Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic GmbH |
SOM GIGABEE XC6SLX150 2X128MB 3I
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paquet: - |
Stock7 328 |
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Spartan-6 LX-150 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C |
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Digi International |
CONNECTCORE
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paquet: - |
Stock4 960 |
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- | - | - | - | - | - | - | - |
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Logic |
SYSTEM ON MODULE WIRELESS TORP
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paquet: - |
Stock6 192 |
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ARM? Cortex?-A8, DM3730 | TMS320C64x (DSP) | 800MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 0.59" x 1.3" (15mm x 33mm) | -40°C ~ 85°C |
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Digi International |
MODULE 9P 64MB SDRAM 64MB FLASH
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paquet: - |
Stock6 656 |
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- | - | - | - | - | - | - | - |
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Digi International |
MODULE 9C 32MB SDRAM 64MB FLASH
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paquet: - |
Stock5 808 |
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ARM926EJ-S, NS9360 | - | 155MHz | 64MB | 32MB | SO-DIMM-144 | 3.59" x 2.06" (91.2mm x 52.2mm) | -40°C ~ 85°C |
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Logic |
CARD ENGINE 16MB FLASH 32MB RAM
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paquet: - |
Stock4 400 |
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ARM720T, LH79524 | - | 77.4MHz | 16MB | 32MB | SO-DIMM-144 | 2.37" x 2.67" (60.2mm x 67.8mm) | 0°C ~ 70°C |
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Digi International |
MODULE A9M2410 32MB SDRAM FLASH
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paquet: - |
Stock5 456 |
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- | - | - | - | - | - | - | - |
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Digi International |
MODULE RABBITCORE RCM3710
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paquet: - |
Stock4 848 |
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Rabbit 3000 | - | 22.1MHz | 256KB | 128KB | IDC Header 2x20 | 1.2" x 2.95" (30mm x 75mm) | 0°C ~ 70°C |
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Digi International |
MOD WI-I.MX6 50 PCS PACK
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paquet: - |
Stock3 696 |
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ARM? Cortex?-A9, i.MX6Dual | - | 800MHz | 4GB | 512MB | - | 1.97" x 1.97" (50mm x 50mm) | -40°C ~ 85°C |
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Digi International |
MODULE
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paquet: - |
Stock2 832 |
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- | - | - | - | - | - | - | - |
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Critical Link LLC |
MITYDSP-L138F W/ OMAP-L138
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paquet: - |
Stock5 552 |
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ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | 456MHz | 512MB (NAND), 8MB (NOR) | 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) | SO-DIMM-200 | 2.66" x 2" (67.6mm x 50.8mm) | 0°C ~ 70°C |
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Digi International |
MODULE I.MX51 I.MX512 800MHZ
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paquet: - |
Stock4 944 |
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- | - | - | - | - | - | - | - |
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Digi International |
MODULE ME CUSTOMIZABLE JTAG
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paquet: - |
Stock3 264 |
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ARM7TDMI, NS7520 | - | 55MHz | 2MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 85°C |
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Bluetechnix GmbH |
MODULE BF527-C-C-Q50S64F8
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paquet: - |
Stock4 336 |
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CM-BF527 | - | 600MHz | 8MB | 64MB | Expansion 2 x 60 | 1.22" x 1.42" (31mm x 36mm) | 0°C ~ 70°C |
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Digi International |
RF MODULE CONNECTCORE
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paquet: - |
Stock2 640 |
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- | - | - | - | - | - | - | - |
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Trenz Electronic GmbH |
SOM ARTIX-7 XC7A200T-2C 1GB DDR3
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paquet: - |
Stock7 984 |
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Artix-7 A200T | - | 200MHz | 32MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C |
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Microchip Technology |
SAMA5D2 SYST.ON MODULE 1
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paquet: - |
Stock6 792 |
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ARM® Cortex®-A5 | - | 500MHz | 64Mb Flash, 1Kb EEPROM | 1Gb (128K x 8) | Edge Connector | 1.18" x 1.57" (30mm x 40mm) | -40°C ~ 85°C (TA) |
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Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
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paquet: - |
Stock5 840 |
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Zynq UltraScale+ XCZU4EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C |
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Critical Link LLC |
IC MODULE CORTEX-A9 1.2GHZ 6GB
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paquet: - |
Stock2 416 |
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ARM® Cortex®-A9, Arria 10 SX | NEON™ SIMD | 1.2GHz | - | 6GB | Board-to-Board (BTB) | 4" x 4" (101.5mm x 101.5mm) | 0°C ~ 70°C |
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Trenz Electronic GmbH |
IC MOD ARTIX-7 A100T 25MHZ 64MB
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paquet: - |
Stock3 136 |
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Artix-7 A100T | - | 25MHz | 64MB | - | 50 Pin | 2.87" x 1.38" (73mm x 35mm) | 0°C ~ 70°C |
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Critical Link LLC |
MITYDSP-L138F SOM W/ OMAP-L138
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paquet: - |
Request a Quote |
|
ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | 456MHz | 256MB (NAND), 16MB (NOR) | 128MB | SO-DIMM-200 | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 0°C ~ 70°C |
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MYIR Tech Limited |
System-On-Module, Zynq-7020
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paquet: - |
Request a Quote |
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ARM® Cortex®-A9 | Zynq-7000 (Z-7020) | 866MHz | 4GB eMMC, 32MB QSPI | 1GB | Pin(s) | 2.953" L x 2.165" W (75.00mm x 55.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
CRUVI CARRIER BOARD WITH AMD SPA
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paquet: - |
Request a Quote |
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Spartan-7 | - | 100MHz | 32MB QSPI | 8MB | USB | 2.264" L x 1.766" W (57.50mm x 44.85mm) | - |
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Trenz Electronic GmbH |
SOC MODULE WITH XILINX ZYNQ XC7Z
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paquet: - |
Request a Quote |
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Zynq™ XC7Z020-1CLG400I | ARM Cortex-A9 | 667MHz | 32MB | 1GB | 1 x 160 Pin | 2.362" L x 1.575" W (60.00mm x 40.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
MPSOC MODULE WITH XILINX ZYNQ UL
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paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
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Trenz Electronic GmbH |
MPSOC MODULE WITH AMD ZYNQ ULTRA
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paquet: - |
Request a Quote |
|
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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Trenz Electronic GmbH |
MPSOC MODULE WITH XILINX ZYNQ UL
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paquet: - |
Request a Quote |
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Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
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Trenz Electronic GmbH |
MICROCHIP POLARFIRE SOC FPGA 25T
|
paquet: - |
Request a Quote |
|
- | - | - | 64MB | 1GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - |