Page 5 - Supports pour CI, transistors - Adaptateurs | Connecteurs, interconnexions | Heisener Electronics
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Supports pour CI, transistors - Adaptateurs

Dossiers 353
Page  5/13
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
84-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 84
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock4 734
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1110267-N
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.9

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
  • Number of Pins: 68
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 550
DIP, 0.9" (22.86mm) Row Spacing
68
-
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-450001-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 28DIP 0.4

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock4 302
DIP, 0.4" (10.16mm) Row Spacing
28
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
68-304538-10
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock3 436
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-652000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock4 050
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
68-505-110-RC-P
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock7 164
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-352000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 20DIP 0.3

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 208
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
240-3639-09-0602J
3M

RECEPTACLE DIP SOCKET 40POS 1.0"

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
paquet: -
Stock6 480
-
-
-
-
-
-
-
-
-
-
24-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 24SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 24
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
paquet: -
Stock3 420
SOIC
24
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-354W00-20
Aries Electronics

DIP-TO-SOWIC ADAPTER

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 20
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
paquet: -
Stock2 592
SOWIC
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock7 758
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
14-665000-00
Aries Electronics

SCK ADAPT 14P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock6 624
SOIC
14
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
10-665000-00
Aries Electronics

SCK ADAPT 10P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 10
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 910
SOIC
10
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
08-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 8SOWIC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock5 040
SOWIC
8
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
18-35W000-10-P
Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock3 942
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
LCQT-TSOP40
Aries Electronics

SOCKET ADAPTER TSOP TO 40DIP

  • Convert From (Adapter End): TSOP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock7 182
DIP, 0.6" (15.24mm) Row Spacing
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
08-350000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
paquet: -
Stock4 464
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
228-1277-39-0602J
3M

RECEPTACLE DIP SOCKET 28POS .6"

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
paquet: -
Stock8 406
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
PA-QLD6SM18-32F-88
Logical Systems Inc.

ADAPTER 32QFN TO 32DIP

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
paquet: -
Stock2 574
-
-
-
-
-
-
-
-
-
-
224-1275-39-0602J
3M

RECEPTACLE DIP SOCKET 24POS .6"

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
paquet: -
Stock6 804
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
214-3339-09-0602J
3M

SOCKET ADAPTER 14DIP TO 14DIP

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
paquet: -
Stock6 192
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
LCQT-SOIC32W
Aries Electronics

SOCKET ADAPTER SOIC-W TO 32DIP

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 892
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
PA-SOD3SM18-20
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 20DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
paquet: -
Stock7 398
DIP
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
LCQT-SOIC14
Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 208
DIP, 0.6" (15.24mm) Row Spacing
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
LCQT-TSSOP14
Aries Electronics

SOCKET ADAPTER TSSOP TO 14DIP

  • Convert From (Adapter End): TSSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock8 640
DIP, 0.3" (7.62mm) Row Spacing
14
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
08-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
paquet: -
Stock80 514
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
PA-SOD3SM18-14
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 14DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
paquet: -
Stock6 888
DIP
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
LCQT-SOIC8-8
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
paquet: -
Stock20 952
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass