ XC7Z020-1CLG400I
ARM Cortex-A9
667MHz
32MB
1GB
1 x 160 Pin
2.362" L x 1.575" W (60.00mm x 40.00mm)
-40°C ~ 85°C
TE0820-05-2BI81ML
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-
TE0813-02-4AE81-A
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0821-01-3BE21ML
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: 2 x 100 Pin
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Zynq UltraScale+ XCZU3EG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
-
128MB
2GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
TEM0007-01-CAA11-A
Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 25T

  • Module/Board Type: FPGA
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
64MB
1GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
-