Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 100 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 330 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock5 706 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 968 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 280 |
|
- | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock7 632 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 718 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 304 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 780 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock4 734 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 370 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock2 214 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 444 |
|
74.17582MHz, 74.25MHz, 148.35165MHz, 148.5MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 748 |
|
25MHz, 75MHz, 125MHz, 150MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 892 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURALBE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 066 |
|
100MHz, 125MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
IDT, Integrated Device Technology Inc |
IC ENHANCED OSCILLATOR 10-PIN
|
paquet: - |
Stock8 154 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC ENHANCED OSCILLATOR 10-PIN
|
paquet: - |
Stock7 794 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC OSCILLATOR QUAD MEMS 10PIN
|
paquet: - |
Stock2 916 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
OSCILLATOR VCSO CONFIGURABLE
|
paquet: 6-SMD, No Lead |
Stock5 148 |
|
644.5313MHz, 693.483MHz | - | - | LVPECL | 3.3V | ±100ppm | -40°C ~ 85°C | 125mA | 0.295" L x 0.197" W (7.50mm x 5.00mm) | 0.104" (2.64mm) | 6-SMD, No Lead |
||
Silicon Labs |
OSC XO 644.53125MHZ LVDS SMD
|
paquet: 6-SMD, No Lead |
Stock4 608 |
|
644.53125MHz, 698.812334MHz | - | Enable/Disable | LVDS | 2.5V | ±7ppm | -40°C ~ 85°C | 98mA | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.071" (1.80mm) | 6-SMD, No Lead |
||
Silicon Labs |
OSC VCXO 74.1758MHZ CMOS SMD
|
paquet: 6-SMD, No Lead |
Stock2 412 |
|
74.175824MHz, 74.25MHz | - | Enable/Disable | CMOS | 3.3V | ±20ppm | -40°C ~ 85°C | 98mA | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.071" (1.80mm) | 6-SMD, No Lead |
||
EPSON |
OSC DUAL FREQ SMD
|
paquet: 6-SMD, No Lead |
Stock8 766 |
|
156.25MHz | 625MHz | Enable/Disable | LVPECL | 2.5 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 90mA | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.059" (1.50mm) | 6-SMD, No Lead |
||
EPSON |
OSC DUAL FREQ SMD
|
paquet: 6-SMD, No Lead |
Stock5 886 |
|
100MHz | 125MHz | Enable/Disable | LVPECL | 2.5 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 90mA | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.059" (1.50mm) | 6-SMD, No Lead |
||
Cardinal Components Inc. |
OSC 2.7V 3.6864/ 3.6874 MHZ
|
paquet: 4-SMD, No Lead |
Stock6 660 |
|
3.6864MHz, 3.6874MHz | - | Enable/Disable | CMOS | 2.7V | ±25ppm | -40°C ~ 85°C | 20mA | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.051" (1.30mm) | 4-SMD, No Lead |
||
Abracon LLC |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-VFQFN Exposed Pad |
Stock3 096 |
|
106.25MHz, 125MHz, 155.52MHz, 156.25MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad |
||
Abracon LLC |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-VFQFN Exposed Pad |
Stock8 406 |
|
106.25MHz, 125MHz, 156.25MHz, 212.5MHz | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 58mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad |
||
Abracon LLC |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-VFQFN Exposed Pad |
Stock7 176 |
|
24MHz, 27MHz, 74.25MHz, 148.5MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad |