Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
---|---|---|---|---|---|---|
Maxim Integrated |
IC SMART BATTERY 500MAH 16-DIP
|
paquet: 16-DIP Module (0.300", 7.62mm) |
Stock3 472 |
|
||
Maxim Integrated |
IC SMART BATTERY 250MAH 16-DIP
|
paquet: 16-DIP Module (0.300", 7.62mm) |
Stock13 968 |
|
||
Maxim Integrated |
IC SMART BATTERY 3V 16-DIP
|
paquet: 16-DIP Module (0.300", 7.62mm) |
Stock3 856 |
|
||
Maxim Integrated |
PCM W/O CRYSTAL NV SRAM SNAP-ON
|
paquet: 34-PowerCap? Module |
Stock16 584 |
|
||
Maxim Integrated |
PCM W/CRYSTAL NV SRAM SNAP-ON
|
paquet: 34-PowerCap? Module |
Stock11 412 |
|
||
Maxim Integrated |
IC SRAM NV TIMEKEEPING POWERCAP
|
paquet: 34-PowerCap? Module |
Stock6 128 |
|
||
Maxim Integrated |
IC SRAM NV TIMEKEEPING POWERCAP
|
paquet: 34-PowerCap? Module |
Stock7 188 |
|
||
Maxim Integrated |
PCM W/CRYSTAL NV SRAM SNAP-ON
|
paquet: 34-PowerCap? Module |
Stock73 548 |
|
||
Maxim Integrated |
PCM W/O CRYSTAL NV SRAM SNAP-ON
|
paquet: 34-PowerCap? Module |
Stock17 628 |
|
||
Maxim Integrated |
IC GAMMA BUFFER 8CH 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 584 |
|
||
Maxim Integrated |
IC GAMMA BUFFER 8CH 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock5 152 |
|
||
Maxim Integrated |
IC I2C GAMMA/VCOM BUFF 48-TQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock4 976 |
|
||
Maxim Integrated |
IC I2C GAMMA/VCOM BUFF 48-TQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock7 104 |
|
||
Maxim Integrated |
IC I2C GAMMA/VCOM BUFF 48-TQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock3 024 |
|
||
Maxim Integrated |
IC GAMMA BUFFER 8CH 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 160 |
|
||
Maxim Integrated |
IC I2C GAMMA/VCOM BUFF 48-TQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock18 300 |
|
||
Maxim Integrated |
IC CIRCUIT SAMPLE-N-HOLD 8-UDFN
|
paquet: 8-WFDFN |
Stock6 768 |
|
||
Maxim Integrated |
IC CIRCUIT SAMPLE-N-HOLD 8-UDFN
|
paquet: 8-WFDFN |
Stock76 788 |
|
||
Maxim Integrated |
IC OPAMP AUDIO 14TDFN
|
paquet: 14-WFDFN Exposed Pad |
Stock2 800 |
|
||
Maxim Integrated |
IC AMP AUDIO MONO AB DIFF 14TDFN
|
paquet: 14-WFDFN Exposed Pad |
Stock8 004 |
|
||
Maxim Integrated |
IC VOICE MESSAGING PROC DIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock2 224 |
|
||
Maxim Integrated |
IC PROCESSOR ANSWER MACH 28-DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock6 128 |
|
||
Maxim Integrated |
IC PROCESSOR ANSWER MACH 28-DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 912 |
|
||
Maxim Integrated |
IC PROCESSOR VOICE MESS 28-DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 832 |
|
||
Maxim Integrated |
IC TDM/PACKET TRANSPORT 676BGA
|
paquet: 676-BGA |
Stock2 624 |
|
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock4 976 |
|
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock5 792 |
|
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock5 888 |
|