Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Logic |
MODULE FIRE ENGINE
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paquet: - |
Stock2 304 |
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- | - | - | - | - | - | - | - |
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Trenz Electronic GmbH |
SOM GIGABEE XC6SLX100 2X512MB 2I
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paquet: - |
Stock7 504 |
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Spartan-6 LX-100 | - | 125MHz | 16MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C |
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Logic |
SOM TORPEDO WIRELESS 800MHZ IND
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paquet: - |
Stock5 792 |
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ARM? Cortex?-A8, DM3730 | TMS320C64x (DSP) | 800MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 0.59" x 1.3" (15mm x 33mm) | -40°C ~ 85°C |
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Digi International |
MOD 9P 32MB SDRAM 8MB FLASH
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paquet: - |
Stock2 496 |
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- | - | - | - | - | - | - | - |
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Logic |
SYSTEM ON MODULE LV OMAPL138
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paquet: - |
Stock5 776 |
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ARM926EJ-S, OMAP-L138 | TMS320C6748 | 375MHz | 8MB | 128MB | Board-to-Board (BTB) Socket - 300 | 1.18" x 1.57" (30mm x 40mm) | 0°C ~ 70°C |
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Digi International |
MODULE MEMORY CORE RCM3365
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paquet: - |
Stock5 536 |
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Rabbit 3000 | - | 44.2MHz | 512KB (Internal), 32MB (External) | 1MB | 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card | 1.85" x 2.73" (47mm x 69mm) | 0°C ~ 70°C |
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Digi International |
MODULE RABBITCORE RCM3300
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paquet: - |
Stock6 944 |
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Rabbit 3000 | - | 44.2MHz | 512KB (Internal), 8MB (External) | 1MB | 2 IDC Headers 2x17, 1 IDC Header 2x5 | 1.85" x 2.73" (47mm x 69mm) | -40°C ~ 70°C |
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Digi International |
MODULE I.MX51 800MHZ 256MB FLASH
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paquet: - |
Stock7 248 |
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- | - | - | - | - | - | - | - |
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Digi International |
MOD ME 9210 8MB SDRAM 4MB FLASH
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paquet: - |
Stock4 480 |
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ARM926EJ-S, NS9210 | - | 75MHz | 4MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 80°C |
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Trenz Electronic GmbH |
SOM ZYNQ Z-7012S 1GB DDR3L SDRAM
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paquet: - |
Stock4 976 |
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ARM Cortex-A9 | Zynq-7000 (Z-7012S) | 766MHz | 32MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C |
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Trenz Electronic GmbH |
SOM FPGA ARTIX-7 35T FLASH 2C
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paquet: - |
Stock6 544 |
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Artix-7 A35T | - | 100MHz | 32MB | - | 50 Pin | 2.87" x 1.38" (73mm x 35mm) | 0°C ~ 70°C |
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Digi International |
ME 8MB SDRAM 2MB FLASH SINGLE
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paquet: - |
Stock8 256 |
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ARM7TDMI, NS7520 | - | 55MHz | 2MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 85°C |
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Critical Link LLC |
MITYDSP-L138F SOM OMAP-L138
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paquet: - |
Stock6 744 |
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ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | 375MHz | 256MB (NAND), 8MB (NOR) | 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) | SO-DIMM-200 | 2.66" x 2" (67.6mm x 50.8mm) | -40°C ~ 85°C |
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Digi International |
MODULE RABBITCORE RCM3610
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paquet: - |
Stock8 628 |
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Rabbit 3000 | - | 22.1MHz | 256KB | 128KB | IDC Header 2x20 | 1.23" x 2.11" (31mm x 54mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
SOM ZYNQ SOFT PROPELLER 40DIP
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paquet: - |
Stock6 096 |
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ARM Cortex-A9 | Zynq-7000 (Z-7010) | 33MHz | 16MB | - | 40 Pin | 0.71" x 2.01" (18mm x 51mm) | -40°C ~ 85°C |
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Digi International |
MODULE RABBITCORE RCM3365
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paquet: - |
Stock6 016 |
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Rabbit 3000 | - | 44.2MHz | 512KB (Internal), 32MB (External) | 1MB | 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card | 1.85" x 2.73" (47mm x 69mm) | 0°C ~ 70°C |
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Digi International |
MODULE DIGI CONNECT ME
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paquet: - |
Stock3 216 |
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- | - | - | - | - | - | - | - |
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Trenz Electronic GmbH |
MOD MPSOC 2GB DDR4
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paquet: - |
Request a Quote |
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ARM® Cortex®-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 128MB | 2GB | Pin(s) | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
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Forlinx Embedded |
NXP LS1028ASOM,2GB DDR4,8GB eMMC
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paquet: - |
Request a Quote |
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ARM® Cortex®-A72 | - | 1.5GHz | 8GB eMMC, 16Mb QSPI | 2GB | Board-to-Board (BTB) Socket - 160 | 1.653" L x 2.559" W (42.00mm x 65.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
MOD SOM DDR3L 1GB
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paquet: - |
Request a Quote |
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ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
MODULE FPGA KINTEX
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paquet: - |
Request a Quote |
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Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
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Trenz Electronic GmbH |
DIPFORTY1 "SOFT PROPELLER" MIT A
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paquet: - |
Request a Quote |
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ARM Cortex-A9 | Xilinx Zynq 7: XC7Z007S-1CLG225C | - | 16MB | - | 2 x 20 Pin | 2.008" L x 0.709" W (51.00mm x 18.00mm) | 0°C ~ 70°C |
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Beacon EmbeddedWorks |
SYSTEM ON MODULE DM3730
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paquet: - |
Request a Quote |
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- | - | - | - | - | - | - | - |
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Trenz Electronic GmbH |
IC MODULE GIGABEE
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paquet: - |
Request a Quote |
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Spartan-6 LX-45 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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iWave Systems |
ZU4CG (-1 Speed) MPSoC SOM
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paquet: - |
Request a Quote |
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ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | ARM® Mali 400 MP2 | 1.5GHz, 600MHz | 8GB eMMC | 4GB, 1GB | 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
FPGA MODULE ARTIX7
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paquet: - |
Request a Quote |
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Artix-7 A200T | - | 200MHz | 32MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
MOD SOM DDR3L 1GB
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paquet: - |
Request a Quote |
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ARM Cortex-A9 | Zynq-7000 (Z-7035) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
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Trenz Electronic GmbH |
MPSOC MODULE WITH ZYNQ ULTRASCAL
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paquet: - |
Request a Quote |
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Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I | - | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | 0°C ~ 85°C |
