Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 118 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock6 876 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 286 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock7 128 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 790 |
|
80MHz, 100MHz | 25MHz, 80MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 210 |
|
25MHz, 75MHz | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock3 762 |
|
25MHz, 27MHz | 24MHz, 125MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 878 |
|
24MHz | 100MHz, 200MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 402 |
|
- | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 490 |
|
125MHz, 156.25MHz | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 42mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 934 |
|
24MHz, 25MHz, 27MHz, 48MHz, 50MHz, 54MHz | 24MHz, 27MHz, 50MHz, 54MHz, 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 226 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 986 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 454 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock8 298 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 768 |
|
75MHz, 100MHz, 125MHz, 150MHz | 75MHz, 100MHz, 125MHz, 150MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 60mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock7 488 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock7 956 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 822 |
|
100MHz, 125MHz, 148.5MHz, 150MHz, 156.25MHz, 400MHz | 25MHz, 50MHz, 74.25MHz, 75MHz, 125MHz, 200MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock3 006 |
|
127MHz | 127MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURALBE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock5 130 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Silicon Labs |
OSC PROG 2.5NS 50PPM 2X2.5MM
|
paquet: 4-SMD, No Lead |
Stock8 964 |
|
22.5792MHz, 24.576MHz | - | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 4.9mA | 0.079" L x 0.098" W (2.00mm x 2.50mm) | 0.035" (0.90mm) | 4-SMD, No Lead |
||
IDT, Integrated Device Technology Inc |
IC ENHANCED OSCILLATOR 10-PIN
|
paquet: - |
Stock4 590 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
OSCILLATOR VCSO CONFIGURABLE
|
paquet: 6-SMD, No Lead |
Stock5 688 |
|
644.5313MHz, 657.4219MHz | - | - | LVPECL | 3.3V | ±100ppm | -40°C ~ 85°C | 125mA | 0.295" L x 0.197" W (7.50mm x 5.00mm) | 0.104" (2.64mm) | 6-SMD, No Lead |
||
IDT, Integrated Device Technology Inc |
OSCILLATOR VCSO CONFIGURABLE
|
paquet: 6-SMD, No Lead |
Stock2 736 |
|
622.08MHz, 669.3266MHz | - | - | LVPECL | 3.3V | ±100ppm | -40°C ~ 85°C | 125mA | 0.295" L x 0.197" W (7.50mm x 5.00mm) | 0.104" (2.64mm) | 6-SMD, No Lead |
||
EPSON |
OSC QUAD FREQ SMD
|
paquet: 8-SMD, No Lead |
Stock4 554 |
|
100MHz, 125MHz, 156.25MHz, 312.5MHz | - | Enable/Disable | LVPECL | 2.5 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 90mA | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.059" (1.50mm) | 8-SMD, No Lead |
||
Abracon LLC |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-VFQFN Exposed Pad |
Stock7 866 |
|
100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 60mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad |
||
Abracon LLC |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-VFQFN Exposed Pad |
Stock7 848 |
|
100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad |