Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock5 776 |
|
1 | 2:1 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 500MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 32-VFQFN Exposed Pad |
Stock2 416 |
|
1 | 2:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL | LVCMOS, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 40-VFQFN Exposed Pad |
Stock3 792 |
|
2 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 36-WFQFN Exposed Pad |
Stock4 720 |
|
1 | 3:6 | Yes/Yes | HCSL, HSTL, LVDS, LVPECL, Crystal | HCSL, LVDS, LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 36-WFQFN Exposed Pad | 36-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock3 840 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 48-VFQFN Exposed Pad |
Stock2 464 |
|
1 | 1:12 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 32-TQFP Exposed Pad |
Stock2 592 |
|
1 | 1:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 2.7GHz | 2.5V, 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
paquet: 20-VFQFN Exposed Pad |
Stock2 480 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 32-VFQFN Exposed Pad |
Stock5 872 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32TQFP
|
paquet: 32-LQFP |
Stock3 600 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-VFQFN Exposed Pad |
Stock6 640 |
|
2 | 2:4 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 64-TQFP
|
paquet: 64-LQFP Exposed Pad |
Stock5 440 |
|
1 | 1:20 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 650MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 16VFQFPN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 120 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVCMOS, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-VFQFN Exposed Pad |
Stock5 888 |
|
2 | 3:3 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32VFQFPN
|
paquet: 32-VFQFN Exposed Pad |
Stock4 368 |
|
1 | 2:8 | Yes/Yes | - | CML, HCSL, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 40-VFQFN Exposed Pad |
Stock2 160 |
|
1 | 1:12 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 64-TQFP
|
paquet: 64-LQFP Exposed Pad |
Stock2 224 |
|
1 | 1:20 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 650MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 28-WFQFN Exposed Pad |
Stock7 664 |
|
2 | 1:4 | No/No | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 28-LCC (J-Lead) |
Stock6 224 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 16-VFQFPN
|
paquet: 16-WFQFN Exposed Pad |
Stock7 040 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-WFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-VFQFN Exposed Pad |
Stock5 760 |
|
2 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING 32VFQFPN
|
paquet: 32-VFQFN Exposed Pad |
Stock6 240 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING
|
paquet: 20-VFQFN Exposed Pad |
Stock2 784 |
|
1 | 1:4 | Yes/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 1.65 V ~ 1.95 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 16-VFQFN Exposed Pad |
Stock5 168 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
paquet: 32-VFQFN Exposed Pad |
Stock2 592 |
|
1 | 1:8 | Yes/Yes | HCSL, LVPECL | HCSL | 350MHz | 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 28-VFQFPN
|
paquet: 28-WFQFN Exposed Pad |
Stock4 000 |
|
1 | 2:8 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER MUX 2:4 24-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock4 432 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING 32VFQFPN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 520 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |