Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
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Molex, LLC |
HS DOCK FIXED CONN 144CKT 8.74CL
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paquet: - |
Stock5 724 |
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Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 144 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
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Molex, LLC |
FY05MINI FIT 3CKTS RA HDR FOR HP
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paquet: - |
Stock5 868 |
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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Amphenol FCI |
HEADER BERGSTIK
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paquet: - |
Stock7 992 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 48 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.615" (15.62mm) | 0.110" (2.79mm) | 0.825" (20.95mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
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Amphenol FCI |
HEADER BERGSTIK
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paquet: - |
Stock3 060 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 34 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.400" (10.16mm) | - | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
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Amphenol FCI |
HEADER BERGSTIK
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paquet: - |
Stock2 214 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 60 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.120" (3.05mm) | 0.470" (11.94mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
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Amphenol FCI |
BERGSTIK II DR STRAIGHT RET
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paquet: - |
Stock3 508 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 26 | All | 2 | 0.100" (2.54mm) | Through Hole | Kinked Pin, Solder | Push-Pull | 0.318" (8.08mm) | 0.120" (3.05mm) | 0.538" (13.67mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | Polycyclohexylenedimethylene Terephthalate (PCT) | - | - | - | UL94 V-0 | Black |
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TE Connectivity Aerospace, Defense and Marine |
CONN HEADER 60POS DL R/A GOLD
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paquet: - |
Stock5 562 |
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Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Shrouded - 3 Wall | 60 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | - | 0.180" (4.59mm) | 0.135" (3.43mm) | - | 0.330" (8.38mm) | Square | Gold | 50µin (1.27µm) | Tin-Lead | Brass | Polyester, Glass Filled | Mating Guide, Mounting Flange | - | - | - | Blue |
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Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
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paquet: - |
Stock3 330 |
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Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 100 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | 0.120" (3.05mm) | - | - | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Samtec Inc. |
CONN HEADER 78POS DUAL .05" T/H
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paquet: - |
Stock6 588 |
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Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 78 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | 0.065" (1.65mm) | 0.090" (2.29mm) | 0.189" (4.80mm) | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
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paquet: - |
Stock8 946 |
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Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 50 | 49 | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | - | - | 0.500" (12.70mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Keying Slot | -55°C ~ 125°C | - | - | Black |
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Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
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paquet: - |
Stock3 438 |
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Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 30 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | - | - | 0.500" (12.70mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Keying Slot | -55°C ~ 125°C | - | - | Black |
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Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
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paquet: - |
Stock3 526 |
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Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 50 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | 0.120" (3.05mm) | - | 0.500" (12.70mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | - | - | Natural |
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Samtec Inc. |
1MM SURFACE MOUNT STRIP
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paquet: - |
Stock6 282 |
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Male Pin | 0.039" (1.00mm) | Board to Board | Shrouded - 4 Wall | 35 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.065" (1.65mm) | - | - | 0.168" (4.27mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, End Shrouds, Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Samtec Inc. |
1MM MICRO TERMINAL STRIPS
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paquet: - |
Stock8 892 |
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Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 60 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | - | 0.075" (1.90mm) | - | - | 0.059" (1.50mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds | -55°C ~ 125°C | - | UL94 V-0 | Black |
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TE Connectivity AMP Connectors |
CONN HEADER 23POS R/A .100 GOLD
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paquet: - |
Stock6 120 |
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Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Unshrouded | 23 | All | 1 | - | Through Hole, Right Angle | Solder | - | 0.295" (7.49mm) | 0.140" (3.56mm) | - | 0.100" (2.54mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Thermoplastic | - | -55°C ~ 105°C | - | UL94 V-0 | Natural |
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Samtec Inc. |
1MM MICRO STRIPS
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paquet: - |
Stock8 784 |
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Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 20 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | - | 0.065" (1.65mm) | - | - | 0.038" (0.97mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds, Pick and Place | -55°C ~ 125°C | - | - | Black |
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Samtec Inc. |
SMT .050'' STRIPS
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paquet: - |
Stock8 370 |
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Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 38 | All | 1 | - | Surface Mount | Solder | - | 0.405" (10.29mm) | - | - | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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3M |
CONN HEADER 18POS DUAL .100 STR
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paquet: - |
Stock7 380 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.318" (8.08mm) | 0.110" (2.79mm) | 0.528" (13.42mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Gold | Copper Alloy | Polybutylene Terephthalate (PBT), Polyester, Glass Filled | - | -40°C ~ 105°C | - | UL94 V-0 | Black |
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Samtec Inc. |
1MM SURFACE MOUNT STRIP
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paquet: - |
Stock7 956 |
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Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 21 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.065" (1.65mm) | - | - | 0.098" (2.50mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Preci-Dip |
CONN HDR 37POS 2.54MM T/H R/A
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paquet: - |
Stock8 334 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 37 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.276" (7.00mm) | 0.118" (3.00mm) | - | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Samtec Inc. |
SMT .050'' STRIPS
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paquet: - |
Stock4 986 |
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Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 20 | 19 | 2 | 0.100" (2.54mm) | Surface Mount | Solder | - | 0.100" (2.54mm) | - | - | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
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paquet: - |
Stock8 586 |
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Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | 0.075" (1.90mm) | - | - | 0.034" (0.86mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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TE Connectivity AMP Connectors |
CONN RCPT 14POS DL R/A TIN PCB
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paquet: - |
Stock3 418 |
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Tab | 0.138" (3.50mm) | Board to Cable/Wire | Shrouded - 4 Wall | 14 | All | 2 | 0.232" (5.90mm) | Through Hole, Right Angle | Solder | Locking Ramp | - | 0.157" (4.00mm) | - | 0.622" (15.80mm) | Rectangular | Tin | - | Tin | Brass | Polybutylene Terephthalate (PBT) | Mounting Flange | -30°C ~ 105°C | - | UL94 HB | Natural |
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TE Connectivity AMP Connectors |
CONN HEADER 20POS VERT .156 TIN
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paquet: - |
Stock6 444 |
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Male Pin | 0.156" (3.96mm) | Board to Cable/Wire | Unshrouded | 20 | 19 | 1 | - | Through Hole | Solder | - | 0.400" (10.16mm) | 0.125" (3.18mm) | 0.650" (16.51mm) | 0.125" (3.18mm) | Square | Tin | - | Tin | Copper Alloy | Thermoplastic, Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Natural |
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TE Connectivity AMP Connectors |
CONN HEADR BRKWAY .100 06POS R/A
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paquet: - |
Stock6 984 |
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Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 6 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.238" (6.05mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Thermoplastic | - | -65°C ~ 105°C | - | UL94 V-0 | Black |
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Preci-Dip |
CONN HDR 4POS 0.100 T/H
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paquet: - |
Stock8 748 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 4 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.141" (3.60mm) | 0.118" (3.00mm) | 0.385" (9.77mm) | 0.116" (2.95mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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Preci-Dip |
CONN HDR 5POS 2.54MM T/H
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paquet: - |
Stock3 474 |
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Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 5 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.587" (14.91mm) | 0.118" (3.00mm) | 0.805" (20.44mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
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TE Connectivity AMP Connectors |
CONN HEADER 20POS VERT .050 SMD
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paquet: - |
Stock4 032 |
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Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 20 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.226" (5.74mm) | Circular | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Pick and Place | -65°C ~ 105°C | - | UL94 V-0 | Black |