Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2.1GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock6 416 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2.1GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 16:1 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock3 376 |
|
1 | 16:1 | No/Yes | LVCMOS, LVTTL | LVDS, LVPECL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 16:1 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock4 848 |
|
1 | 16:1 | No/Yes | LVCMOS, LVTTL | LVDS, LVPECL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 984 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 520 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 968 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock6 528 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 056 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 328 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock3 552 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 696 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 176 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 208 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 1.3GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock3 648 |
|
8 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1.3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 1.3GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock5 584 |
|
8 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1.3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 864 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock3 568 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 872 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock6 464 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 616 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 616 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 680 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
paquet: 16-VFQFN Exposed Pad |
Stock7 408 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock4 464 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 704 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 2GHZ 32TQFP
|
paquet: 32-LQFP |
Stock3 232 |
|
2 | 1:5 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 8:1 2.5GHZ 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock3 728 |
|
1 | 8:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |